IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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D-Sub Economy Range Board-Mount Connectors
Amphenol's D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have a guaranteed durability of 50 mating cycles. Board connectors are available in straight and right angle versions, while cable connectors are available in solder bucket and crimp styles.
D-Sub High Density Board-Mount Connectors
Amphenol's D-Sub High Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
D-Sub MicroTCA Connectors
Amphenol's D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost. The connector's compact footprint allows for more space ...
D-Sub Pin-in-Paste Connectors
Amphenol's D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors.
Pin-in-Paste technology (PiP) allows the use of Through Hole product in SMT manufacturing processes. The connectors use high temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.
D-Sub Power Board-Mount Connectors
Amphenol's D-Sub Power Board-Mount Connectors features full power and mixed power versions specifically developed for power applications in industrial and telecom market segment. Board connectors feature preloaded power contacts from 10A to 40A with up to 8 contacts in full power versions. Cable crimp and solder power contacts features colour code plastic clips for easy wire gauge identification.
D-Sub Press-Fit Connectors
Amphenol FCI offers Standard density and Mixed power connectors in press fit termination. In SMT (Surface Mount Technology) manufacturing process, this Press-fit series connectors help to save the cost of an additional wave soldering. The "eye of the needle" termination combined with a special flat rock design (easy application by pressure on insulator) make this product line very attractive.
D-Sub Standard Board Mount Connectors
The standard density D-Subminiature series are widely used for numerous applications in many market segments. Amphenol offers Delta-D (single shell design) and Frugal-D (two shell design) under this category. Standard density D-subminiature PCB mount connectors available in straight and angled version. They come with a large number of mounting options.
D-Sub Standard Density Connectors - NFD17 Series
Amphenol's NFD17 D-Subminiature connectors complement our extensive I/O connector product line. This line of connectors offers many superior features, high performance level and low installation cost. These proven D-Subminiature connectors are one of the most popular Input/Output interconnects, addressing a wide variety of applications in Telecommunications, Data, Consumer Industrial, Instrumentation and Me
EDSFF Board Site Connector
Amphenol introduces the next-generation OverPass™ solution - EDSFF Board Site Connector. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting a highspeed signal up to PCIe® Gen 5 and PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance compared to conventional PCB routing methods.
Elite®
ULTRA-HIGH DENSITY BACKPLANE INTERCONNECT SOLUTION
Ultra-High density 56+ Gbp/s PAM4 interconnect platform utilizing proven press-fit technology and a single wafer design optimized for traditional backplane, direct orthogonal, and cable design solutions.
eQSFP
The eQSFP interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, and a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 28 Gbps/Channel and replacing up to 4 standard SFP+ receptacles. Supporting standards include Gigabit Ethernet, InfiniBand, and SONET/SDH with different data rate options.
EXAMAX2® 112Gb/s Backplane Cable
EXAMAX2® Cable Backplane Systems offer high density cable assemblies for both internal and external applications that are capable of delivering high speed performance of 112Gb/s per channel. EXAMAX2® cable applications include internal OverPass™ cables, external I/O cables, cabled midplane and cabled backplane
ExaMAX2® 112Gb/s High-Speed Backplane Connector
The ExaMAX2® backplane connector system supports 112Gb/s PAM4 industry specifications. It maintains mating interface compatibility with previous ExaMAX products to allow cost/performance flexibility for designers. The mating interface and connector design are optimized to support the demanding electrical and mechanical requirements of 112G systems. ExaMAX2 delivers industry-leading SI performance.
ExaMAX® 56Gb/s Backplane Cable
The ExaMAX® I/O system offers cable assemblies and I/O connector solutions for both internal and external applications. ExaMAX® I/O products are capable of delivering high-speed performance of 25 Gb/s per channel with a path to 40 Gb/s and higher. The ExaMAX® I/O system delivers superior linear board signal density and meets the performance requirements of the OIF-CEI-25G-LR industry standard.
ExaMAX® 56Gb/s High-Speed Orthogonal Connector
The ExaMAX® high-speed orthogonal connector system is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements. The 6-Pair orthogonal right-angle header connector solution further expands the range of applications supported by the ExaMAX® connector system.
ExaMAX® VS High-Speed Backplane Connector
The ExaMAX® VS backplane system is a scalable, cost-optimized connector system designed for higher bandwidth applications up to 25Gb/s. The high-performance connector system provides both mechanical robustness and superior signal integrity, minimizing channel performance variation for every differential pair.
