IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product Micro-TCA Card Edge Connectors
Micro-TCA Card Edge Connectors
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.

Product Micro USB 2.0
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.

Product Micro USB 3.1 GEN 1
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.

Product MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.

Product Millipacs® Accessories
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.

Product Millipacs® Cable Connectors
Millipacs® Cable Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® cable connectors in standard 5+2 row configuration, transversal mounting on pin array

Product Millipacs® Compact PCI
Millipacs® Compact PCI
FCI Basics Compact PCI Millipacs® 2mm hard metric (HM) connectors are designed in accordance with IEC 61076-4-101 and fulfill the interconnection requirement of the Compact PCI bus architecture. Millipacs® range currently supports 10Gb/s and 25Gb/s data rate with backward mating compatibility to the standard 2mm HM IEC 61076-4-101 connectors.

Product Millipacs® High Temperature Backplane Connectors
Millipacs® High Temperature Backplane Connectors
Amphenol's Millipacs® is a 2.00mm grid Interconnection system in a hard metric configuration designed in accordance with IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. Millipacs® high-temperature series addresses the market requirements for Backplane connectors compatible with higher operating temperature applications.

Product Millipacs® Mezzanine
Millipacs® Mezzanine
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.

Product Millipacs® Power & Hybrid Connectors
Millipacs® Power & Hybrid Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.

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