With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
The SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The lowprofile system provides 4X and 8X cable-plug options, and the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Amphenol's Mini-SAS HD Active Optical Cable is fully compliant with SAS 2.1 and SAS 3.0 industry standards as well as the SFF-8636 interface standard. Used primarily for external Enterprise storage applications, this cable is part of Amphenol's comprehensive Mini-SAS HD product offerings that address all board connector and cabling applications, from 1 to 100 meters.
Amphenol's 12G / 24G Mini-SAS HD product is the next generation SAS storage interface addressing multichannel bandwidth requirements of 12Gb/s or 24Gb/s while meeting or exceeding SAS 3.0/4.0 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS HD 2.0 product (19.01mm port-to-port).
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
UPGRADED VERSION CAN SUPPORT SAS 3.0 ELECTRICAL PERFORMANCE SPEC (12GB/S DATA RATE)
Fully compliant with SFF-8087 specification provide interface for higher speed up to 6Gb/s data rate per channel (meet SAS 2.0 electrical performance spec). Upgraded version can support SAS 3.0 electrical performance spec (12Gb/s data rate).
Minitek127® 1.27mm Cable-to-Board Connector System
Minitek127® cable-to-board series are 1.27mm pitch insulation-displacement connector, position ranges from 6 to 100 positions. Family comprehensive offer includes straight and right angle, surface mount and through mount, eject and w/o eject headers in different plating variations (gold flash / 0.25µm gold / 0.76µm gold).
Designed for the finest pitch wire-to-board applications, FCI Basics Minitek® 0.80mm is the ideal solution for devices that require compact and low-profile connectors. With wire gauge range from 32AWG-28AWG, these connectors are available in a single row vertical SMT and right angle SMT configurations. These connectors come with locking features to provide enhanced contact reliability.
Minitek® is Amphenol ICC's brand for BTB and wire/cable to board connectors in 2.00mm pitch. It is a fully modular system enabling all types of connections between PCBs, wires, and flat cables. Its 2mm spacing allows up to 38% space saving compared to traditional modular systems. It is available in vertical and horizontal configurations both in single and double row with 2 to 25 positions per row.
Minitek® Board-In connector system is a flexible solution designed for economical and permanent wire-to-board applications up to 3A. It is a one-piece direct solder-to-board solution that provides space and cost savings compared to a two-piece connector system. It is currently offered in 2-16 positions under 2.00mm and 2.50mm pitch sizes covering vertical and horizontal configurations.
FCI Basics Minitek® MicroSpeed connector family with 1.00mm pitch supports high-speed data applications with up to 25Gb/s. These connectors feature a shielded design that provides superior EMC performance and significantly improved electromagnetic compatibility. The poka-yoke polarization prevents visual mismating, which makes it ideal for use in industrial environments.
Minitek® Pwr 3.0 BMI is a flexible and comprehensive solution designed for power application with current rating up to 8.5A per circuit. It is available in 4 to 24 circuits in dual row with Right angle and vertical options. Both WTB and WTW solutions are supported in this 3mm BMI product family.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 3.0 is a flexible and comprehensive solution designed for power application with current rating up to 5A per circuit. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row.
ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE
Minitek® Pwr 3.0 High Current Connector (HCC) is designed for power applications with a current rating of up to 12A per contact and a wire gauge range from 16AWG to 30AWG for Wire-to-wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual rows and 2 to 12 circuits for single rows.
ROBUST AND VERSATILE SELFALIGNING CONNECTOR
Minitek® Pwr 4.2 BMI is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 24 circuits for dual row.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 4.2mm is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.
ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE
Minitek® Pwr 4.2 High Current Connector (HCC) is designed for power applications with current rating up to 13A per contact and wire gauge range from 30AWG-16AWG for wire-to-wire and wire-to-board applications. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.
Amphenol introduces the Gen 5, Minitek® 12VHPWR connector system. This new introduction CEM 5.0 PCI Express® 12V-2x6 auxiliary power connector and cable assembly support the 600W GPU cards. The 12V-2x6 auxiliary power connector is not designed to mate with legacy PCI Express® 2x3 and 2x4 12V Auxiliary Power connectors.
Amphenol introduces the new PICPWR OCP® connector system. This new introduction PICPWR 2x6+12SB or 2x3+6SB auxiliary power connector and cable assembly supports the 864W (2x6) / 486W (2x3) power distribution within the HPM and to/from peripheral subsystems to HPM or peripheral subsystems.
Amphenol Mini USB Type B design offers customized design. Mini USB 2.0 connector takes up only about 1/8 of the space of standard USB-B, five circuits, with one circuit reserved for future use in host identification between devices. These portable devices are used for consumer applications and charging. These are available in both SMT and through-hole receptacles available.
Amphenol LTW Waterproof Mini & Micro-USB 2.0 SWIFT Connectors are IP67 / IP68 stand-alone connectors suitable for miniature connector requirements or wearable applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
RJE1Y cable assemblies are offered in a variety of colors, lengths, and boot styles with speeds up to 25 Gigabit Ethernet. The RJ45 plugs have injection-molded kinks to protect the cable and wire. There are three main strain relief styles: non-booted, bubble boot, and latch boot. The boot offers protection to the locking tab on the RJ45 plug which prevents it from being damaged.
Amphenol FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking and Home Entertainment markets for various applications. The product features a simple, flexible and low profile design for LAN application, in particular, the Network Interface Card.
Amphenol LTW provides a comprehensive product range of M series, including M5, M8, Guided M8, M10.5, M12, 7/8", M20 and M23. We also have push pull version, MPronto-12, The Mpronto-12 M12 push pull connectors are the World’s First truly backward compatible to all female M12*1.0 sockets made by different manufacturers.
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Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry standard sockets. This helps to upgrade the graphics processor in a device, without changing the whole system or relying on proprietary vendor upgrades.
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
OCP 48V COMPATIBLE POWER CABLE ASSEMBLY FOR OPEN COMPUTE IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant Barklip® BK150 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and provide a convenient method of distributing up to 150A per contact between busbars, cables, and circuit boards.
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 220A per contact between busbars, cables, and circuit boards.
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards.
Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. The connector system features two individual power circuits and two newly added secondary chassis grounding contacts.
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
The RJE7H series of 1x1 Tab Down CAT5e jack connectors is one of the top-selling OneG series connectors from Amphenol. With a low profile, no-shield, and no-LED the connector aims to extend the application capability to suit a wide range of Communications, Storage, Consumer, Home, Industrial, and Medical markets.
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
mphenol is leading the industry in OSFP cable development. Our Electronics Products ʻProduct of the Yearʼ award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 224G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, 800G, and 1.6T per cable assembly.
DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
OSFP OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external OSFP IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W
PCIe® Gen 6 Mini Cool Edge 0.60mm Card Edge Connectors
Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. This fine-pitch solution offers multiple BTB applications like right-angle, mezzanine, and coplanar connectors. Cable options are available for a complete interconnect solution.