IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
100G VPX Backplane
Amphenol-BSI 100G VPX Backplane is based on the OpenVPX65 BKP3-CEN08-15.2.16-n profile. We have used our experience from 30 years developing 100G backplane systems to the IT/Datacom market. Next-generation VPX interconnects allow the signal transition path to expand to 100G bandwidth through a traditional copper backplane. Backplane assembly and test in the production environment are critical.
1.0-2.3 Connector Series
The 1.0/2.3 connector series features a compact design for dense connector packing which makes them ideal for applications where space limitation is a factor. The Amphenol version features a patented ultra-slim push-pull coupling system which allows quick installation and ensures positive locking and high retention.
10G SFP+ Loopback Modules
10G PORT TESTING SOLUTION
Amphenol's 10G SFP+ MSA compliant Loopback Modules are part of Amphenol's comprehensive copper cable and connector product family. Offered as passive electrical, our SFP+ Loopbacks come with and without EMI spring fingers. Loopbacks without EMI spring fingers reduce the insertion and extraction force.
1RU 125A Dual-Feed GMT Fuse Panel
The 125GMT10/nrg125GMT10 and 125GMT15/nrg125GMT15 fuse panels are 125A dual-feed and provide 10/10 and 15/15 GMT fuse positions. Engineered into a standard 1RU footprint that supports up to 20A GMT fuses in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
1RU 240A Dual-Feed, 9/9 TPA/GMT Fuse Panel
The 240GT54/nrg240GT54 combination fuse panels are 240A dual-feed and provide 5/5 GMT fuse positions and 4/4 TPA fuse or circuit breaker positions. Engineered into a standard 1RU footprint, with circuits that support up to 20A GMT fuses and 50A TPA fuses or 60A breakers in each position, providing ample capacity for distribution to a broad range of components.
1RU 250A Dual-Feed, 8/8 TPA Fuse Panel
The 250TPA08/nrg250TPA08 fuse panels are 250A dual-feed and provide 8/8 TPA fuse positions. Engineered into a standard 1RU footprint, each circuit supports up to 50A TPA fuses in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
1RU 325A Dual-Feed, 8/8 Circuit Breaker Panel
The 300CB08/nrg300CB08 circuit breaker panels are 325A dual-feed and provide 8/8 breaker positions. Engineered into a standard 1RU footprint, each circuit supports up to 60A breakers in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
1RU Circuit Breakers
Engineered for use in 1RU circuit breaker panels, these single-pole standard delay circuit breakers provide reliable circuit protection for DC applications from 5A to 60A. In addition to providing conventional overcurrent protection, each breaker can be used as an on-off switch.
32G FC SW Transceivers
The 32G FC SW transceivers are designed to be used in Fibre Channel links up to 28.05 Gb/s data rate over multimode fiber. They are compliant with FC-PI-6a, SFF-8472 Rev 12.2c, and compatible with SFF-8432b and applicable portions of SFF-8431 Rev. 4.1d. These transceivers are RoHS compliant and per Directive 2011/65/EUe.
4.3-10 Connector Series
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.
50G SFP56 LR Transceivers
SUPPORTS 53.12Gb/s DATA RATE & LOW POWER
The module is compliant with IEEE 802.3 cd, SFF-8472 Rev 12.4, and compatible with SFF-8432 and applicable portions of SFF-8431 Rev. 4.1.
- Supports 53.125Gb/s data rate
- 1.8W maximum power consumption with established link
- Up to 10km on 9/125μm SMF
- Operating temperature range: -40°C to 85°C
- Electrically hot-pluggable
50G SFP56 SR Transceivers
SUPPORTS 53.125Gb/s DATA RATE & LOW POWER
The module is compatible with IEEE 802.3 cd 50G SR. Maximum link length of 70m on OM3 multimode fiber or 100m on OM4 multimode fiber.
- Low power - 1.5W
- Mature COB technology
- Outstanding BER and sensitivity
- Supports 53.125Gb/s data rate
- Electrically hot-pluggable
Active Optical Cables
AOC series includes QSFP28 AOC, QSFP+ AOC, SFP28 AOC, SFP+ AOC, QSFP28 to SFP28 BO, and QSFP+ to SFP+ AOC BO, compliant with MSA and other standards. It is characterized by low power consumption, small size, and high reliability, which is beneficial to increase capacity of data centers, improve port density, and reduce power consumption.
Advanced Optical Modules (AOMs)
From a dedicated Base-8 architecture to a standard 12 or 24 fiber system, Amphenol Network Solutions' Advanced Optical Modules (AOMs) offer the complete solution. Our AOM portfolio is easily configurable and adaptable to create a solution that meets your network needs. Modules are deployed in the C2X or C2E chassis.
