IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product cStack™ Flex Cables
cStack™ Flex Cables
Amphenol's cStack™ flexible circuit assemblies are designed for applications where flexibility, space, weight, and performance are critical. They are available in standard and custom flex circuit and connector designs. cStack™ Flex is a compression-based interconnect utilizing Amphenol's cStack™ interposer terminated to a multi-layer impedance-controlled flexible circuit in a compact footprint.

Product C-Type USB Connector
C-Type USB Connector
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】

Product Custom Flex Cables
Custom Flex Cables
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.Amphenol flex cables are qualified in a wide range of commercial and military...

Product CXP Passive Copper Cable Assemblies 120G/168G/300G
CXP Passive Copper Cable Assemblies 120G/168G/300G
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.

Product DDR2 SO-DIMM Memory Module Sockets
DDR2 SO-DIMM Memory Module Sockets
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.

Product DDR3 Memory Module Sockets
DDR3 Memory Module Sockets
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.

Product DDR4 Memory Module Sockets
DDR4 Memory Module Sockets
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.

Product DDR4 SO-DIMM Memory Module Sockets
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.

Product DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile Memory Module Sockets
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.

Product DDR5/LPDDR5 CAMM2 Connector
DDR5/LPDDR5 CAMM2 Connector
COMPLIES TO JEDEC SO-032 SPEC The DDR5/LPDDR5 CAMM2 connector follows JEDEC standards with 644 pins/666 pins, has a pitch of 1.00x1.38mm, and a connector height of 1.0mm. It provides dual channel memory which could support higher bandwidth and can catch up all DDR5 capacities needed. This connector is developed to support lower-power DDR5 memory and does not require ground shielding.

Product DDR5 Memory Module Sockets (SMT)
DDR5 Memory Module Sockets (SMT)
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023 The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.

Product DDR5 SOCAMM Connector
DDR5 SOCAMM Connector
LATEST MEMORY FORM FACTOR FOR AI SERVERS The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.

Product DDR5 SO-DIMM Connectors
DDR5 SO-DIMM Connectors
HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector are available in various height options.

Product DensiLink® OverPass™ Assemblies
DensiLink® OverPass™ Assemblies
112G DOUBLE ENDED HIGH PERFORMANCE CABLING INTERCONNECT DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems.

Product DensiMate™ 1.25mm Double Row
DensiMate™ 1.25mm Double Row
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges. With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.

Product DensiStak™ 1034 pin Open-Pin-Field Board-to-Board Connector
DensiStak™ 1034 pin Open-Pin-Field Board-to-Board Connector
HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields

Product (Digital Visual Interface) DVI Connectors
(Digital Visual Interface) DVI Connectors
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】

Product DIN 41612 Accessories
DIN 41612 Accessories
ACCESSORIES FOR HARSH ENVIRONMENT CONNECTOR APPLICATIONS SHROUDS LATCHES AND THEIR FRAMES DIN POLARIZING KEY HOOD/COVER SET

Product DIN 41612 Headers and Receptacles
DIN 41612 Headers and Receptacles
DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.

Product DIN IDC Cable Connectors and Cable Assemblies
DIN IDC Cable Connectors and Cable Assemblies
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21 and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system. This robust and standardized solution is widely used in Industrial and Instrumentation markets.

Product DIN Power
DIN Power
DIN 41612 CONNECTORS WITH MEDIUM AND HIGH POWER CONTACTS Amphenol has consolidated the DIN 41612 series manufacturing, adding the DIN Power range, thereby offering Power connectors along with the wide range of standard DIN connectors. The DIN Power connectors are preferred in applications that require particularly robust connectors or higher currents up to 15 A.

Product DisplayPort 2.1 Connector
DisplayPort 2.1 Connector
DISPLAYPORT SUPER HIGH RESOLUTION VIDEO/AUDIO INTERCONNECT SOLUTION Amphenol DisplayPort is a scalable system capable of delivering 1, 2, or 4 lanes of high-definition video at a maximum of 20Gb/s per lane. DisplayPort also supports 16K superior resolution with 80Gb/s bandwidth.

Product Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In-Card...

Product DSFP 56G PAM4 SMT Connector
DSFP 56G PAM4 SMT Connector
DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.

Product DSFP Cable Assemblies
DSFP Cable Assemblies
Amphenol's DSFP cable assemblies are designed to support applications for Ethernet and Fibre Channel. The Amphenol DSFP products offer an ultra-high-performance, cost effective solution for 10G/25G/50G speed applications in switched fabric I/O, switches, routers, data storage arrays, and high-performance computer (HPC) clusters. The Small Form Factor Pluggable (SFP) interface supports a variety of commun...

Product D-Sub Accessories
D-Sub Accessories
Amphenol's D-Sub Accessories complement their D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories include plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, metal and plastic dust caps, and brackets .

