Industrial
Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
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High Frequency Coaxial D38999 Contacts
SV Microwave offers DC to 40 GHz high frequency size 8, 12 and 16 coaxial contacts for the D38999 Series III housing and standard inserts. These contacts allow any application to continue to use the D38999 connector and be able to expand the use to include the microwave transmission lines.
High Performance RF Adapters
SV Microwave has released a line of high-performance adapters capable of excellent signal performance up to 65 GHz. These between-series adapters are configured with a reliable, easily-calibrated, and consistent threaded interface on one end and a convenient high-density push-on interface on the other, making them ideal for various applications.
High Performance RF PCB Thru-Hole Connectors
As part of our commitment to continuous quality improvement, SV has re-designed a line of thru-hole PCB connectors with current design standards to improve performance at higher frequencies. These connectors feature a contact that goes through the PCB and can launch directly to transmission lines on the opposite side. Current configurations include straight and right-angle SMP male connectors.
HPCE® Board to Board Connector
The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.
HPCE® Cable Assembly
The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact.
HPCE® High Power Card Edge Connector
The High Power Card Edge (HPCE®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
HPCE® Mezzanine Connector
The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
HS-Lok Push-Lock Connectors
Amphenol LTW's HS-Lok Push-Lock Connectors provide IP68 protection and are rated to UL-F1 UV resistance, making them ideal for indoor or outdoor wet locations. HS-Lok features audible feedback and guided key design, ensuring error-proof and easy assembly for blind mating.
The HS-Lok is UL2238 and UL50e compliant and rated up to 5A【Quick Guide: https://amphenolltw.com/down.php?supp_download=98】
HYPERBUSS™ Family
Amphenol Sine Systems’ HYPERBUSS™ Family of receptacle Connectors are IP68 and IP69K rated (in mated condition), high-performance, cost-effective solutions used in a variety of interconnect applications where a common “bussed” electrical pathway is required. They contain superior environmental seals and seal retention capabilities.
ICFP (IC Footprint Probe)
Amphenol's ICFP offers 50 Ohms access to IC contact pads and signal paths on an IC circuit footprint. This solution is simple to manipulate, cost-effective, and time-saving alternative to expensive X-Y tables and fragile planar probes for Engineers who may need to probe multiple signals at once.