Industrial
Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
Visit our global sites to learn more: Amphenol Industrial Products Group and Amphenol Global Interconnect Systems
![Product Ball & Land Grid Array Socket System for 0.050 [1.27mm] Adapters](https://staph.blob.core.windows.net/images-products/Ball-And-Land-Grid-Array-Socket-System-for-0-050-[1-27mm]-Adapters-6768.png)
Ball & Land Grid Array Socket System for 0.050 [1.27mm] Adapters
BGA sockets; which are high density and have superior electrical performance: Thermal Performance: Operating Temperature Range: -55 to 140C; Glass Transition Temperature Range: 150 to 200C; Electrical Performance: Maximum Voltage: 75 VAC / 100 VDC; Maximum Current: 1 Amperes per contact Contact Resistance: Dry Circuit: .01ΩMax. @ .01 Amps/5VDC Insulation Resistance, @ 500VDC: 10,000 MOhms Min.
Ball & Land Grid Array Socket System for .8mm, 1mm, 1.27mm, and 2.54mm Adapters
BGA sockets; which are high density and have superior electrical performance: Thermal Performance: Operating Temperature Range: -55 to 140C; Glass Transition Temperature Range: 150 to 200C; Electrical Performance: Maximum Voltage: 75 VAC / 100 VDC; Maximum Current: 1 Amperes per contact Contact Resistance: Dry Circuit: .01ΩMax. @ .01 Amps/5VDC Insulation Resistance, @ 500VDC: 10,000 MOhms Min.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
Barrier Terminal Block
In structure, they comprise panel feed-through type, baffle type, and pluggable type, and can connect all kinds of conducting wires whose cross-sections are 0.32mm² to 53.5mm². The spacing between 7.62mm and 11mm can be selected. It can provide covered or uncovered styles. Product design in line with IEC60998, UL1059, CSA C22.2 No.158, and other international standards.
BergStak® 0.50mm Mezzanine Connector
The BergStak® product range is expanded to include 0.5mm mezzanine connectors. Available in 3mm to 6mm stack height options in 0.5mm increments, this connector is offered in 10 to 60 positions in 10 position increments. Designed with scoop-proof housing the terminals are protected from damage when parts are mated.
BergStak® 0.50mm Self-Alignment Board-to-Board Connector
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
BergStak® 0.80mm Pitch
FLEXIBLE SOLUTION FOR HIGH-DENSITY APPLICATIONS
FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
BergStak® 0.80mm Shielded Board-to-Board Connector
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
BergStak® Lite 0.80mm Board-to-Board Connector
Amphenol's BergStak® Lite 0.8mm is a comprehensive, versatile, and flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 4 sizes up to 100 positions. This is an economical version that uses Gold Flash plating that can meet up to 50 mating cycles while extending the mechanical advantage of the standard BergStak® 0.80mm.
BMB RF Interconnects
SV Microwave’s latest product line offers a comprehensive range of RF interconnects, including standard and bulkhead cable connectors for a variety of cable types and PCB connectors ideal for use in board-to-board solutions, with connectors in both Full Detent and Smooth Bore options, as well as a bullet. This product line is rated to work up to 22 GHz, ensuring reliable and high-performance RF solutions.