ExaMEZZ® 56Gb/s High Speed, Hermaphroditic BGA Mezzanine Connector
The ExaMEZZ® connector is designed to enable superior 25Gb/s electrical performance and provide a path to 56Gb/s in anticipation of further increases in bandwidth requirements and high-speed signaling. ExaMEZZ® connectors feature a revolutionary beam-on-beam contact interface that minimizes the residual stub for improved signal integrity performance.
ExpressPort® QSFP+
Amphenol's ExpressPort® QSFP+ interconnect system is comprised of a 38 position 0.8mm pitch SMT connector, & a press-fit cage. With four channels of data in one pluggable, the system interface is capable of transferring data up to 16Gb/s per Channel, & replacing up to 4 standard SFP+ receptacles. These features result in greater port density & overall cost savings over traditional SFP+ products.
ExpressPort® SFP+
Amphenol's ExpressPort® SFP+ interconnect system provides data transfer speeds of up to 16Gb/s. The design of the ExpressPort® SFP+ connector minimizes impedance discontinuities & reflections at high data rates & provides a 10-20dB improvement in Near-End Crosstalk. ExpressPort® SFP+ cage construction features EMI shielding available in the form of metal spring fingers or elastomeric gaskets.
ExtremePort™ Flash Connector
Amphenol introduces the next-generation OverPass™ solution - ExtremePort™ Flash. The 0.60mm pitch connector comes with an extremely low profile design capable of transmitting a high-speed signal up to 56G PAM4, and allows much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
ExtremePort™ OSFP 112G Connectors
112GB/S PAM-4 WITH UP TO 800GB/S AGGREGATED BANDWIDTH
Amphenol's ExtremePort™ OSFP 112G interconnect system is comprised of a 60 position, 0.60mm pitch connector designed for high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface.
The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP 224G Connectors
EXTREMEPORT™ OSFP 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP 224G interconnect system is comprised of a 60 position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8x224Gb/s electrical interface. The OSFP footprint is optimized for signal integrity performance.
ExtremePort™ OSFP-XD 112G Connectors
EXTREMEPORT™ OSFP-XD 112G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ OSFP-XD 112G interconnect system is comprised of a 120-position, 0.6mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over a 16 x 112Gb/s electrical interface. The OSFP-XD footprint is optimized for signal integrity performance.
ExtremePort™ QSFP 112G
BACKWARDS PLUG COMPATIBLE AND SUPERIOR SIGNAL INTEGRITY
Amphenol's ExtremePort™ QSFP 112G interconnect system is comprised of a 38position, 0.8mm pitch connector built for use in high speed serial applications. Each port offers 4 channels which increases port density, frees up board real estate and delivers a cost optimized solution. The ExtremePort™ QSFP 112G connector supports next generation 400G appli
ExtremePort™ QSFP DD 112G Connectors
Amphenol's ExtremePort™ QSFP DD 112G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 800Gb/s in aggregate over an 8 x 112Gb/s electrical interface. The cage and connector design provides backward compatibility to QSFP56...
ExtremePort™ QSFP-DD 224G Connectors
EXTREMEPORT™ QSFP-DD 224G INTERCONNECT SYSTEM
Amphenol's ExtremePort™ QSFP-DD 224G interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high-speed serial applications. Each port supports up to 1.6Tb/s in aggregate over an 8 x 224Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP modules which can be inserted into a QSFP-DD
ExtremePort™ QSFP+
Amphenol's ExtremePort™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows for more board real estate and cost-optimized solutions. The ExtremePort™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel.
ExtremePort™ SFP112G
Amphenol's ExtremePort™ SFP112G interconnect system is comprised of a 20-position hot swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports up to 112Gb/s PAM4 aggregate bandwidth with a backward compatibility for next generation Ethernet and Fibre Channel applications. The ExtremePort™ SFP112G connector shares the same unique mating interface and EMI cage dimensions as the SFP+
ExtremePort™ SFP+
Amphenol's ExtremePort™ SFP+ interconnect system is comprised of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB.It supports up to 56Gb/s PAM4 aggregate bandwidth with backward compatibility for next-gen Ethernet & Fibre Channel applications. ExtremePort™ SFP+ connector shares the same unique mating interface & EMI cage dimensions as the SFP+ form factor.
ExtremePort™ Swift Connectors
In order to provide higher speed and smaller size solution on networking equipment and server, Amphenol has developed ExtremePort™ Swift connector which is used in application of PCIe® Gen5 signal NRZ 32GT/s, UPI 2.0 24GT/s, 24Gb/s SAS signal. With 0.6mm contact pitch, ExtremePort™ Swift solutions are smaller than mainstream connectors in current market to save space in end device.
