With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Amphenol LTW's waterproof USB connectors are IP67 / IP68 rated and designed with standard Type A/B interfaces in various product configurations -- plastic/metal, screw/bayonet locking, receptacle, receptacle with cables, overmolded cable, and field-installable demands for industrial applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Automotive Grade PCI Express® Gen 5 Card Edge Connectors
EXTEND DIFFERENTIAL SIGNALING TO 32GT/S FOR NEXT-GENERATION SYSTEMS
PCIe® Gen 5 straddle mount connectors outperform the industry standards with higher speed along with complying to USCAR. The optimized series supports backwards mating and is footprint compatible with PCIe® 4/3/2/1.
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors
Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance.
BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact beams ensuring high current carrying capability and low contact resistance.
OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol's BergStak® 0.8 mm is a flexible solution designed for high-speed and high-density, parallel board-to-board connector systems with 16 PCB stack heights in 10 sizes up to 200 positions.
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
The BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections.
It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature.
The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB
Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.
SINGLE-PIECE COMPRESSION TYPE SURFACE MOUNT CONNECTORS
Amphenol Communications Solutions offers compression-type surface mount connectors to provide power and signal connection between either two PCB modules or one PCB and an electrical module. The single-piece small footprint solution brings cost and space savings to the design of smaller and more economical consumer electronic devices.
Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles and right angle headers are offered in 9-69 positions.
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 64 GT/s Gen 6 capabilities. Slim connector design saves space on the motherboard while facilitating other higherdensity applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
CoolPower® HD Right-Angle Cable-to-Board Connector
Amphenol's CoolPower® HD Right-Angle Connector is a 90-degree, versatile pin-and-socket solution designed to deliver highdensity power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and ....
Amphenol's CoolPower® HD Vertical Connector Series is a versatile pin-and-socket solution that delivers high-density power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and offers exceptional ...
CoolPower® Slim Drawer Mini (SDM) Connectors offer a high level of mating configuration flexibility, current density, and a thin profile making it ideal for compact board-to-board power interconnects. The CoolPower® SDM series is available with two or four power lines and boasts up to 318A per linear inch in a footprint of only 5.6mm x 14mm.
Amphenol's CoolPower® Slim Drawer Series is configurable to accommodate various combinations of power and signal contacts and a number of mounting and termination options. CoolPower® Slim Drawer can deliver up to 60A per pin and provides an ultra-low end-of-life contact resistance of just 0.4mΩ. Additional features include blind-mating, sequential mating, and true hotplug capabilities.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...