With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
ULTRA SLIM D-SUB CONNECTORS
Amphenol has expanded the D-Sub connectors with a modified ultra slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.
STANDARD DENSITY D-SUBMINIATURE CONNECTORS
Current rating for stamped and formed signal pin is 3A and 7.5A for machined signal pin
Dip and PF board termination, and various cable termination such as IDC, wire wrap, solder cup, wire screwed and crimping
Tray standard packing and tube is per request
Contact resistance less than 20mOhm
High reliability machined and commercial stamped contacts are avail
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current up to 100A with 10,000 mating cycles. They are IP67-rated in mated condition and can be mated in two directions (bi-directional mating).
HIGHLY DURABLE SWAPPABLE DOCKING CONNECTOR
The swappable custom battery connector solutions with cable assemblies are offered in 2 power & 6 signal configurations. These connectors can carry a continuous current of 15A-70A with 10,000 mating cycles and IP67 rated in mated and unmated condition
EBY offers a complete selection of industry standard Euro Style Terminal Blocks - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
Suited for solid or stranded wire. Wire-to-board or wire-to-wire feed-through styles. No special tools required for installation. Easy field termination. Many screw and spring terminal wiring options.
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
112GB/S PAM-4 WITH UP TO 800GB/S AGGREGATED BANDWIDTH
Amphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface.
The OSFP footprint is optimized for signal integrity performance.