With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature.
The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB
Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.
SINGLE-PIECE COMPRESSION TYPE SURFACE MOUNT CONNECTORS
Amphenol Communications Solutions offers compression-type surface mount connectors to provide power and signal connection between either two PCB modules or one PCB and an electrical module. The single-piece small footprint solution brings cost and space savings to the design of smaller and more economical consumer electronic devices.