With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
0.40mm Fine Pitch 3.0mm Stacked Height Board-to-Board
Amphenol's 0.40mm Fine Pitch 3.0mm Stacked Height Board-to-Board connectors are suitable for a wide range of high-reliability applications and demanding environments. Its unique connector design allows the rotation angle after fully mated at 0.7° and X&Y axis mating misalignment of 0.3mm. This pair of connectors comes with data rates up to 6Gbs.
HIGH-SPEED FINE PITCH FLOATING BOARD-TO-BOARD CONNECTORS
This fine pitch 0.40mm 4mm stacked height 80pos floating board-to-board connectors are suitable for a wide range of high-reliability applications and demanding environments. Its unique connector design gives a floating range of ±0.20mm in X and Y directions. With data rates up to 6Gb/s these connectors meet high transmission requirements.
0.50MM PITCH, 85Ω BOARD-TO-BOARD SOLUTION
Amphenol high-speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights and pin counts are offered to provide maximum design flexibility. Amphenol 0.50mm pitch connector design is suitable for high-performance applications.
F33M/F332/F323 series is a 0.50mm pitch Non-ZIF flex connector with an Autolock mechanism and surface mount termination. It comes with 6 to 68 contact positions in both right angle and vertical orientations. This series features a cable thickness of 0.33mm and provide the durability of 20 mating cycles. Its robust connector design makes it suitable for robotic operations, supporting Industry 4.0.
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.60mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets SAS 3.0, 12GT/s.
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
0.80mm Board-to-Board Connectors - B401/B402 Series
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
0.80mm Floating Board-to-Board Connectors - B406/B407/B410 Series
Amphenol's B406/B407/B410 series is 0.80mm pitch floating board-to-board connectors that support stack height up to 23mm and positions from 30 to 120. Its unique connector design has a floating range of ±0.50mm in the X, Y, and Z directions which makes it resistant to vibration. It also supports speed performance up to 2.5Gb/s to meet high transmission requirements.
Amphenol's XGIGA 100G QSFP28 optical modules include SR4, AOC, AOC break out, CWDM4, LR4, ER4 Lite, ER4 and ZR4 series, which adopt LC or MPO optical ports and are compatible with IEEE802.3bm, SFF-8636 and other standards; With low power consumption and small size, it is mainly used in 100G data center internal network, data center interconnection, metropolitan area network and other environments
Amphenol's 100G QSFP28 optical modules include SR4, AOC, AOC break out, CWDM4, LR4, ER4 Lite, ER4 and ZR4 series, which adopt LC or MPO optical ports and are compatible with IEEE802.3bm, SFF-8636 and other standards; With low power consumption and small size, it is mainly used in 100G data center internal network, data center interconnection, metropolitan area network and other environments.
Amphenol 100G CFP/CFP2/CFP4 series optical transceivers support from 10km to 40km reach, adopt LC interface, compatible with IEEE802.3ba, MSA, and other standards. It has the characteristics of low power consumption, dual rate, and high speed. It is widely applied in large data centers, telecom, and other environments.
Amphenol-BSI 100G VPX Backplane is based on the OpenVPX65 BKP3-CEN08-15.2.16-n profile. We have used our experience from 30 years developing 100G backplane systems to the IT/Datacom market. Next-generation VPX interconnects allow the signal transition path to expand to 100G bandwidth through a traditional copper backplane. Backplane assembly and test in the production environment are critical.
Amphenol's 1.00mm pitch flex connectors utilize 1.00mm contact spacing to terminate displays and support complex board-to-board connections. These connectors are offered with top and bottom contact positions in both ZIF (Zero Insertion Force) and Non-ZIF cable terminations. The connector series comes with a wide height range of 2.00mm to 5.04mm with 3 to 34 contact positions in both vertical and right angle
Amphenol LTW MPronto-12 Push-Pull Connectors are the world's first truly backward compatible to all M12*1.0 threaded sockets of any manufacturer. Support all M12 codes, the number of contacts is up to 17 pins. Meets IP69K, saves more than 80% of installation time【Video: https://www.youtube.com/watch?v=OCGOYVrbl0k】
The 1.0/2.3 connector series features a compact design for dense connector packing which makes them ideal for applications where space limitation is a factor. The Amphenol version features a patented ultra-slim push-pull coupling system which allows quick installation and ensures positive locking and high retention.
DESIGNED FOR USE IN 10GB/S DATA RATE LINKS. COMPLIANT WITH 10G ETHERNET AND CPRI
Amphenol's 10G SFP+ optical modules include SFP+ AOC. They are compliant with SFP+ MSA, SFF-8431 and SFF-8472, and are mainly used in Telecom, Wireless, InfiniBand, and Fiber Channel. The transceiver is RoHS compliant and per Directive 2011/65/EU.