Product D-Sub Cable Connectors
D-Sub Cable Connectors
Amphenol's D-Subminiature (D-Sub) connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Sub connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in telecommunications, data, consumer, industrial, military, instrumentation and medical.

Product D-Sub Connectors
D-Sub Connectors
Amphenol LTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68. The features are connectors interface meet ANSI / B93.55M-1981, Idiot-proof alignment key design【Quick Guide: https://amphenolltw.com/down.php?supp_download=93】

Product D-Sub Dual Port Connectors
D-Sub Dual Port Connectors
DUAL PORT D-SUBMINIATURE CONNECTORS Contact thickness options of gold flash, 15µ", and 30µ" Up to 500 mating cycles Various pin counts to choose from Stacked configuration

Product D-Sub Economy Range Board-Mount Connectors
D-Sub Economy Range Board-Mount Connectors
Amphenol's D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have a guaranteed durability of 50 mating cycles. Board connectors are available in straight and right angle versions, while cable connectors are available in solder bucket and crimp styles.

Product D-Sub High Density Board-Mount Connectors
D-Sub High Density Board-Mount Connectors
Amphenol's D-Sub High Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.

Product D-Sub High Density Connectors
D-Sub High Density Connectors
HIGH DENSITY D-SUBMINIATURE CONNECTORS Available in various sizes up to 78 positions Endures temperatures up to 260°C High density terminations include rear release crimp and solder cups for cable side, and Dip straight or R/A for board side Tray packing available as standard and tube on request

Product D-Sub Hybrid Connectors
D-Sub Hybrid Connectors
HYBRID D-SUBMINIATURE CONNECTORS Mating interface according to MIL C24308 Current rating of 7.5A for signal and 40A max. for power Endures temperatures up to 260°C Contact resistance less than 5mOhms Up to 18 configurations of Signal, Power, and Coax contacts Machined signal contacts are fixed in the insulator

Product D-Sub MicroTCA Connectors
D-Sub MicroTCA Connectors
Amphenol's D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost. The connector's compact footprint allows for more space ...

Product D-Sub Pin-in-Paste Connectors
D-Sub Pin-in-Paste Connectors
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors. Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.

Product D-Sub Power Board-Mount Connectors
D-Sub Power Board-Mount Connectors
Amphenol's D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10A to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts features colour code plastic clips for easy wire gauge identification.

Product D-Sub Press-Fit Connectors
D-Sub Press-Fit Connectors
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.

Product D-Sub Slimline
D-Sub Slimline
ULTRA SLIM D-SUB CONNECTORS Amphenol has expanded the D-Sub connectors with a modified ultra slim body with contact alignment in a single row. These are available both in SMT termination suitable for reflow soldering and solder tail version for standard wave soldering. These connectors also feature solderable retention pegs that absorb vibration.

Product D-Sub Standard Board Mount Connectors
D-Sub Standard Board Mount Connectors
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.

Product D-Sub Standard Density Connectors - NFD17 Series
D-Sub Standard Density Connectors - NFD17 Series
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me

Product Dubox® 2.54mm
Dubox® 2.54mm
The Dubox®, connector family offers an extensive range of through-hole and surface-mount part options. It is available in single or double-row in both straight and right angle orientations from 2 to 50 positions, with a maximum current rating of 3A per individual contact. This cost-efficient solution offers high reliability in electrical performance.

Product Dubox® 2.54mm Crimp to Wire
Dubox® 2.54mm Crimp to Wire
The Dubox®, connector families offer an extensive range of through-hole and surface-mount part options, including single or double-row in either straight or right-angle orientation from 2 to 50 positions, with a current rating of 3A (maximum) per individual contact. The Dubox® contact has a pre-stressed, dual-beam design to enable low insertion force, 4-wall contact design for signal protection.

Product EDSFF Board Site Connector
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.

Product EDSFF E1/E3 High-Speed Cable Assembly
EDSFF E1/E3 High-Speed Cable Assembly
EDSFF ORTHOGONAL CABLE ASSEMBLY WITH DIFFERENTIAL SIGNALING TO 32GT/S NRZ FOR NEXT-GENERATION SYSTEMS Amphenol's EDSFF E1/E3 high-speed cable assembly transmits power and high-speed signals via a cable that directly connects to the main PC board supporting EDSFF E1/E3 SSD and CXL or other modules.

Product Elite®
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.

Product eQSFP
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.

Product EXAMAX2® 112Gb/s Backplane Cable
EXAMAX2® 112Gb/s Backplane Cable
EXAMAX2® Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel. EXAMAX2® cable applications include internal OverPass™ cables, external I/O cables, cabled midplane and cabled backplane

Product ExaMAX2® 112Gb/s High-Speed Backplane Connector
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.

Product ExaMAX+® High Speed Backplane Connector System
ExaMAX+® High Speed Backplane Connector System
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.

Product ExaMAX® 56Gb/s Backplane Cable
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.

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