IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
D-Sub Pin-in-Paste Connectors
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Power Board-Mount Connectors
Amphenol's D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10A to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts features colour code plastic clips for easy wire gauge identification.
D-Sub Press-Fit Connectors
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
D-Sub Slimline
ULTRA SLIM D-SUB CONNECTORS
Amphenol has expanded the D-Sub connectors with a modified ultra slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
D-Sub SMT Connectors
D-Sub connectors are now available with Surface Mount Termination (SMT) in standard form factors. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate SMT soldering. The products are UL recognized and lead-free.
D-Sub Standard Board Mount Connectors
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.
D-Sub Standard Density Connectors
STANDARD DENSITY D-SUBMINIATURE CONNECTORS
Current rating for stamped and formed signal pin is 3A and 7.5A for machined signal pin
Dip and PF board termination, and various cable termination such as IDC, wire wrap, solder cup, wire screwed and crimping
Tray standard packing and tube is per request
Contact resistance less than 20mOhm
High reliability machined and commercial stamped contacts are avail
D-Sub Standard Density Connectors - NFD17 Series
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
Dubox® 2.54mm
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.
Dubox® 2.54mm Crimp to Wire
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
DURASWAP™ Concentric Connectors
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current up to 100A with 10,000 mating cycles. They are IP67-rated in mated condition and can be mated in two directions (bi-directional mating).
DuraSwap™ Connectors
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current of 15A-70A with 10,000 mating cycles and IP67 rated in mated and unmated condition
ecomate® Aquarius™
Available in a variety of shell sizes and insert arrangements for Power, Mixed Power/Signal, Coax, and RJ45 layouts. Amphenol Sine Systems’ ecomate® Aquarius Waterproof Connectors provide an IP67/69K waterproof rating when in a mated condition for industrial applications and incorporates the latest technology in high impact thermoplastic design, offering many advantages.
EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF E1/E3 High-Speed Cable Assembly
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
Embedded Phase Tuner
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.
EMC Shields
Amphenol's EMC Shields are widely used in applications that require electromagnetic isolation of board-level components. They are provided in a wide variety of profiles and sizes to accommodate mother/daughter board configurations. Amphenol EMC Shields also commonly known as EMI shields and RFI shields, is a popular solution for minimizing crosstalk and susceptibility.
EMI Gasket Bulkhead Connectors and Adapters
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
Euro Style Terminal Blocks
EBY offers a complete selection of industry standard Euro Style Terminal Blocks - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
Suited for solid or stranded wire. Wire-to-board or wire-to-wire feed-through styles. No special tools required for installation. Easy field termination. Many screw and spring terminal wiring options.
EXAMAX2® 112Gb/s Backplane Cable
EXAMAX2® Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel. EXAMAX2® cable applications include internal OverPass™ cables, external I/O cables, cabled midplane and cabled backplane
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX+® High Speed Backplane Connector System
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® 56Gb/s High-Speed Backplane Connector
ExaMAX® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.
ExaMAX® 56Gb/s High-Speed Orthogonal Connector
The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Extremeport-Flash
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Extremeport-MCIO(Mini Cooledge IO)
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Extremeport-Swift
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ OSFP 112G Connectors
112GB/S PAM-4 WITH UP TO 800GB/S AGGREGATED BANDWIDTH
Amphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface.
The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP 224G Connectors
EXTREMEPORT™ OSFP 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8x224Gb/s electrical interface. The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP-XD 112G Connectors
EXTREMEPORT™ OSFP-XD 112G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP-XD 112G interconnect system is comprised of a 120-position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over a 16 x 112Gb/s electrical interface. The OSFP-XD footprint is optimized for signal integrity performance.
ExtremePort™ QSFP 112G
BACKWARDS PLUG COMPATIBLE AND SUPERIOR SIGNAL INTEGRITY
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels which increases port density, frees up board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP 112G connector supports next generation 400G appli
ExtremePort™ QSFP DD 112G Connectors
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
ExtremePort™ QSFP-DD 224G Connectors
EXTREMEPORT™ QSFP-DD 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ QSFP-DD 224G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8 x 224Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP modules which can be inserted into a QSFP-DD
ExtremePort™ QSFP+
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.
ExtremePort™ SFP112G
Amphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports up to 112Gb/s PAM4 aggregate bandwidth with a backward compatibility for next generation Ethernet and Fibre Channel applications. The ExtremePort™ SFP112G connector shares the same unique mating interface and EMI cage dimensions as the SFP+
ExtremePort™ SFP+
Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.
ExtremePort™ Swift Connectors
In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed ExtremePort™ Swift connector which is used in application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in current market to save space in end device.
ExtremePort™ Z-Link
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Extremeport-Z-Link(Gen Z)
Amphenol’s Extremeport Z-Link(Gen Z ) Connector is a scalable connector and connector interface compliant to SNIA: SFF-TA-1002. Z-Link can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. Z-Link can support high speed and power in one connector, and we developed 1C, 2C, 4C, and 4C+ connectors to support customers' different applications.
Extreme RF Cable Assemblies
Amphenol SV Microwave offers a complete line of fixed length, high-frequency Ø.047" and Ø.085" cable assemblies in series: SMA, 2.92mm, 2.4mm, 1.85mm, SMP, & SMPM. These assemblies feature low solder wicking, and the high flexibility allows for tight bends behind the cable ferrule. Our low loss is your gain!