IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
M Series Metric Circular Connector
Amphenol LTW provides a comprehensive product range of M series, including M5, M8, Guided M8, M10.5, M12, 7/8", M20 and M23. We also have push pull version, MPronto-12, The Mpronto-12 M12 push pull connectors are the World’s First truly backward compatible to all female M12*1.0 sockets made by different manufacturers.
【Quick guide: https://amphenolltw.com/down.php?supp_download=100】
M-Series™ VR 56Gb/s PAM4 BGA Mezzanine Connector
Leveraging proven technologies, including an industry-leading BGA design, this connector system offers a solution that provides superior self-aligning and self-leveling capabilities. This product incorporates a next-generation differential pair contact design, enabling impressive performance of up to 56Gb/s for both PAM4 and NRZ applications.
Multi-Trak™
Amphenol introduces the next-generation product - Multi-Trak™. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 56G PAM4 PCIe® Gen 5 and target to meet 64G PAM4 PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
NeXLev® 12.5Gb/s High Density BGA Mezzanine Connector
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
nrgBDFB-XLW 1000A Battery Distribution Fuse Bay
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type Connector Series
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
OCP 48V BarKlip® BK150 IO
OCP 48V COMPATIBLE POWER CABLE ASSEMBLY FOR OPEN COMPUTE IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant Barklip® BK150 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards and provide a convenient method of distributing up to 150A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK220 I/O
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK220 power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 220A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK350 I/O
OCP-COMPATIBLE ORV3 POWER ASSEMBLY CONNECTOR FOR IT GEAR POWER DISTRIBUTION ARCHITECTURE
Amphenol's OCP 48V compliant BarKlip® BK350 I/O power cable assemblies are designed to meet OCP V3 IT Gear power distribution architecture standards. The connector system supports up to 360A per contact between busbars, cables, and circuit boards.
OCP 48V BarKlip® BK500 IO
Amphenol's OCP 48V compliant Barklip® BK500 IO power cable assemblies are designed to meet OCP V3 power distribution architecture standards and provide a convenient method of distributing up to 500A per contact between busbars, cables, and circuit boards. The connector system features two individual power circuits and two newly added secondary chassis grounding contacts.