With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional pcb routing methods.
Mini Power 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 9A per pin and wire gauge range from 28AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini Power Plus 4.2 connector system is a 4.20mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 13A per pin and a wire gauge range from 20AWG-16AWG. It is available in 2 to 24 circuits for dual row. The boardlock option ensures a strong retention force.
Mini power super series is a 4.20mm pitch power connector designed for flexible wire-to-board applications based on different wire gauges and circuits. It provides a maximum current rating of 20A/pin and accommodates a wire gauge of 16AWG and 14AWG. It is foolproof against mismating among different circuits. This series is available in 2 to 24 circuits for dual row.
Amphenol's external Mini-SAS cable assembly solutions address the current and legacy storage industry's demand for a reliable, compact, high-speed serial I/O supporting SAS 2.1. The Mini-SAS I/O system provides a cost-effective, high-speed solution that meets the bandwidth requirements of current and legacy applications of servers and external storage systems.
Amphenol's external mini-SAS / SATA connector, cage, and cable assembly system solution addresses the storage industry's demand for more compact, high-speed serial I/O interfaces that also support evolving signal speed requirements.
The SAS 2.1 standard meets SAS-3 next generation speed and density requirements that provides faster data transmission and more bandwidth for end users. The lowprofile system provides 4X and 8X cable-plug options, and the external I/O connectors include eight sideband signals per 4X port, 1x4 configuration for up to 192Gb/s of total bandwidth.
Amphenol's Mini-SAS HD Active Optical Cable is fully compliant with SAS 2.1 and SAS 3.0 industry standards as well as the SFF-8636 interface standard. Used primarily for external Enterprise storage applications, this cable is part of Amphenol's comprehensive Mini-SAS HD product offerings that address all board connector and cabling applications, from 1 to 100 meters.
Amphenol's 12G / 24G Mini-SAS HD product is the next generation SAS storage interface addressing multichannel bandwidth requirements of 12Gb/s or 24Gb/s while meeting or exceeding SAS 3.0/4.0 specifications. The Mini-SAS HD product provides greater port density (11mm port-to-port) versus the legacy Mini-SAS HD 2.0 product (19.01mm port-to-port).
NEXT-GENERATION SAS STORAGE INTERFACE
Amphenol Mini-SAS High-Density connector system is the next-generation SAS system that provides faster data rates and more bandwidth. It provides double the port density of current Mini-SAS connectors with 1x1, 1x2, and 1x4 port options.
UPGRADED VERSION CAN SUPPORT SAS 3.0 ELECTRICAL PERFORMANCE SPEC (12GB/S DATA RATE)
Fully compliant with SFF-8087 specification provide interface for higher speed up to 6Gb/s data rate per channel (meet SAS 2.0 electrical performance spec). Upgraded version can support SAS 3.0 electrical performance spec (12Gb/s data rate).
Minitek127® 1.27mm Cable-to-Board Connector System
Minitek127® cable-to-board series are 1.27mm pitch insulation-displacement connector, position ranges from 6 to 100 positions. Family comprehensive offer includes straight and right angle, surface mount and through mount, eject and w/o eject headers in different plating variations (gold flash / 0.25µm gold / 0.76µm gold).
Designed for the finest pitch wire-to-board applications, FCI Basics Minitek® 0.80mm is the ideal solution for devices that require compact and low-profile connectors. With wire gauge range from 32AWG-28AWG, these connectors are available in a single row vertical SMT and right angle SMT configurations. These connectors come with locking features to provide enhanced contact reliability.
Minitek® is Amphenol ICC's brand for BTB and wire/cable to board connectors in 2.00mm pitch. It is a fully modular system enabling all types of connections between PCBs, wires, and flat cables. Its 2mm spacing allows up to 38% space saving compared to traditional modular systems. It is available in vertical and horizontal configurations both in single and double row with 2 to 25 positions per row.
Minitek® Board-In connector system is a flexible solution designed for economical and permanent wire-to-board applications up to 3A. It is a one-piece direct solder-to-board solution that provides space and cost savings compared to a two-piece connector system. It is currently offered in 2-16 positions under 2.00mm and 2.50mm pitch sizes covering vertical and horizontal configurations.
FCI Basics Minitek® MicroSpeed connector family with 1.00mm pitch supports high-speed data applications with up to 25Gb/s. These connectors feature a shielded design that provides superior EMC performance and significantly improved electromagnetic compatibility. The poka-yoke polarization prevents visual mismating, which makes it ideal for use in industrial environments.
Minitek® Pwr 3.0 BMI is a flexible and comprehensive solution designed for power application with current rating up to 8.5A per circuit. It is available in 4 to 24 circuits in dual row with Right angle and vertical options. Both WTB and WTW solutions are supported in this 3mm BMI product family.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 3.0 is a flexible and comprehensive solution designed for power application with current rating up to 5A per circuit. It is available in 2 to 24 circuits for dual row and 2 to 12 circuits for single row.
ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE
Minitek® Pwr 3.0 High Current Connector (HCC) is designed for power applications with a current rating of up to 12A per contact and a wire gauge range from 16AWG to 30AWG for Wire-to-wire and Wire-to-Board applications. It is available in 2 to 24 circuits for dual rows and 2 to 12 circuits for single rows.
ROBUST AND VERSATILE SELFALIGNING CONNECTOR
Minitek® Pwr 4.2 BMI is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 24 circuits for dual row.
COMPACT, ROBUST AND VERSATILE
Minitek® Pwr 4.2mm is a flexible and comprehensive solution designed for power application with current rating up to 9A per circuit. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.
ROBUST, VERSATILE AND HIGH CURRENT PERFORMANCE
Minitek® Pwr 4.2 High Current Connector (HCC) is designed for power applications with current rating up to 13A per contact and wire gauge range from 30AWG-16AWG for wire-to-wire and wire-to-board applications. It is available in 2 to 24 circuits for dual row and 3 to 5 circuits for single row.
Amphenol introduces the Gen 5, Minitek® 12VHPWR connector system. This new introduction CEM 5.0 PCI Express® 12V-2x6 auxiliary power connector and cable assembly support the 600W GPU cards. The 12V-2x6 auxiliary power connector is not designed to mate with legacy PCI Express® 2x3 and 2x4 12V Auxiliary Power connectors.
Amphenol introduces the new PICPWR OCP® connector system. This new introduction PICPWR 2x6+12SB or 2x3+6SB auxiliary power connector and cable assembly supports the 864W (2x6) / 486W (2x3) power distribution within the HPM and to/from peripheral subsystems to HPM or peripheral subsystems.
Amphenol Mini USB Type B design offers customized design. Mini USB 2.0 connector takes up only about 1/8 of the space of standard USB-B, five circuits, with one circuit reserved for future use in host identification between devices. These portable devices are used for consumer applications and charging. These are available in both SMT and through-hole receptacles available.
Amphenol LTW Waterproof Mini & Micro-USB 2.0 SWIFT Connectors are IP67 / IP68 stand-alone connectors suitable for miniature connector requirements or wearable applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
RJE1Y cable assemblies are offered in a variety of colors, lengths, and boot styles with speeds up to 25 Gigabit Ethernet. The RJ45 plugs have injection-molded kinks to protect the cable and wire. There are three main strain relief styles: non-booted, bubble boot, and latch boot. The boot offers protection to the locking tab on the RJ45 plug which prevents it from being damaged.
Amphenol FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking and Home Entertainment markets for various applications. The product features a simple, flexible and low profile design for LAN application, in particular, the Network Interface Card.
Amphenol LTW provides a comprehensive product range of M series, including M5, M8, Guided M8, M10.5, M12, 7/8", M20 and M23. We also have push pull version, MPronto-12, The Mpronto-12 M12 push pull connectors are the World’s First truly backward compatible to all female M12*1.0 sockets made by different manufacturers.
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Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry standard sockets. This helps to upgrade the graphics processor in a device, without changing the whole system or relying on proprietary vendor upgrades.
Amphenol's MXM connector is a high-density PCIe® solution that supports next-generation server system architectures. These are non-proprietary, industry-standard sockets. With 0.50mm pitch and 314 contacts, the MXM 3.0 connector supports 16 lanes of PCI Express® signal performance with smaller board space.
SV Microwave, a longstanding participant in the VITA community and active member of the electro-mechanical and hardware working groups, is now officially licensed to offer NanoRF modules and contacts. This addition to our VITA modular interconnect system underscores our commitment to staying at the forefront of VITA technologies.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
SV Microwave’s latest addition to its Non-Magnetic product family introduces high-performance cable assemblies engineered for magnetically sensitive environments. These compact 6" assemblies pair trusted SMA and SMPM interfaces with Ø.047" or Ø.085" flexible cables to deliver low-loss, high-frequency performance in a ready-to-use format. Ideal for applications in quantum computing, test and measurement.
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
OCP 48V COMPATIBLE POWER CABLE ASSEMBLY FOR OPEN COMPUTE IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant Barklip® BK150 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and provide a convenient method of distributing up to 150A per contact between busbars, cables, and circuit boards.
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 220A per contact between busbars, cables, and circuit boards.
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards.
Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. The connector system features two individual power circuits and two newly added secondary chassis grounding contacts.
Designed based on three decades of experience developing power connectors for specific applications. For use in power shelves, servers, or any other aspect of OCP power management. Extended efforts include offering turn-key AC whip cable assemblies to ORV3 specifications.