IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
Millipacs® Cable Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® cable connectors in standard 5+2 row configuration, transversal mounting on pin array
Millipacs® Mezzanine
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
Millipacs® Power & Hybrid Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® R/A Headers
FCI Basics Millipacs® Hard Metric Right Angle header Modules are available in all popular versions - Type A, B, C, B19, B22, AB22, and AB25 with options for top row shielding, high-temperature grade,
Millipacs® R/A Receptacles
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
Millipacs® Vertical Headers
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® Vertical Receptacles
FCI Basics Millipacs® is a 2.00mm modular, Board-To-Board or Cable-To-Board Interconnection system in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with options for the outer row.
Mini Cool Edge 0.60mm Connectors
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Mini Cool Edge IO
Amphenol ICC introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Mini Power 4.2
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini Power Super
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.
Mini-SAS
The Mini-SAS external I/O connector consists of a die-cast metal cage and a Compact Multi-Lane SMT connector. It supports Fiber Channel & InfiniBand standards, making it the perfect solution to the ever-growing demand for high-speed mass storage systems, servers & storage area networks. Providing four serial send/receive channels/ports, this connector provides signal speeds of 6 Gbps/channel.
Mini-SAS Copper Cable Assemblies 3G/6G
Amphenol's external Mini-SAS cable assembly solutions address the current and legacy storage industry's demand for a reliable, compact, high-speed serial I/O supporting SAS 2.1. Mini-SAS solutions satisfy the applicable requirements of the INCITS T10 and SAS 2.1 specification and conform to the mechanical requirements described in the SFF-8086 and SFF-8088 documents.
Mini-SAS HD
Mini-SAS High-Density receptacle is the next-gen SAS system; the SAS 2.1 standard meets SAS-3 next-gen speed & density requirements that provide faster data transmission & more bandwidth for end users. The low-profile system provides 4X and 8X cable-plug options & the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Mini-SAS HD Copper Cable Assemblies 6G/12G/24G
Amphenol's Mini-SAS HD product is the present generation SAS storage interface addressing multi-channel bandwidth requirements of 6Gb/s, 12Gb/s, and 24Gb/s while meeting or exceeding SAS 2.1 SAS 3 and SAS 4 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS 2.1 product (19.01mm port-to-port).
Mini-SAS HD Internal
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
Minitek127® 1.27mm Board-to-Board
FCI Basics Minitek127® standard board-to-board connector is the improved 1.27mm pitch modular system. The halogen-free product includes the straight, right-angle, and surface mount, post option for surface mount, different plating variations, and position numbers up to 100.
Minitek127® 1.27mm Wire/Cable-to-Board Connector System
FCI Basics Minitek127® 1.27mm connector system is an extensive range of modular connectors for all types of wire/ cable-to-board applications. It includes straight and right angle, surface mount and through-hole, pin headers and board receptacles in different plating variations, customized stacking headers, IDC version, available in up to 100 positions.
Minitek® Pwr 5.7 Connector System
Minitek® Pwr 5.7 is a flexible and comprehensive solution for power application with a high current rating of up to 23A per contact and wire gauge range from 16-12AWG for wire-to-board application. Minitek® Pwr 5.7 features polarized mating geometry, this helps to prevent mismating. It offers a wide operating temperature, ranging from -40°C to 105°C, making it suitable for a range of applications.
Modular Jack - RJ45
FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking, and Home Entertainment markets for various applications. Modular Jacks Cat 3 supports the transmission of 16Mbps signals targeted to phone, modem, POS terminal machines and Cat 5 supports the transmission of 100Mbps signals targeted to switch, router, hub, etc.
M-Series™ 56
56GB/S HIGH-SPEED MEZZANINE BGA CONNECTOR SYSTEM
Leveraging proven technologies, including an industry-leading BGA design, offering superior self-aligning and self-leveling. With a next-generation differential pair contact design for up to 56Gb/s NRZ and 112Gb/s PAM4 performance.
MXM 3.0 Connectors
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
NanoRF VITA 67.3 Connector System
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev®
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
Non-Magnetic RF Connectors
Non-magnetic coaxial connectors are used to carry 50 ohm RF signals within the magnetic field of MRI equipment where a high signal-to-noise ratio (SNR) is required.
nrgBDFB-XLW 1000A Battery Distribution Fuse Bay
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type Connector Series
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
OCP ORv3
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.
OCTIS™ - Hybrid Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies on a hybrid interface promote bother signal and power transmission over Cat 5e cable in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - Optical Solutions
FCI Basics OCTIS offers a range of optical solutions meeting ever-increasing bandwidth requirements. SFP version is interoperable with all types of SFP/SFP+ ports and suitable for high data rate applications over long lengths. QSFP version offers enhanced bandwidth (4X SFP/SFP+).
OCTIS™ - Power Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies using Amphenol's PwrProfile® interface promote high power transmission in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - RJ45 Connectors and Cable Assemblies
FCI Basics OCTIS™ I/O connectors and cable assemblies using the RJ45 standard interface promote Ethernet-friendly signal transmission in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCTIS™ - Signal Connectors and Cable Assemblies (Metral® HDXS)
FCI Basics OCTIS™ I/O connectors and cable assemblies using Amphenol's Metral® HDXS interface promote signal and PoE++ transmission over Cat 5e and 6 cables in outdoor and harsh environments. It offers lightning protection, EMI shielding, and is field-installable. The transceiver is held outside the telecom box helping to save on board space and bettering the thermal distribution prospects.
OCuLink Connector
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
Omni-Path Copper Cable Assemblies 100G
The Omni-Path verified DAC copper cables, are offered to address the needs of the majority of the inter-cabinet & short-reach intra-cabinet cable connections while minimizing cable bulk & cable routing issues, up to 4 meters using 30AWG cable. Longer-length cables up to 6 meters also maximize the length of copper. These longer cables use 26AWG high-performance bulk cable.
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Copper Cable Assemblies 200G/400G
200G / 400G SOLUTIONS
Amphenol's leading the industry in OSFP cable development. OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with both 25G/ lane channel NRZ and 50G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G and 400G per cable assembly.
OSFP Loopback 200G/400G
OSFP (Octal SFP) Loopback Modules are part of our OSFP I/O system product family that includes copper cables, connectors, and AOC's. These OSFP loopback cable assemblies are offered in four configurations - Passive Electrical, Passive Thermal, Active Electrical, Active Thermal. All loopback cable assemblies support 200G (8 lanes @ 25G NRZ) or 400G (8 lanes @ 50G PAM4) signaling transmission.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
PC/104 Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 is a modular, ruggedized version of the PC 2.54mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PC/104 Plus Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 Plus is a modular, ruggedized version of the PC 2.00mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCS
The PCS Series are versatile, high-current, mixed density connectors with low contact resistance. It remains an industry-leading power connector in the market. Options for one, two, or three contact rows provide flexibility in selection and high conductivity contacts are available to maximize current density. Other options - sequential mating, integrated locking latch, and press-fit contacts.