Industrial
Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
Visit our global sites to learn more: Amphenol Industrial Products Group and Amphenol Global Interconnect Systems
EMI Wind-Lok®
This series, is an EMI shielded, ruggedized harsh environment, metal reverse bayonet coupling, high power connector utilizing RADSOK® socket contact technology. With a single-pole 18mm RADSOK® contact and up to 800 amps possible with a standard operating temperature from -40°C to +125°C.
EMP
Motor Power connector provides a high voltage and heavy current connection in RMT application, It's an IP67 rectangular connector, and with high strength stainless steel screw/nut mechanism for application in harsh environments, compliant with EN50124 and NFF61. EMP series product has a wide range of current up to 500A and 3000V max high voltage.
ePower
This series, utilizing RADSOK® socket contact, HVIL contact, and EMI shielding technologies in a ruggedized harsh environment, metal rectangular, push/pull coupling, high power connector. With two or three contacts per connector and up to 700 amps possible with a standard operating temperature from -40°C to +125°C.
ePower-Lite
This series, utilizing RADSOK®socket contact, HVIL contact, and EMI shielding technology in a ruggedized harsh environment, thermoplastic rectangular, push/pull coupling, high power connector. With two, three, or four contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +125°C.
euMicron
2 and 4 Channel connector system with smaller diameter – designed for applications where size and space requirements are critical. Very high resistance to vibration, shock, environmental effects, dust, and debris. Compatible with Tyco Pro Beam Mini & Telecast MX connectors.
Eurolens
The hermaphroditic connector allows ideal flexibility in the field. The expanded beam offers an optimal optical transmission with minimal loss and the non-contact system enables thousands of mattings. The EUROLENS-Connector-System, available with 2, 4, 8, and 12 channels, is compatible will all MIL-DTL-83526/20 and bulkheads MIL-DTL-83526/21 connectors.
EX-309
Pin and Sleeve Certified Interlock and Plug for Hazard locations. Power options EX HAZLOC certified 16A, 32A, 63A, 125A for EX zone 1, 2, 21, 22 II 2 GD. Ex db eb IIC T* Gb. Ex tb IIIC T80°C Db IP66.
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX+® High Speed Backplane Connector System
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.
ExaMAX® 56Gb/s High-Speed Backplane Connector 85Ohm
The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.