IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Cool Edge 0.80mm Hybrid Power & Signal Connectors
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
Crossbow™
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
Cryo-Seal Hermetic Connector Series
The Cryo-Seal Hermetic connector series is designed for extreme low-temperature environments. They are built to retain contact-to-contact sealing in temperatures as low as -319 °F (-195° C).
Temperatures falling below -85 °F (-65 °C) typically leaves one at risk of losing the pin-to-pin environmental seal and/or having cracked elastomeric components leading to electrical shorting.
cStack™
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
cStack™ Flex Cables
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.
Custom Flex Cables
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.
CXP
CXP connector comes in a one-piece Press-Fit assembly that provides one-step placement to the board to accommodate single, ganged, or stacked connector configurations in high-density requirements. CXP system has twelve channels for up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba & the InfiniBand CXP12x QDR standards.
CXP2 Active Optical Cable
HIGH DENSITY, EXCELLENT PERFORMANCE AND RELIABILITY
Amphenol's 300G CXP2 to CXP2 Active Optical Cable is a natural choice for optical cabling in data center/high-performance computing hardware applications, providing a cost-effective plug-and-play cabling solution. The CXP2 form factor delivers the highest hardware faceplate port density among existing SFF industry standards.
CXP Passive Copper Cable Assemblies 120G/168G/300G
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.