IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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C-Type USB Connector
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Custom Flex Cables
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.Amphenol flex cables are qualified in a wide range of commercial and military...
CXP Passive Copper Cable Assemblies 120G/168G/300G
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
DDR4 Memory Module Sockets
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
DensiLink® OverPass™ Assemblies
112G DOUBLE ENDED HIGH PERFORMANCE CABLING INTERCONNECT
DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems.
DensiMate™ 1.25mm Double Row
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges.
With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.
(Digital Visual Interface) DVI Connectors
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
DIN 41612 Accessories
ACCESSORIES FOR HARSH ENVIRONMENT CONNECTOR APPLICATIONS
SHROUDS
LATCHES AND THEIR FRAMES
DIN POLARIZING KEY
HOOD/COVER SET
DIN IDC Cable Connectors and Cable Assemblies
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21 and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system. This robust and standardized solution is widely used in Industrial and Instrumentation markets.
DisplayPort
HIGH-PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION
Amphenol DisplayPort connector system is a scalable solution that transmits 1, 2, or 4 lanes of High-Definition video at 2.7Gb/s per lane up to a maximum of 10.8Gb/s. DisplayPort also allows flexible allocation of available bandwidth between audio and video.
DisplayPort 2.1 Connector
DISPLAYPORT SUPER HIGH RESOLUTION VIDEO/AUDIO INTERCONNECT SOLUTION
Amphenol DisplayPort is a scalable system capable of delivering 1, 2, or 4 lanes of high-definition video at a maximum of 20Gb/s per lane. DisplayPort also supports 16K superior resolution with 80Gb/s bandwidth.
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In-Card...
DSFP 56G PAM4 SMT Connector
DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.
DSFP Cable Assemblies
Amphenol's DSFP cable assemblies are designed to support applications for Ethernet and Fibre Channel. The Amphenol DSFP products offer an ultra-high-performance, cost effective solution for 10G/25G/50G speed applications in switched fabric I/O, switches, routers, data storage arrays, and high-performance computer (HPC) clusters. The Small Form Factor Pluggable (SFP) interface supports a variety of commun...
D-Sub Accessories
Amphenol's D-Sub Accessories complement their D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories include plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, metal and plastic dust caps, and brackets .
D-Sub Accessories
In addition to a wide variety of D-Sub connectors, we offer a large assortment of Backshells, Locking Systems and Mounting Hardware. We also offer blind mate options, EMI covers, Sealing Options, and custom options to fit many different application requirements.
D-Sub Connectors
Amphenol LTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68. The features are connectors interface meet ANSI / B93.55M-1981, Idiot-proof alignment key design【Quick Guide: https://amphenolltw.com/down.php?supp_download=93】
Dsub Custom Specials
DSUB CONNECTORS FOR CUSTOM APPLICATIONS
Amphenol has proven capability to work with customers and develop special product extensions to meet their custom applications. This can be to meet special polarization requirements, fitment to their special panel cabinets, extra standoff to meet the height requirements, assemblies for cable application, etc.
D-Sub Dual Port Connectors
DUAL PORT D-SUBMINIATURE CONNECTORS
Contact thickness options of gold flash, 15µ", and 30µ"
Up to 500 mating cycles
Various pin counts to choose from
Stacked configuration
D-Sub High Density Connectors
HIGH DENSITY D-SUBMINIATURE CONNECTORS
Available in various sizes up to 78 positions
Endures temperatures up to 260°C
High density terminations include rear release crimp and solder cups for cable side, and Dip straight or R/A for board side
Tray packing available as standard and tube on request
D-Sub Hybrid Connectors
HYBRID D-SUBMINIATURE CONNECTORS
Mating interface according to MIL C24308
Current rating of 7.5A for signal and 40A max. for power
Endures temperatures up to 260°C
Contact resistance less than 5mOhms
Up to 18 configurations of Signal, Power, and Coax contacts
Machined signal contacts are fixed in the insulator
D-Sub MicroTCA Connectors
Amphenol's D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost. The connector's compact footprint allows for more space ...
D-Subminiature High Power Series
75A HIGH POWER CONTACTS WITH CRIMP, SOLDER BUCKET, AND PCB TERMINATIONS
Amphenol's D-Subminiature connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer, Industrial...
D-Sub Pin-in-Paste Connectors
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Press-Fit Connectors
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
D-Sub SMT Connectors
D-Sub connectors are now available with Surface Mount Termination (SMT) in standard form factors. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate SMT soldering. The products are UL recognized and lead-free.
D-Sub Standard Density Connectors - NFD17 Series
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
ecomate® Aquarius™
Available in a variety of shell sizes and insert arrangements for Power, Mixed Power/Signal, Coax, and RJ45 layouts. Amphenol Sine Systems’ ecomate® Aquarius Waterproof Connectors provide an IP67/69K waterproof rating when in a mated condition for industrial applications and incorporates the latest technology in high impact thermoplastic design, offering many advantages.
EconoStik™ 2.54mm
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
EDSFF E1/E3 High-Speed Cable Assembly
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS
Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.
eHPCE® Enhanced High Power Card Edge Connector
CLASSIC HPCE® WITH ENHANCED PERFORMANCE
eHPCE® connector offers a 15% increase in power density with the same footprint as classic HPCE®. The all-new power contact design offers lower contact resistance and higher current carrying capacity compared to classic HPCE® connectors. eHPCE® connectors are designed to extend the life of power supplies using card edge output power connectors.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
EMC Shields
Amphenol's EMC Shields are widely used in applications that require electromagnetic isolation of board-level components. They are provided in a wide variety of profiles and sizes to accommodate mother/daughter board configurations. Amphenol EMC Shields also commonly known as EMI shields and RFI shields, is a popular solution for minimizing crosstalk and susceptibility.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Extremeport-Flash
Amphenol’s Extremeport-Flash is an extreme low mating height, easy-to-release high-speed cable solution. We designed 95ohm Flash mainly to support near chip (under heat sink) to IO application, and the mating height is lower than 5mm. Flash can support 56G PAM4, and scalable to 112G PAM4 application, and plug is with pull tab design feature for easy release.
Extremeport-MCIO(Mini Cooledge IO)
Amphenol's Mini Cooledge IO(MCIO) is a high-speed, small mechanical size cable solution. Amphenol MCIO product is now being specified in the SFF group and the project number is SFF-TA-1016. MCIO cable can support PCIe Gen5, and is scalable to PCIe Gen6 and 112G PAM4. We developed 85ohm and 95ohm solutions to support different applications.
Extremeport-Swift
Amphenol’s Extremeport-Swift is an extreme low profile(mating height<9mm), robust mechanical, and excellent SI performance cable solution. The cable assembly and connector can support PCIe Gen5, and the SI performance is scalable to PCIe Gen6 and 112G PAM4. We can provide straight, right angle, and side exit plug types with 38pin, 74pin, and 124pin to support customers to optimize system layout.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ OSFP 112G Connectors
112GB/S PAM-4 WITH UP TO 800GB/S AGGREGATED BANDWIDTH
Amphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface.
The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP 224G Connectors
EXTREMEPORT™ OSFP 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8x224Gb/s electrical interface. The OSFP footprint is optimized for signal integrity performance.