IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Amphe-PD™
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-PRB
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
APC 8010
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Barrier Terminal Blocks
EBY offers a complete selection of industry standard terminal blocks and barrier strips - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
For bare or terminated wires
Wire-to-board or wire-to-wire feed-through styles
No special tools required for installation
Easy field termination
Flexible design options - contact us!
Board-to-Board RF Connectors
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.
Ceramic Injection Molding
Amphenol's CIM process uses ceramic zirconium to provide a scratch and wear-resistant surface to components such as mobile phone camera decoration and side keys. The CIM material provides additional durability and strength to your products. We have applied our Metal Injection Molding (MIM) experience of large volume runs to CIM to create a hi-tech material process.
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
CFP4
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
Coaxial Fixed Attenuators
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.