With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
eSATA connectors are designed for external storage applications that require a single-lane Serial ATA cable connection up to approximately two metres in length. The connectors comply with the Serial ATA Specification issued by the Serial ATA International Organization (SATA-IO). eSATA connectors support both Gen 1 (1.5Gb/s) and Gen 2 (3Gb/s) SATA data rates.
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
The ExaMAX+® backplane connector system is designed to meet 56Gb/s PAM4 industry specifications with plenty of SI margin while maintaining mating interface compatibility with previous ExaMAX® products. The optimized connector design delivers superior signal integrity performance resulting in lower crosstalk noise and higher insertion loss-to-crosstalk ratio.
ExaMAX® 56Gb/s High Speed Backplane Cable Assembly
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
The ExaMAX® 85Ohms backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. Optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion loss. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.
ExaMAX® backplane connector system is designed for higher bandwidth applications from 25Gb/s to 56Gb/s. The optimized connector design delivers superior signal integrity performance resulting in low crosstalk noise and low insertion. Each signal wafer incorporates an innovative one-piece, embossed ground structure to improve crosstalk performance through 56Gb/s.
The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed Mezzanine Connector System
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.
Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.
Amphenol has developed the ExtremePort™ Swift connector which is used in the application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in the current market to save space in the end device.
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.
CTW (Card-to-Wire) fan module connector comes with a flexible design for card-to-wire power applications used in fan modules. It allows different wire gauges ranging from 28AWG - 22AWG. The connector provides a maximum current rating of 4A/pin.
FFC/FPC Connectors with Autolock Mechanism - F308/F332 Series (0.50mm pitch)
F308/F332 series is a 0.50mm pitch right angle Non-ZIF flex connector with an auto-lock mechanism and surface mount termination. It features a height of 2.45mm and comes in 6 to 68 contacts. This series features a cable thickness of 0.33mm and provides the durability of 20 mating cycles. Its robust connector design makes it suitable for robotic operations, supporting Industry 4.0.
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.
The FDE enclosure has a low profile, side-by-side door design that provides an ideal environment for splicing and patching in indoor wall-mount applications. An integrated access door on the customer side of the enclosure provides a generous opening for a cleaning tool to reach the optical connectors, resulting in a more craft-friendly design.
Amphenol LTW's offers a variety of Fiber Optics adapters that allow terminating fiber optics cables to be coupled together. Available in LC & SC type for your outdoor application for your high-speed transmission requirement.
Fanout cables are used for fixed cabling between network cabinets, mainly for breakout applications. System-oriented connector combinations make them application-independent and suitable for all Ethernet and Fibre Channel applications. Usually, 8-fold, 12-fold and 24-fold fanout cable assembled with MPO connectors one side and any common connector type on the other side could be provided.
Fiber Optic Splice Module Twin with Angled Cable Strain Relief
The splice module is designed to fit the 3U subrack and is used to integrate unassembled cables into the network. Equipped with pre-assembled pigtails and a splice cassette it offers an uncomplicated possibility for cable installation. With the angled cable support the fibers are guided perfectly without risk of breaking.
The subrack is suitable for accommodating up to 12x7TE or 16x5TE modules. Due to the modular design, the system is well scalable, and mixed configurations, as well as extensions, can be easily realized. Rear-mountable trunk head holders provide space for the safe and quick installation of incoming cables.
The FSB series of indoor wall mount enclosures are designed for centralized splice-only applications. These boxes are well suited as optical cable splice collection points for DAS (Distribution Antenna Systems), MTU (Multi-Tenant Unit), commercial business applications, and MDU (Multi-Dwelling Unit) residential fiber network applications.
FCI Basics Filtered D-Sub Connectors safeguard the function of electrical devices and systems in critical applications by offering EMC protection and by maintaining signal integrity. The connector additionally incorporates a filter element mounted between each contact and the ground shell of the standard D-Sub without having to alter footprint dimensions.
HIGH-SPEED FINE PITCH FLOATING BOARD-TO-BOARD CONNECTORS
This fine pitch 0.40mm 4mm stacked height 80pos floating board-to-board connectors are suitable for a wide range of high-reliability applications and demanding environments.
Amphenol RF offers a full line of pre-assembled, fixed-length cable assemblies. Fixed length assemblies are offered in all of our most popular connector series and are available in over 1400 standard configurations and lengths.
FlexTrax combines the flexibility of split tubes with greater ease of access than slotted duct, significantly reducing the potential to pinch or bend a fiber compared to current vertical cable management methods. Users can purchase FlexTrax as needed for the application based on the estimated length required. Installation is simple and dynamic, allowing users to customize their solutions.
