With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol LTW's Magneto-Lok series offers a low-profile, self-aligning magnetic connection with 360°rotation and quick disconnect at any angle. Available in both receptacle and overmolded versions. With insulation resistance of 100 MΩ, voltage ratings up to 12Vdc / 24Vdc, and a vibration resistance 10 ~ 55 Hz, it ensures reliable performance for up to 10,000 mating cycles.
Amphenol's M-CRPS (+54V) Connectors and Cable Assemblies are designed to meet the Open Compute Project's M-CRPS power supply input specifications, providing robust performance and flexibility. Capable of delivering up to 40A per contact, these connectors support 8AWG - 12AWG wire sizes, enabling standardized DC-MHS rack and power architecture while maintaining design adaptability.
The MCX (Micro Coaxial) series is a 50 Ω series with broadband capability ranging from DC to 6 GHz. In addition, the MCX series features secure, fast and easy snap-on/ snap-off coupling.
The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.
1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights
FCI Basics Metral® product offers the broadest range of backplane connector solutions which includes RA and vertical for both header and receptacle series. The connectors are designed in accordance with IEC 61076-4-104 and Telcordia GR-1217- CORE. Metral® backplane connectors meet Futurebus+ standards to support applications in data, industrial and instrumentation, medical and telecom markets.
Metral® High Speed 1000 Series Backplane Connectors
Amphenol’s FCI Basics Metral® 1000 Series is a high-speed 2mm backplane connector system consisting of right-angle receptacles and vertical headers. The 1000 Series features a unique stripline structure in the receptacle and outer ground shields in the header. The stripline structure allows improved signal performance when routed in either a single-ended or a differential pair configuration.
Mezzostak® 0.50mm is a robust fine-pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The innovative hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.50mm mezzanine connectors are available in 120 positions with other position options provided on request.
micro-LinkOVER™ OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect by overpassing the PCB. These cables support 56G and 112G signaling in hardware system designs as well as a technology for future 224G signaling systems.
Micro Power 3.0 connector system is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 6.5A per pin and a wire gauge range from 30AWG-20AWG. It is available in 2 to 24 circuits for dual rows and 2 to12 circuits for a single row. Scoop-proof housings prevent mismating between header and receptacle.
Micro Power Plus 3.0 connector system, is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 12.5A per pin and wire gauge range from 30AWG-16AWG. It is available in 2 to 24 circuits for dual row and 2 to12 circuits for single rows.
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES
MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini Power Plus 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 13A per pin and a wire gauge range from 20AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.
The SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The lowprofile system provides 4X and 8X cable-plug options, and the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Amphenol's 12G / 24G Mini-SAS HD product is the next generation SAS storage interface addressing multichannel bandwidth requirements of 12Gb/s or 24Gb/s while meeting or exceeding SAS 3.0/4.0 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS HD 2.0 product (19.01mm port-to-port).
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
UPGRADED VERSION CAN SUPPORT SAS 3.0 ELECTRICAL PERFORMANCE SPEC (12GB/S DATA RATE)
Fully compliant with SFF-8087 specification provide interface for higher speed up to 6Gb/s data rate per channel (meet SAS 2.0 electrical performance spec). Upgraded version can support SAS 3.0 electrical performance spec (12Gb/s data rate).
Minitek127® board-to-board series are 1.27mm pitch connector, position ranges from 4 to 100 positions. Family comprehensive offer includes straight and right angle, surface mount and through mount, shrouded and unshrouded headers in different plating variations (gold flash / 0.25μm gold / 0.76μm gold).
Minitek127® 1.27mm Cable-to-Board Connector System
Minitek127® cable-to-board series are 1.27mm pitch insulation-displacement connector, position ranges from 6 to 100 positions. Family comprehensive offer includes straight and right angle, surface mount and through mount, eject and w/o eject headers in different plating variations (gold flash / 0.25µm gold / 0.76µm gold).
FCI Basics Minitek® 2.00mm Blind Mate Interface (BMI) is a flexible and comprehensive solution designed for application with a current rating of up to 2A per circuit. It allows misalignment and provides floating for easy blind-mate connections. BMI option is available in a dual row with 8 or 12 circuits. These connectors provide an ideal solution for panel-to-board applications.
Minitek® Pwr 3.0 BMI is a flexible and comprehensive solution designed for power application with current rating up to 8.5A per circuit. It is available in 4 to 24 circuits in dual row with Right angle and vertical options. Both WTB and WTW solutions are supported in this 3mm BMI product family.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 3.0 is a flexible and comprehensive solution designed for power application with current rating up to 5A per circuit. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row.
ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE
Minitek® Pwr 3.0 High Current Connector (HCC) is designed for power applications with a current rating of up to 12A per contact and a wire gauge range from 16AWG to 30AWG for Wire-to-wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual rows and 2 to 12 circuits for single rows.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 4.2mm is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.
Minitek® Pwr 5.7 is a flexible and comprehensive solution for power application with a high current rating of up to 23A per contact and wire gauge range from 16-12AWG for wire-to-board application. Minitek® Pwr 5.7 features polarized mating geometry, this helps to prevent mismating. It offers a wide operating temperature, ranging from -40°C to 105°C, making it suitable for a range of applications.
Amphenol introduces the Gen 5, Minitek® 12VHPWR connector system. This new introduction CEM 5.0 PCI Express® 12V-2x6 auxiliary power connector and cable assembly support the 600W GPU cards. The 12V-2x6 auxiliary power connector is not designed to mate with legacy PCI Express® 2x3 and 2x4 12V Auxiliary Power connectors.
Amphenol LTW Waterproof Mini & Micro-USB 2.0 SWIFT Connectors are IP67 / IP68 stand-alone connectors suitable for miniature connector requirements or wearable applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Amphenol FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking and Home Entertainment markets for various applications. The product features a simple, flexible and low profile design for LAN application, in particular, the Network Interface Card.
Rugged RJ Panel Mount connector IP67 Sealing. Ruggedized RJ connectors with die-cast housings and IP67 sealing for Harsh Environment applications, provide reliable performance in extreme conditions for the most demanding applications and mate with standard RJ plugs.
Amphenol LTW provides a comprehensive product range of M series, including M5, M8, Guided M8, M10.5, M12, 7/8", M20 and M23. We also have push pull version, MPronto-12, The Mpronto-12 M12 push pull connectors are the World’s First truly backward compatible to all female M12*1.0 sockets made by different manufacturers.
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56GB/S-112GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging well-established technologies, including an industry-leading Ball Grid Array (BGA) design, this connector offers a superior self-aligning and self-leveling solution. It incorporates a next-generation differential pair contact design, enabling exceptional performance of up to 56Gb/s NRZ and 112Gb/s PAM4.
Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
AFSI offers a high-performance, dual-channel hermaphroditic fiber optic connector, ideally suited for the energy, broadcast, and military markets. The mTACh connector is rugged yet compact. It is designed for use in tight spaces yet durable enough for applications requiring multiple mating cycles and harsh environments.
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.