Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
SV Microwave just launched our line of 3mm coaxial between board spacing PCB interconnects. This line allows for the lowest stacked height (3mm) of any board-to-board high frequency coaxial connection system. SV’s 3mm product line is ideal for high density stacked and high density multiport applications. Additionally, installation of this line can be accomplished with and without solder.
5G Flex Assemblies are dependable and flexible, outdoor rated, general-use coaxial cable assemblies fitting for many 5G applications. Utilizing Times Microwave’s cable heritage, these assemblies will withstand the test of time while providing reliable electrical performance.
5G Flex Assemblies are dependable and flexible, outdoor rated, general-use coaxial cable assemblies fitting for many 5G applications. Utilizing Times Microwave’s cable heritage, these assemblies will withstand the test of time while providing reliable electrical performance.
Amphenol 62IN series connectors are general-purpose, environmental resistant, miniature circular connectors with three-point bayonet coupling & five keyway polarization, design to meet the requirement of MIL-DTL- 26482 series 1 solder type, These connectors are widely used in military & Industrial application, available in a variety of sizes, styles & configuration.
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol ICC can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol ICC offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol ICC offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol ICC offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol ICC offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backward mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax VS® high-speed signal connectors from Amphenol ICC meet the dimensional and electrical requirements described in the Compact PCI® Serial (PICMG CPCI-s.0) Specification developed by the PCI Industrial Computer Manufacturers Group (PICMG). Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles.
AirMax VS® coplanar connectors permit mating two boards in the same plane. The AirMax family includes many coplanar configurations including 3-, 4- and 5-Pair per column connectors with column pitch of 2mm and 3mm. This family also includes 100 Ohms versions for the broad market as well as 85Ohms versions for other computer architectures. These connectors can accommodate 12.5Gb/s applications.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
This family of heat shrink tubing with options that are chemical and solvent resistant, irradiated or cross-linked materials, unlined, and adhesive lined. With 2:1 to 6:1 shrink ratios and a wide temperature range.
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
This series, is a rapid-mating, general duty, or ruggedized harsh environment, metal push/pull coupling, power, and signal connector. With over 20 insert arrangements ranging from 2 to 12 contacts per connector and up to 23 amps possible with a standard operating temperature from -40°C to +100°C.