IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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UltraPort™ SFP+
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
USB 2.0 Connector
FCI Basics USB 2.0 connector delivers a data rate of up to 480Mb/s. The Universal Serial Bus interface is ideal for use in connecting removable storage devices into automotive multimedia systems but extends its functionality across a variety of domains in consumer, datacom, and industrial applications.
USB 3.0 Connector
FCI Basics USB 3.0 connector delivers a data rate of up to 5Gb/s thanks to the SuperSpeed transfer mode. As a third major revision of the USB standard, it is backward compatible with USB 2.0 devices and cables. USB 3.0 is available in vertical through hole, right angle through-hole, and upright through-hole positions.
USB 3.1 GEN 2
COMPLIANT TO USB 3.1 SPECIFICATIONS; IDEAL FOR SERVER APPLICATIONS
Amphenol USB 3.1 Gen 2 Connector operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous bidirectional communication. It supports scalable power delivery up to 100W and performance speed up to 10Gb/s.
USB Type C
USB Type C connectors are expected to be widely used as a next-generation interface. They support a variety of protocols such as USB2.0/3.0/3.1 and meet Superspeed communication 10Gb/s, 5A, and 20V power supply. The usability of the USB 3.1 Type C connector is enhanced also by its low profile and reversible product design. It is ideal for emerging product designs.
VHDM-HSD™
VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.
VHDM®
Amphenol's VHDM® connector's modular format and breadth of components provide unmatched design flexibility. VHDM® can be combined with VHDM-HSD™ to incorporate both single-ended and differential signaling within the same connector. VHDM® derivatives provide an upgrade path to 25 Gb/s with backward mate compatibility to allow for scale as needed.
VITA/D38999 RF Cable Assemblies
SV’s newest fixed-length RF cable assemblies allow you to expand the use of the standard D38999 circular connector to incorporate microwave transmission lines. These assemblies are available in VITA 67.3 SMPM, SMPS, and NanoRF series and terminate into various D38999 BMB, SMPM, and SMPS interfaces and their respective size 8, 12, and 16 contacts.
WaveTrax Fiber Raceway
WaveTrax®, the Amphenol Network Solutions fiber raceway system, is designed to help engineers deliver reliable fiber optic network performance. Reduce your cost of ownership with the full line of WaveTrax products, including troughs, elbows, cross and T sections, off-ramps, and articulating links - easily installed so you are up and running quickly!
X2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
XCede I/O
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
XCede Plus Backplane Connector
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
XCede® Backplane Connector
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
XCede® Family Cable Assemblies
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
XCede® HD
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
XCede® HD2
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
XCede® HD Plus
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.
XCede® Power Connectors
XCede® connector platform is designed to provide headroom for high-speed, serial data rates demanded by data centers and service provider networks. The use of polymers in a resonance-damping shield enables low crosstalk across a wide frequency range. The XCede® backplane header system provides the ruggedness and long-term reliability required by today's systems.
XFP
XFP is a 30pos 0.8mm pitch SMT receptacle designed to support 10 Gigabit Fibre Channel and Gigabit Ethernet with the ability to extend performance to 14 Gbps. It is constructed from a metal frame and the cage assembly is to be bezel-mounted to an I/O panel with compliant pins for pressing onto the host PCB. Its single row cage configuration requires less space & is cost-optimized.
XFP 10G Transceivers
XFP 10G optical transceivers include SR, LR, ER, ZR and support Duplex, BiDi, CWDM, and DWDM solutions. They adopt an LC interface and are compatible with IEEE802.3ae, XFP MSA, and other standards. XFP 10G optical transceivers have the characteristics of low power consumption, small size, and high speed. They are most commonly used in Transmission, Storage Area Networks, and other environments.