Floating Board-to-Board Connectors - B406/B407/B410 Series (0.80mm pitch)
Amphenol's B406/B407/B410 series is 0.80mm pitch floating board-to-board connectors that support stack height up to 23mm and positions from 30 to 120. Its unique connector design has a floating range of ±0.50mm in the X, Y, and Z directions which makes it resistant to vibration. It also supports speed performance up to 2.5Gb/s to meet high transmission requirements.
FLTStack 0.50mm is a floating type Board-to-Board (BTB) connector designed to operate a minimum of ±0.50mm floating range in the XY directions. It features a self-cleaning function, vibration resistance, and self-alignment for easier mating. In addition, it supports up to 3Gb/s communication data rates. It features a fine pitch design at 0.5mm and supports a current rating of up to 0.5A/pin.
Amphenol's GbX connector platform is a differential connector that provides flexible and low-cost design solutions for lower-speed applications while providing backward mate compatible upgrades to allow for up to 14 Gbps.
The GG is a unique connector series for two reasons. First, it boasts the ability to carry the most power in a single package. Second, it is a modular connector with a fixed envelope. GG connector is an extreme power connector capable of up to 200 amps per contact.
Ideal for power distribution to LEDs on connectivity panels, lower amperage network elements, and other traditional equipment, GMT fuses provide fast-acting DC power circuit protection up to 20A.
The HCI® High Power backplane/midplane connector series addresses applications demanding additional power at the interface between a daughter card and a backplane or midplane in chassis-based equipment platforms. HCI High Power modules are rated for up to 113A per contact without exceeding a 30°C temperature rise in still air.
The HCSO-1W sensor simplifies current measurement (AC/DC) for batteries, chargers & motors. It clamps directly on cables, reducing installation steps & errors. Based on Hall effect tech, it offers accurate readings & various current ranges. Easy to install & calibrate, making it cost-effective for manufacturers.
The HPCE® BTB is a board-to-board high power connector for demanding applications requiring high linear current density and small connector size. It is part of Amphenol's HPCE® series family together with HPCE and HPCE cable assembly. HPCE® BTB is ideal for next-generation 1U/2U servers, storage enclosures, telecommunications equipment, and datacom/ networking equipment.
The HPCE® cable assembly is a next-generation power cable assembly for demanding applications requiring high linear current density and low power loss. It offers both one-piece (cable to card edge) and two-piece (cable to header) solutions. Both have a low profile height (7.5mm) and are based on very cost-effective and highly reliable stamped-and-formed power contact.
The HPCE® Mezzanine is a next-generation power board-to-board for demanding applications requiring variable stack heights and high linear current density. It offers both receptacle and recommended PCB Bridge. Both are based on very cost-effective and highly reliable stamped-and-formed power contact technology similar to other power solutions from Amphenol.
The 19” Hybrid Patchbox is suitable for fixed installations with a one-piece front panel to accommodate up to 8 URM P8-connectors and 12 RJ45 Keystone-Modules. Alternative SC- or LC-connectors are applicable. Optimized packing density is provided by combining fiber optic and copper cables. Backside cable inlets for screwed cable glands 2 x M32 and 4 x M25 as well as M6 grounding bolt are included.
The Amphenol Network Solutions HyperX is a high-density interconnect or cross-connect ODF with up to 3,456 terminations. HyperX is a modular solution with an open architecture allowing you to scale your network as needed when incorporating Amphenol Network Solutions C2 Advanced Optical Modules (AOMs) within C2E or C2X chassis.
RUGGED INDUSTRIAL/MILITARY RJ45 (ETHERNET) CONNECTORS
Amphenol's line of Rugged Bulkhead Adaptors serves many markets and applications across the globe including Transportation, Military, Medical, and Industrial.
Amphenol offers a vast array of indoor connectors and adapters that are produced with high-quality material and meet EIA/TIA and IEC standards and RoHS compliant. Available in a wide variety of footprints, fiber capacity, fiber types, and colors.
The InfinX® high-speed mezzanine connector solution is designed to meet the needs of 25+Gb/s applications. Available in 4- and 6-Pair configurations, InfinX is your best choice for high-speed board-to-board applications. InfinX supports from 10mm to 42mm stack heights and provides unparalleled reliability and signal integrity with its patented Resonance Dampening Technology.
The product family includes optical muxes for DWDM and CWDM applications, co-existence modules, splitters, and optical TAPs for network monitoring. These optical circuits can be packaged in different forms, such as LGX style cassettes and C2 AOMs, to provide customers with maximum flexibility on the installation platform and component density required to service a wide range of applications.
Amphenol's IPS series is an integrated cable solution for high-speed card edge connectors like PCIe®. Compared to the traditional card-to-board application, this will extend the connection from simplified card-to-card to multiple gender options for connector-to-connector, connector-to-card, or card-to-card configurations.
Designed for high-density fiber connectivity and splicing for indoor wall mount applications. This compact plastic demarcation fiber enclosure is lightweight for easier handling. It can accommodate SC and LC style adapters and mass fusion splice sleeve holders.