IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
Combo-D
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboStak® and PowerStak® Board-to-Board Connectors
ComboStak® and PowerStak® are compact, hybrid (signal and power), and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power-only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
Cool Edge 0.80mm Hybrid Power & Signal Connectors
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
Crossbow™
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
Cryo-Seal Hermetic Connector Series
The Cryo-Seal Hermetic connector series is designed for extreme low-temperature environments. They are built to retain contact-to-contact sealing in temperatures as low as -319 °F (-195° C).
Temperatures falling below -85 °F (-65 °C) typically leaves one at risk of losing the pin-to-pin environmental seal and/or having cracked elastomeric components leading to electrical shorting.
CSG/CSL/CSF Cable Glands
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
cStack™
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
cStack™ Flex Cables
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.
C-Type USB Connector
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Custom Flex Cables
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.
CXP
CXP connector comes in a one-piece Press-Fit assembly that provides one-step placement to the board to accommodate single, ganged, or stacked connector configurations in high-density requirements. CXP system has twelve channels for up to 20 Gbps, resulting in 240 Gbps of total bandwidth. This allows our CXP to go beyond the 100 Gigabit Ethernet IEEE 802.3ba & the InfiniBand CXP12x QDR standards.
CXP2 Active Optical Cable
HIGH DENSITY, EXCELLENT PERFORMANCE AND RELIABILITY
Amphenol's 300G CXP2 to CXP2 Active Optical Cable is a natural choice for optical cabling in data center/high-performance computing hardware applications, providing a cost-effective plug-and-play cabling solution. The CXP2 form factor delivers the highest hardware faceplate port density among existing SFF industry standards.
CXP Passive Copper Cable Assemblies 120G/168G/300G
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
DDR4 Memory Module Sockets
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
(Digital Visual Interface) DVI Connectors
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
DIN 41612 Accessories
ACCESSORIES FOR HARSH ENVIRONMENT CONNECTOR APPLICATIONS
SHROUDS
LATCHES AND THEIR FRAMES
DIN POLARIZING KEY
HOOD/COVER SET