IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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AgilLink™ 1.0mm Wire-to-Board
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several
AgilLink™ 1.20mm Wire-to-Board Header
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.25mm Wire-to-Board
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 1.50mm Wire-to-Board Header
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.00mm Wire-to-Board Header
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
AgilLink™ 2.50mm Wire-to-Board Header
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm Wire-to-Board
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm Wire-to-Board
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
AirMax VS® Coplanar High-Speed Backplane Connector
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】