IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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MCX Connector Series
The MCX (Micro Coaxial) series is a 50 Ω series with broadband capability ranging from DC to 6 GHz. In addition, the MCX series features secure, fast and easy snap-on/ snap-off coupling.
MEG-Array® 32Gb/s High Density BGA Connector
The MEG-Array® Mezzanine Connector provides the high density and high-speed benefits of a large array supported by the reliability and low costs of standard surface mount PCB assembly.
1.27x1.27mm array of discrete circuit contacts allows flexible ground distribution to optimize high-speed signal integrity at speeds up to 32Gb/s. MEG-Array® is offered in a variety of PCB mezzanine stack heights
Metral® High Speed 1000 Series Backplane Connectors
Amphenol’s FCI Basics Metral® 1000 Series is a high-speed 2mm backplane connector system consisting of right-angle receptacles and vertical headers. The 1000 Series features a unique stripline structure in the receptacle and outer ground shields in the header. The stripline structure allows improved signal performance when routed in either a single-ended or a differential pair configuration.
Metral® High Speed 2000 Series Backplane Connectors
Amphenol’s FCI Basics Metral® 2000 Series is a high-speed 2mm backplane connector system of vertical headers. The 2000 Series features a unique stripline structure that allows having improved signal performance when routed in either a single-ended or a differential pair configuration.
Metral® High Speed 4000 Series Backplane Connector
Amphenol’s FCI Basics Metral® 4000 Series is a high-speed 2mm backplane connector system consisting of right-angle receptacles and vertical headers. The 4000 Series features a unique stripline structure in both the receptacle and header. Compared to the Metral® 1000 and 2000 Series, Metral® 4000 receptacle connectors employ a modified receptacle contact geometry optimized for 100Ω differential signals.
Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro Cool Edge NF1/NGSFF 0.50mm Connectors
Micro Cool Edge NF1/NGSFF 0.50mm is a new small form factor card edge connector designed for enterprise and data center SSD (Solid State Drive) servers. It supports NF1/NGSFF (Next Generation Small Form Factor) which can double storage capacity and enable front side service within server systems compared to the M.2 standard.
Micro Power 3.0
Micro Power 3.0 connector system is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating up to 6.5A per pin and a wire gauge range from 30AWG-20AWG. It is available in 2 to 24 circuits for dual rows and 2 to12 circuits for a single row. Scoop-proof housings prevent mismating between header and receptacle.
Micro Power Plus 3.0
Micro Power Plus 3.0 connector system, is a 3.00mm pitch power connector designed for wire-to-board applications. It is mainly used for power applications and supports a current rating of up to 12.5A per pin and wire gauge range from 30AWG-16AWG. It is available in 2 to 24 circuits for dual row and 2 to12 circuits for single rows.
Micro Power Super
Micro Power Super series is a 3.00mm pitch power connector designed for flexible wire-to-board applications, based on different wire gauges and circuits. It provides a maximum current rating of 17A/pin and accommodates a wire gauge of 16AWG and 15AWG. It is foolproof against mismating among different circuits. This series is available for 2 to 24 circuits for dual rows.
Micro SD and SD Card Sockets
MEMORY CARD CONNECTORS WITH SUPPORT FOR UHS-I AND UHS-II
Micro SD and SD card sockets are user-friendly and ideal for use in portable devices such as digital cameras and mobile phones. They are also suitable for server applications as well as automotive devices, notebooks, and servers.
Micro-TCA Card Edge Connectors
FULLY COMPLIANT CONNECTOR FOR ADVANCED MC™ MODULES
MicroTCA (μTCA) vertical card edge connectors provide 170 contacts on a 0.75mm pitch and enable Advanced MC™ modules to be plugged directly into a backplane. MicroTCA card edge connectors' conventional press-fit or surface mount assembly processes and connector designs require no costly hardware, resulting in low total applied cost.
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
Millipacs® Power & Hybrid Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® R/A Headers
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
Millipacs® R/A Receptacles
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
Millipacs® Vertical Headers
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.
Millipacs® Vertical Receptacles
Millipacs® HM vertical receptacles are offered in standard 5 and 8 row signal modules and up to maximum of 200 signal contacts. Vertical receptacle module, when mated to a standard straight header are suitable for parallel Board-to-Board applications. Vertical receptacle can also be used in backplane in the place of vertical header and mated with right angle header on the daughter card.
Mini Cool Edge 0.60mm Connectors
Mini Cool Edge is a 0.60mm high density, high-speed card edge connector for a new generation small form factor system. These fine pitch solutions offer multiple BTB applications like a right angle, mezzanine, and coplanar and support cable interconnect options. Mini Cool Edge 0.60mm meets SFF TA-1002, Gen Z, EDSFF and OCP NIC 3.0 specifications.
Mini Cool Edge IO
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector come with a slim form factor design, capable of transmitting high-speed signal up to 64G PAM4/PCIe® Gen 4/PCIe® Gen 5/PCIe® Gen 6, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional pcb routing methods.