With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】
Pin & Sleeve IEC 60309 UL listed. The Amphe-309 consists of both IP44 (splash-proof) and IP67 (Water Proof) devices from 16 A up to 125 A, from a simple plug to customer-specified combination units. The series range covers all clock positions in use for low profile, watertight, and Heavy Duty solutions. EC 603 09-1 & 2, EN 60 309-1 & 2, BS 4343-2 1992, and UL 1682 & 1686.
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-Phase is a High Current Single pin connector with a smart design to keep performance and safety as a top priority keeping the solution price competitive. Finger Proof Protection against electric shock (IP2X) on both sides of Source and Drain and have a bayonet mechanical locking system requiring a key to unlock for additional safety.
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
ASGTC-Quadrax is a special circular bayonet coupling connector for data line transmission in RMT application, It's IP67 protection and with a self-locking system specially designed in order to get heavy duty application, Q-contacts with the protection of copper body and multipoints band in female contact to provide to 360º shielding.
ATPC Type MV designed to meet UL Standard 1072 and comply with industry standards ICEA S-93-639, S-94-649 and AEIC CS-8. Available in single conductor and three conductors plus ground. Voltage options from 5kV up to 35kV. Copper or aluminum conductors, NL-EPR, TR-XLPE or XLPE insulation with 100%/133%/173% insulation levels, copper tape shield or concentric neutrals. Jacket PVC, XPLE, LLDPE
Amphenol LTW's waterproof USB connectors are IP67 / IP68 rated and designed with standard Type A/B interfaces in various product configurations -- plastic/metal, screw/bayonet locking, receptacle, receptacle with cables, overmolded cable, and field-installable demands for industrial applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact beams ensuring high current carrying capability and low contact resistance.
OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP200 connector provides a convenient method of distributing up to 200A directly to a 3.00mm mating busbar. The connector system features an integrated guide system that provides protection to the contacts during mating and un-mating.
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP300 connector is designed to mate directly with 3.00mm single pole busbars and provides a convenient method of distributing up to 300A between vertical and horizontal busbars. The connector features 16 independent points of conducting beams ensuring high reliability and ultra-low contact resistance.
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0
The C2E chassis provides a Data Center solution that is dense, modular and tray based. It is offered as either a dedicated Base-8 solution using the C2 Base-8 modules for MPO or MTP breakout modules, or a dedicated Base-12 version.
Fiber cable entry and exit gates have a front-facing door that opens to make it easier to get fibers in and out of the tray. The gates are several times larger than those in legacy slack storage trays, producing an industry-leading 96 1.6mm fiber cable capacity. The routing arcs within the tray have movable fingers, which greatly facilitates accessing the fibers during and after installation.
The C2X chassis' supports multiple patch, patch/splice, and pre-terminated fiber configurations available in either bulkhead or cassette solutions. C2X tray-based option accepts C2 AOMs (Advanced Optical Modules) for patch, patch/splice, as well as splitters, MPO breakouts, and WDMs. C2X is available in 1, 2, 3, or 4RU and supports vast fiber counts.
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections.
It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】
The Cascade Panel is a 1RU chassis with spaces for 4x custom patch plates at a total density of 96 LCs in a single rack unit. The Cascade Panel has a sliding tray that brings the adapters forward, allowing for easier
access when performing moves, adds, or changes. Its simple,
streamlined design provides a balance of density and usability
when connecting multiple LC or MPO connections.
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
HYBRID AND MEDIUM POWER SOLUTION
ComboStak® and PowerStak® are compact, hybrid (signal and power) and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
400POS 0.635MM PITCH COM-HPC
Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
COM-HPC is a PICMG sponsored open standard for a family of high performance computer modules targeting the embedded computer space. We have developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
CoolPower® HD Right-Angle Cable-to-Board Connector
Amphenol's CoolPower® HD Right-Angle Connector is a 90-degree, versatile pin-and-socket solution designed to deliver highdensity power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and ....
Amphenol's CoolPower® HD Vertical Connector Series is a versatile pin-and-socket solution that delivers high-density power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and offers exceptional ...
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
The Cryo-Seal Hermetic connector series is designed for extreme low-temperature environments. They are built to retain contact-to-contact sealing in temperatures as low as -319 °F (-195° C).
Temperatures falling below -85 °F (-65 °C) typically leaves one at risk of losing the pin-to-pin environmental seal and/or having cracked elastomeric components leading to electrical shorting.
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.