Industrial
Amphenol is a technology leader in the design, manufacture and supply of high-performance interconnect systems, sensors and antennas for a broad range of industrial applications. Our core competencies include application-specific industrial interconnect solutions utilizing integrated assemblies. Our primary end applications for industrial include agriculture equipment, alternative and traditional energy generation, batteries and hybrid drive systems, entertainment, factory automation, heavy equipment, instrumentation, internet of things (IoT), LED lighting, marine, medical equipment, oil and gas, power distribution, public safety, rail mass transit, smart manufacturing (IIoT), and transportation.
Visit our global sites to learn more: Amphenol Industrial Products and Amphenol Global Interconnect Systems
HPCE® Board to Board Connector
The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.
HPCE® Cable Assembly
The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact.
HPCE® High Power Card Edge Connector
The High Power Card Edge (HPCE®) connector is a next-generation power card edge connector for demanding applications requiring high linear current density and low power loss. HPCE offers a low profile height (7.50mm) and is based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
HPCE® Mezzanine Connector
The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
HS-Lok Push-Lock Connectors
Amphenol LTW's HS-Lok Push-Lock Connectors provide IP68 protection and are rated to UL-F1 UV resistance, making them ideal for indoor or outdoor wet locations. HS-Lok features audible feedback and guided key design, ensuring error-proof and easy assembly for blind mating.
The HS-Lok is UL2238 and UL50e compliant and rated up to 5A【Quick Guide: https://amphenolltw.com/down.php?supp_download=98】
HU & PF - Pluggable Type Terminal Blocks
Pitch: 5.08mm
Poles: 2P-8P
Voltage Rating: 300V
Current Rating: 15A
Solid Wire: 12-26 AWG
Stranded Wire: 16-26 AWG
Withstanding Voltage: 1.6KV
HVSP
HVSP series is a high voltage small size plastic connector, it has rotation and polarization integration, can be used in energy storage. Rated current from 100A to 250A. It's a prime solution for limited space and cost. IP67, IP6K9K.
Hybrid Distribution Panel HypΣ
The Hybrid Distribution Panel enables the combination of copper and fiber optic cabling on just 1 height unit (U). The modular components and full accessibility from the front and rear make the system ideal for highly flexible data center and network infrastructures.
Hybrid Patchbox - 19"
The 19” Hybrid Patchbox is suitable for fixed installations with a one-piece front panel to accommodate up to 8 URM P8-connectors and 12 RJ45 Keystone-Modules. Alternative SC- or LC-connectors are applicable. Optimized packing density is provided by combining fiber optic and copper cables. Backside cable inlets for screwed cable glands 2 x M32 and 4 x M25 as well as M6 grounding bolt are included.
HYPERBUSS™ Family
Amphenol Sine Systems’ HYPERBUSS™ Family of receptacle Connectors are IP68 and IP69K rated (in mated condition), high-performance, cost-effective solutions used in a variety of interconnect applications where a common “bussed” electrical pathway is required. They contain superior environmental seals and seal retention capabilities.