IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Cable Assemblies
mphenol is leading the industry in OSFP cable development. Our Electronics Products ʻProduct of the Yearʼ award-winning OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with 25G/lane channel NRZ up to 224G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G, 400G, 800G, and 1.6T per cable assembly.
OSFP-XD Copper Cable Assemblies
Amphenol is at the forefront of OSFP-XD (Octal Small Form Factor Pluggable eXtra Dense) cable development, setting new industry standards with our innovative designs. Our advanced OSFP-XD cable assemblies are designed to meet the rigorous demands of both PCIe® Gen 5 and Ethernet protocols, providing a future-proof solution with unparalleled bandwidth capabilities.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® HD 224Gb/s Backplane Interconnect System
INDUSTRY LEADING DENSITY AND PERFORMANCE – YOUR PATH TO 224GB/S
The Paladin® HD interconnect system provides world class bandwidth from 112Gb/s to 224Gb/s with industry leading density, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin® HD's unique mating interface allows for consistent performance in a de-mated condition, critical for next generation systems.
PanelMate™ Family
Amphenol Sine Systems’ PanelMate™ Family of receptacles are engineered with a one-piece, sealed, flanged design for rapid and secure mounting. Their durable, high-temperature, silicone, facial seal provides a barrier of protection from lubricating oils, hydraulic fluids and fossil fuels to withstand the challenges and complexities of harsh environment applications.
PCI
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
PCIe Over Optics- Linear Pluggable Optics (LPO)
QSFP-DD Linear Pluggable Optics. Type II QSFP-DD Form Factor. PCIe Gen 5.0 protocol. 8 Channel full-duplex transceiver. Lengths up to 50m OM4.
Power dissipation < 5W
PCIe® Gen 4 M.2 1A Card Edge Connectors
Amphenol's PCIe® Gen 4 M.2 1A connectors provide 67 contacts on 0.50mm pitch and signal transmission speed of 16Gb/s. It occupies less board space, offers more connector height options. It is designed for PCIe® 4.0 1A applications, making it suitable for tablets, laptops and low profile storage and server applications.