AdvancedTCA
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.
AgilLink™ 1.20mm Wire-to-Board Header G823H
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol ICC offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.50mm Wire-to-Board Header G886
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol ICC offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.50mm Wire-to-Board Header G863
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol ICC offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AirMax® Power Connectors
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® High-Speed Backplane Connector
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
AirMax VSe® High-Speed Backplane Connector
Next-generation AirMax VSe® connectors provide a migration path for up to 25Gb/s per differential pair with the flexibility of an open pin field design. The connectors also feature backward mating-compatible interfaces to existing AirMax VS® connectors with minimal changes to connector footprints.
AirMax VS® 85Ohms High-Speed Backplane Connector
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI
AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax VS® high-speed signal connectors from Amphenol ICC meet the dimensional and electrical requirements described in the Compact PCI® Serial (PICMG CPCI-s.0) Specification developed by the PCI Industrial Computer Manufacturers Group (PICMG). Connections between a front system or peripheral board and backplane are accomplished using right-angle headers and vertical receptacles.
AirMax VS® Coplanar High-Speed Backplane Connector
AirMax VS® coplanar connectors permit mating two boards in the same plane. The AirMax family includes many coplanar configurations including 3-, 4- and 5-Pair per column connectors with column pitch of 2mm and 3mm. This family also includes 100 Ohms versions for the broad market as well as 85Ohms versions for other computer architectures. These connectors can accommodate 12.5Gb/s applications.
AirMax VS® High-Speed Backplane Connector
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal High-Speed Backplane Connector
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® SBB High-Speed Backplane Connector
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Amphe-PD™
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-PRB
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
APC 8010
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Aptera™
The Aptera™ connector meets difficult electronic packaging challenges with a high-speed interconnect designed specifically for space-constrained areas without impeding airflow. Aptera's™ pin assignments are not predetermined, providing more flexibility when it comes to PCB routing design. It features low crosstalk that supports 6.25Gb/s data rates.
BarKlip® BK100 I/O
BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK150 Connector
LOW RESISTANCE BUSBAR CONNECTOR
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore lowering resistance connectors.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BergStak HS™ 0.50mm Mezzanine Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
BergStak HS™ 0.50mm connector is a flexible solution designed for high speed and high density, parallel board-to-board applications with various heights in different sizes.
The BergStak HS™ 0.50mm connector series meets the new 25Gb/s and 32Gb/s performance requirements.
BergStak HS™ 0.80mm Board-to-Board Connector
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm Mezzanine Connector
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
BergStak® 0.80mm Pitch
FLEXIBLE SOLUTION FOR HIGH-DENSITY APPLICATIONS
FCI Basics BergStak® 0.8mm is a flexible solution designed for high speed and high density, parallel board-to-board connector system with 16 PCB stack heights in 9 sizes up to 200 positions.
BergStak® 0.80mm Shielded Board-to-Board Connector
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
BergStak® FX10 0.50mm Board-to-Board Connector
FCI Basics BergStak® product range is expanded to include a 0.50 mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT configuration.
BergStak® Secure Connector
HIGH SECURITY/HIGH DENSITY/HIGH-SPEED BOARD-TO-BOARD CONNECTOR
The BergStak® Secure connector contains One-time-use and Multi-times-use solutions. Both solutions have unique shield designs to protect signal transmission. The 3-row contact design with 1.0mm pitch improves board surface utilization by 20%. The family can support high-speed data transmission up to 32Gb/s.
Board-to-Board 100Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets SAS 3.0, 12GT/s.
Board-to-Board 85Ω (0.60mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.60mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board 85Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board Connectors (0.50mm pitch)
0.50MM PITCH, 85Ω BOARD-TO-BOARD SOLUTION
Amphenol high-speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights and pin counts are offered to provide maximum design flexibility. Amphenol 0.50mm pitch connector design is suitable for high-performance applications.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
C2E Fiber Distribution Panel
The C2E chassis provides a solution that is dense, modular, and tray-based. It is offered as either a dedicated Base-8 solution using the HX8 Base-8 modules for LC to MPO breakout or the Amphenol Network Solutions HX and HX2 modules alternative trays.
CFP 100G Transceivers
Amphenol 100G CFP/CFP2/CFP4 series optical transceivers support from 10km to 40km reach, adopt LC interface, compatible with IEEE802.3ba, MSA, and other standards. It has the characteristics of low power consumption, dual rate, and high speed. It is widely applied in large data centers, telecom, and other environments.
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.