With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
From a dedicated Base-8 architecture to a standard 12 or 24 fiber system, Amphenol Network Solutions' Advanced Optical Modules (AOMs) offer the complete solution. Our AOM portfolio is easily configurable and adaptable to create a solution that meets your network needs. Modules are deployed in the C2X or C2E chassis.
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.
The FDE enclosure has a low profile, side-by-side door design that provides an ideal environment for splicing and patching in indoor wall-mount applications. An integrated access door on the customer side of the enclosure provides a generous opening for a cleaning tool to reach the optical connectors, resulting in a more craft-friendly design.
The FSB series of indoor wall mount enclosures are designed for centralized splice-only applications. These boxes are well suited as optical cable splice collection points for DAS (Distribution Antenna Systems), MTU (Multi-Tenant Unit), commercial business applications, and MDU (Multi-Dwelling Unit) residential fiber network applications.