112G PAM4 Mini Cool Edge 0.60mm Card Edge Connectors
Mini Cool Edge is a 0.60mm high-density, high-speed card edge connector for new-generation small form factor systems. The fine-pitch solutions in vertical orientation are now available for a complete interconnect solution.
Mini Cool Edge 0.60mm meets SFF-TA-1002, OCP NIC 3.0 specifications and networking applications. Common applications include Network Interface Card, Add-In Card, and GPU link.
Amphenol's SFP optical transceivers include 1.25Gb and 2.5Gb series. They support Duplex, BiDi, CWDM, and DWDM applications, and can reach various distances from 500m to 80km. These transceivers adopt an LC interface and are compatible with IEEE802.3ba, SFF 8472, SFP MSA, and other standards. They are characterized by low power consumption, small size, and high reliability.
The 125GMT10/nrg125GMT10 and 125GMT15/nrg125GMT15 fuse panels are 125A dual-feed and provide 10/10 and 15/15 GMT fuse positions. Engineered into a standard 1RU footprint that supports up to 20A GMT fuses in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
The 240GT54/nrg240GT54 combination fuse panels are 240A dual-feed and provide 5/5 GMT fuse positions and 4/4 TPA fuse or circuit breaker positions. Engineered into a standard 1RU footprint, with circuits that support up to 20A GMT fuses and 50A TPA fuses or 60A breakers in each position, providing ample capacity for distribution to a broad range of components.
The 250TPA08/nrg250TPA08 fuse panels are 250A dual-feed and provide 8/8 TPA fuse positions. Engineered into a standard 1RU footprint, each circuit supports up to 50A TPA fuses in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
The 300CB08/nrg300CB08 circuit breaker panels are 325A dual-feed and provide 8/8 breaker positions. Engineered into a standard 1RU footprint, each circuit supports up to 60A breakers in each position, providing ample capacity for distribution to a broad range of components. Advanced circuit-level monitoring features are available as an option.
Engineered for use in 1RU circuit breaker panels, these single-pole standard delay circuit breakers provide reliable circuit protection for DC applications from 5A to 60A. In addition to providing conventional overcurrent protection, each breaker can be used as an on-off switch.
Amphenol QSFP DD to QSFP DD 200G Active Optical Cable assemblies increase the number of lanes from 4 to 8 and double the port density as compared to 100G QSFP28 AOC. The QSFP DD AOCs operate up to 25Gb/s NRZ modulation and provide solutions up to 200Gb/s aggregate bandwidth, supporting 100meters over parallel multimode fiber.
HIGH DENSITY, EXCELLENT PERFORMANCE AND RELIABILITY
Amphenol's 300G CXP2 to CXP2 Active Optical Cable is a natural choice for optical cabling in data center/high-performance computing hardware applications, providing a cost-effective plug-and-play cabling solution. The CXP2 form factor delivers the highest hardware faceplate port density among existing SFF industry standards.
The 32G FC SW transceivers are designed to be used in Fibre Channel links up to 28.05 Gb/s data rate over multimode fiber. They are compliant with FC-PI-6a, SFF-8472 Rev 12.2c, and compatible with SFF-8432b and applicable portions of SFF-8431 Rev. 4.1d. These transceivers are RoHS compliant and per Directive 2011/65/EUe.
Amphenol provides a series of 40G QSFP+optical module products, including SR4, eSR4, IR4, LR4, ER4 lite, AOC and AOC breakout series. This series of products adopts LC or MPO optical port and is compatible with IEEE802.3bm, SFF-8436 and other standards; It has the characteristics of low power consumption, small size, high speed, and is applied to large data centers, campus networks, metropolitan area networ
Amphenol RF offers a full range of 4.3-10 connectors and adapters, which are engineered for the wireless market and are ideal for applications requiring low passive intermodulation, or PIM.
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.
AgilLink™ 0.8mm wire-to-board connector is the most common solution for transferring low power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including, V/T SMT, and R/A SMT to meet various customer requirements. The compactness of the connectors allows for extensive usage in consumer applications.
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI
AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
Amphenol's AirMax VSX® connectors are high speed, high density, 2.00mm pitch connectors that support 56Gb/s PAM4 performance. Innovative design reduces crosstalk and reaches excellent SI performance. AirMax VSX provides a migration path to 56Gb/s PAM4 with backward mating compatibility with traditional AirMax VS®, AirMax VS2® and AirMax VSe® series. Industry leading robustness with field proved components.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】