IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product Paladin® 112Gb/s Backplane Connector
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY. Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.

Product Paladin® HD 224Gb/s Backplane Interconnect System
Paladin® HD 224Gb/s Backplane Interconnect System
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.

Product PanelMate™ Family
PanelMate™ Family
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.

Product PCI
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.

Product PCIe Over Optics- Linear Pluggable Optics (LPO)
PCIe Over Optics- Linear Pluggable Optics (LPO)
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4. Power dissipation < 5W

Product PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge Connectors
PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge Connectors
Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. This fine-pitch solution offers multiple BTB applications like right-angle, mezzanine, and coplanar connectors. Cable options are available for a complete interconnect solution.

Product PCIe® Gen 7 Mini Cool Edge IO Connector
PCIe® Gen 7 Mini Cool Edge IO Connector
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.

Product PCI Express® DirectAttached™ CEM Card Edge Connectors
PCI Express® DirectAttached™ CEM Card Edge Connectors
Amphenol's 1.0mm pitch DirectAttached™ CEM (DA CEM) is a hybrid card edge solution with high-speed signal pins designed to directly attach to the cable to eliminate PCB trace loss and press-fit termination type power pins for better rework. Amphenol has tooled Gen 5 DA CEM with configurations available for X8 and X16, at 32GT/s data rate to meet PCIe® Gen 5.

Product PCI Express® Flip CEM Card Edge Connectors
PCI Express® Flip CEM Card Edge Connectors
The PCIe® Gen 5 Flip CEM is a new 1.0mm pitch vertical card edge connector that follows PCIe® standard mating interface. It is designed with a different footprint because the contacts are “JJ” type or “LL” contacts which provide maximum savings of up to 19.5% in keepout area. The current Flip CEM supports 32GT/s (Gen 5) and the mating side supports backward compatibility with PCIe® 4/3/2/1 card.

Product PCI Express® Gen 5 DirectAttached™ Cable Riser
PCI Express® Gen 5 DirectAttached™ Cable Riser
Amphenol's PCIe® DirectAttached™ cable riser solution with PCIe® DirectAttaced™ CEM connector on one end of the cable allows the flexibility of a different connection on the other end of the cable, accommodating different PCB form factors such as MCIO, Multi-trak™, SlimSAS™, EDSFF, OCP NIC 3.0, Gen Z, or Backplane connectors.

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