With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
The BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections.
It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature.
The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB
Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.
SINGLE-PIECE COMPRESSION TYPE SURFACE MOUNT CONNECTORS
Amphenol Communications Solutions offers compression-type surface mount connectors to provide power and signal connection between either two PCB modules or one PCB and an electrical module. The single-piece small footprint solution brings cost and space savings to the design of smaller and more economical consumer electronic devices.
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 64 GT/s Gen 6 capabilities. Slim connector design saves space on the motherboard while facilitating other higherdensity applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
CoolPower® HD Right-Angle Cable-to-Board Connector
Amphenol's CoolPower® HD Right-Angle Connector is a 90-degree, versatile pin-and-socket solution designed to deliver highdensity power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and ....
Amphenol's CoolPower® HD Vertical Connector Series is a versatile pin-and-socket solution that delivers high-density power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and offers exceptional ...
CoolPower® Slim Drawer Mini (SDM) Connectors offer a high level of mating configuration flexibility, current density, and a thin profile making it ideal for compact board-to-board power interconnects. The CoolPower® SDM series is available with two or four power lines and boasts up to 318A per linear inch in a footprint of only 5.6mm x 14mm.
Amphenol's CoolPower® Slim Drawer Series is configurable to accommodate various combinations of power and signal contacts and a number of mounting and termination options. CoolPower® Slim Drawer can deliver up to 60A per pin and provides an ultra-low end-of-life contact resistance of just 0.4mΩ. Additional features include blind-mating, sequential mating, and true hotplug capabilities.
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
Crossbow allows designers to take advantage of all the benefits associated with orthogonal mid-plane architectures as the differential pairs on each side of the mid-plane share vias creating a straight pass-through connection. This shared via approach combined with the Crossbow footprint, eliminates most electrical problems associated with the typical backplane via stub.
Amphenol LTW's Cable Glands are applied in conjunction with cable or wiring for power or electrical purpose. The Cable Glands are attached to the end equipment and act as a sealing of the terminating housing to ensure the protection of electrical equipment and enclosures. Available in different sizes, materials【Quick guide: https://amphenolltw.com/down.php?supp_download=90】
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Amphenol's Flex Cable Assemblies provide value-added solutions to challenging interconnect problems where a flexible solution is desirable. Amphenol flex cables can be engineered to use any mezzanine connector in the Amphenol portfolio to meet unique signal integrity, mechanical, power, and environmental requirements.Amphenol flex cables are qualified in a wide range of commercial and military...
Amphenol's CXP passive copper cable assemblies are designed to meet the high bandwidth capacity demands being requested by data centers and high-performance computing applications. The CXP copper cables are a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 120Gb/s and 168 Gb/s.
DDR3 vertical DIMM sockets are designed to accept 240 position DDR3 memory modules that conform to JEDEC M0-269. Low-resistance contacts support the use of RDIMM (registered DIMM), which helps to further reduce power consumption in data center hardware.
Vertical DDR4 DIMM sockets from Amphenol provide 288 contacts on 0.85mm pitch and are designed to accept DDR4 memory modules that conform to JEDEC MO-309. The DDR4 series complies with the new interface standard JEDEC POD12. It allows a module seating plane of 2.40mm and supports module variants in UDIMM, RDIMM, and LRDIMM.
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DDR4 Ultra Low Profile (ULP) vertical DIMM sockets provide 288 contacts on 0.85mm pitch. It facilitates convenient memory expansion in servers, workstations, desktop PCs, and embedded applications in communications and industrial equipment. With an ultra-low module seating height of 1.1mm and connector height of 13.1mm, it reduces the overall profile of the connector.
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023
The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges.
With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.
HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR
Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability.
The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21 and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system. This robust and standardized solution is widely used in Industrial and Instrumentation markets.
Double Density Cool Edge 0.80mm Connectors and Cable Assemblies
The 0.80mm pitch Double Density Cool Edge connectors and cable assemblies offer a compact design with 2 rows of contacts. This highly configurable single piece connector can accommodate both high speed and low speed signal and power. This hybrid connector reduces more than half of the PCB footprint when compared to 1.00mm PCIe Cool Edge. It supports PCIe Gen 5 and is designed for multiple Add-In-Card...
DSFP SMT Connectors offer dual high-speed lanes operating at 28Gb/s NRZ and 56Gb/s PAM-4 for a 50G & 100G aggregated bandwidth solution. It has additional 2 pins compared to the SFP/SFP+ family, which enables it to have a second high-speed channel with an identical connector form factor. The DSFP shares the same unique mating interface and EMI cage dimensions as the whole range of SFP/SFP+ cages.
Amphenol's DSFP cable assemblies are designed to support applications for Ethernet and Fibre Channel. The Amphenol DSFP products offer an ultra-high-performance, cost effective solution for 10G/25G/50G speed applications in switched fabric I/O, switches, routers, data storage arrays, and high-performance computer (HPC) clusters. The Small Form Factor Pluggable (SFP) interface supports a variety of commun...
Amphenol's D-Sub Accessories complement their D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories include plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, metal and plastic dust caps, and brackets .
Amphenol's D-Subminiature (D-Sub) connectors are part of an industry standard for applications requiring robust and reliable connectors. These proven D-Sub connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in telecommunications, data, consumer, industrial, military, instrumentation and medical.
Amphenol LTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68. The features are connectors interface meet ANSI / B93.55M-1981, Idiot-proof alignment key design【Quick Guide: https://amphenolltw.com/down.php?supp_download=93】