IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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TFOCA-II® Ruggedized Media Converter (ARCH Series)
Amphenol Fiber Systems International (AFSI) offers the ARCH Series TFOCA-II® Ruggedized Media Converter to provide optical-electrical (O-E) and electrical-optical (E-O) conversion for harsh environments. This stand-alone unit features ruggedized optical transceivers integrated into a compact housing with 10/100/1000 Ethernet electrical interfaces.
TPA Fuses
With ratings up to 50A, TPA fuses enable the management of high-density/high-capacity equipment such as routers, DSLAMs, and powered SONET equipment.
UHF Connector Series
Originally intended for use as a video connector in radar applications, UHF coaxial connectors are general purpose units developed for use in low frequency systems from 0.6 - 300 MHz.
Ultraport-LP SlimSAS
Amphenol LP SlimSAS is a high-speed cable solution with low mating height, and it's a qualified cable solution by UPI1.0. LP SlimSAS can support PCIe Gen5, and its footprint is compatible with standard SlimSAS. Amphenol developed 38pin, 74pin and 124pin LP SlimSAS with straight, right-angle, and side exit plug types to provide customers a flexible system layout.
Ultraport-SlimSAS
Amphenol's SlimSAS is a high-speed and robust cable assembly solution, and supports multiple industry applications such as PCIe, SAS, OpenCAPI, UPI1.0, OCP, NVME, and Ethernet. Amphenol has developed a scoop-proof connector solution with a pull tab. Amphenol develops a 38pin and 74pin solution and has been specified in the SFF group(SFF-8654).
UltraPort™ QSFP+
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
UltraPort™ SFP+
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
USB 3.1 GEN 1
SuperSpeed USB will deliver 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. With 5Gb/s signally rate, SuperSpeed USB 3.1 has a Sync-N-Go technology that minimizes user wait time. No device polling and lower active and idle power requirements are other significant features of these connectors. SuperSpeed USB is backward compatible with USB 2.0.
USB 3.1 GEN 1 Connector
FCI Basics USB 3.1 Gen 1 SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. Standard form-factor plug and receptacle performs up to 5Gbps and has "Sync-N-Go" technology that minimizes user wait-time. SuperSpeed USB is backward compatible with USB 2.0.
USB 3.1 GEN 2
COMPLIANT TO USB 3.1 SPECIFICATIONS; IDEAL FOR SERVER APPLICATIONS
Amphenol USB 3.1 Gen 2 Connector operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous bidirectional communication. It supports scalable power delivery up to 100W and performance speed up to 10Gb/s.