IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
OLST Technology (Optimized Local Surface Treatment)
OLST Technology (Optimized Local Surface Treatment) combines the advantages of light metals – low weight, easy workability, etc. – with the advantages of copper, such as corrosion resistance, the property of being soldered, special features for electrical purposes.
Omni-Path Copper Cable Assemblies 100G
The Omni-Path verified DAC copper cables, are offered to address the needs of the majority of the inter-cabinet & short-reach intra-cabinet cable connections while minimizing cable bulk & cable routing issues, up to 4 meters using 30AWG cable. Longer-length cables up to 6 meters also maximize the length of copper. These longer cables use 26AWG high-performance bulk cable.
Optik-D
"The Optik-D™ fibre-optic connector solution is for designers who need to terminate optical cable in harsh or challenging environments. It is an ARINC 801 conforming fibre-optic connector designed to be used with the Positronic Combo D-Subminiature family. Optik-D is more cost-effective than D38999 or ARINC 600-based systems and is compatible with ARINC 801 products from other manufacturers.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Copper Cable Assemblies 200G/400G
200G / 400G SOLUTIONS
Amphenol's leading the industry in OSFP cable development. OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with both 25G/ lane channel NRZ and 50G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G and 400G per cable assembly.
OSFP Loopback 200G/400G
OSFP (Octal SFP) Loopback Modules are part of our OSFP I/O system product family that includes copper cables, connectors, and AOC's. These OSFP loopback cable assemblies are offered in four configurations - Passive Electrical, Passive Thermal, Active Electrical, Active Thermal. All loopback cable assemblies support 200G (8 lanes @ 25G NRZ) or 400G (8 lanes @ 50G PAM4) signaling transmission.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
PanelMate™ Family
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCIe® Gen 6 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
PCIe® Gen 7 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.
PCS
The PCS Series are versatile, high-current, mixed density connectors with low contact resistance. It remains an industry-leading power connector in the market. Options for one, two, or three contact rows provide flexibility in selection and high conductivity contacts are available to maximize current density. Other options - sequential mating, integrated locking latch, and press-fit contacts.
Perma-Tap® Power Cable Assembly
Perma-Tap® power cable assembly saves space and reduces cost. The wires can be cut, stripped, and terminated to customer-specific lengths. The connector is press-fit to a PCB to provide a compact and secure power delivery solution. A permanent connection between a cable and a PCB with only one connector.
Power Card Edge
The Power Card Edge connectors are a cost-effective system that can be used for DC power output from embedded AC/DC power supplies or for power distribution between boards within an enclosure. The narrow connector body helps maximize airflow for increased cooling and is well-suited for use in 1U rack-mount servers or on power distribution boards inside 1U redundant power supply assemblies.
Power USB Connector
FCI Basics Power USB Connector enables additional power delivery to 5V, 12V, or 24V peripheral devices connected using USB 2.0 cable links. When compared to a standard USB connector, this USB+Power connector interface includes four additional contacts each rated at 5A/contact, to supplement the connector's current-carrying capability. This eliminates the need for a separate power cable.
Precision Stamped components
Various build to print precision stamped components from thin gage to thick gage . Application for Infotainment system, connectivity,Shielding, Wirehardness, Safety & sensor, power train and interior.
Industries : Datacom, Medical, Industrial, Renewable Energy , Semicon and Consumer Electronic industry