With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol ICC's IP67 Waterproof D-Subminiature product line offers the terminations for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight and Right Angle for the board side and Solder Cup for the cable side. Each termination variant has both socket and plug connectors.
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. These DVI Connectors have a copper alloy, gold-plated contacts, and steel, nickel-plated shell.
EconoStik™ 2.54mm is an economical range of 2.54mm unshrouded header. It is available in single-row and double-row with vertical through-hole, right-angle through-hole, and vertical SMT terminations. EconoStik™ 2.54mm is a standard 0.64mm square header with high-temperature resin and 1μ" gold plating in contact and tail. It supports up to 50 mating cycles.
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
SV Microwave streamlines this with our innovative Embedded Phase Tuner. This component allows customers to independently adjust the phase of cable assemblies without external vendor involvement. The Embedded Phase Tuner operates by adjusting the transmission line length using a threaded coupling nut, simplifying the process.
SV Microwave has just released a series of SMA and 2.92mm cable connectors and adapters with built-in electromagnetic interference (EMI) shielding. These interconnects feature a gasket that improves EMI shielding over similar products, resulting in minimal to no electromagnetic interference.
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
EBY offers a complete selection of industry standard Euro Style Terminal Blocks - which may be customized to your needs - support a broad range of wire-to-board and wire-to-wire configurations.
Suited for solid or stranded wire. Wire-to-board or wire-to-wire feed-through styles. No special tools required for installation. Easy field termination. Many screw and spring terminal wiring options.
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.