ExtremePort™ Z-Link
Amphenol introduces the SFF-TA-1002 standard solution - ExtremePort™ Z-Link, which is a 0.60mm pitch connector that comes with a slim form factor design, capable of transmitting a high-speed signal up to 56G PAM4, and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
F2X Fiber Optic Building Entry Point
The building entry point (BEP) enables easy connection of buildings to your fiber optic network. The BEP can accommodate different numbers of fibers according to your needs. With the patented F2X® solution you are able to connect and measure FTTX installations faster.
Fan Connector Card-to-Wire
CTW (Card-to-Wire) fan module connector comes with a flexible design for card-to-wire power applications used in fan modules. It allows different wire gauges ranging from 28AWG - 22AWG. The connector provides a maximum current rating of 4A/pin.
Fiber Demarcation Box Gen 3 (FD3)
The FD3 offers a lightweight aluminum housing with enhancements to cable ports, tie-down brackets and seals, layered fiber routing, various connector port types, and increased capacity, as well as door lock options. Splice trays are configurable to accommodate discrete passive components, such as splitters and WDM filters, as well as High-Density optical modules.
Fiber Demarcation Enhanced Access Box (FDE)
The FDE enclosure has a low profile, side-by-side door design that provides an ideal environment for splicing and patching in indoor wall-mount applications. An integrated access door on the customer side of the enclosure provides a generous opening for a cleaning tool to reach the optical connectors, resulting in a more craft-friendly design.
Fiber Optic Fanout Cable
Fanout cables are used for fixed cabling between network cabinets, mainly for breakout applications. System-oriented connector combinations make them application-independent and suitable for all Ethernet and Fibre Channel applications. Usually, 8-fold, 12-fold and 24-fold fanout cable assembled with MPO connectors one side and any common connector type on the other side could be provided.
Fiber Optic Splice Module Twin with Angled Cable Strain Relief
The splice module is designed to fit the 3U subrack and is used to integrate unassembled cables into the network. Equipped with pre-assembled pigtails and a splice cassette it offers an uncomplicated possibility for cable installation. With the angled cable support the fibers are guided perfectly without risk of breaking.
Fiber Optic Subrack, 19", 3U
The subrack is suitable for accommodating up to 12x7TE or 16x5TE modules. Due to the modular design, the system is well scalable, and mixed configurations, as well as extensions, can be easily realized. Rear-mountable trunk head holders provide space for the safe and quick installation of incoming cables.
Fiber Splice Box (FSB)
The FSB series of indoor wall mount enclosures are designed for centralized splice-only applications. These boxes are well suited as optical cable splice collection points for DAS (Distribution Antenna Systems), MTU (Multi-Tenant Unit), commercial business applications, and MDU (Multi-Dwelling Unit) residential fiber network applications.
Fixed Length Cable Assemblies
Amphenol RF offers a full line of pre-assembled, fixed-length cable assemblies. Fixed length assemblies are offered in all of our most popular connector series and are available in over 1400 standard configurations and lengths.
FlexTrax Cable Manager
FlexTrax combines the flexibility of split tubes with greater ease of access than slotted duct, significantly reducing the potential to pinch or bend a fiber compared to current vertical cable management methods. Users can purchase FlexTrax as needed for the application based on the estimated length required. Installation is simple and dynamic, allowing users to customize their solutions.
FLOS & FLOS+ Push-Pull or Break-Away Connectors
Amphenol LTW’s FLOS & FLOS+ Push-Pull or Break-Away Connectors are designed to offer a reliable connection for data, signal, and power transmissions in indoor and outdoor environments . These connectors feature a corrosion-resistant coating, excellent 360° shielding but also cost-effective price in the market【Quick Guide: https://amphenolltw.com/down.php?supp_download=96】
GbX®
Amphenol's GbX connector platform is a differential connector that provides flexible and low-cost design solutions for lower-speed applications while providing backward mate compatible upgrades to allow for up to 14 Gbps.
GFSH
The GFSH series is a mixed density power connector, ideal for applications that require blind mating in a small package. Multiple contact sizes facilitate the mixing of AC/DC input, signal and DC distributed output in a single package.
GG
The GG is a unique connector series for two reasons. First, it boasts the ability to carry the most power in a single package. Second, it is a modular connector with a fixed envelope. GG connector is an extreme power connector capable of up to 200 amps per contact.
GIG-Array®
Amphenol's GIG-Array® connectors are designed to meet the needs of applications up to 10Gb/s requiring up to 296 signal pins per connector. Amphenol as a BGA connector innovator assures expertise and reliability in the GIG-Array® BGA design with a combination of multiple stack heights (15mm to 40mm) and sizes (104 signals to 296 signals) utilizing a 100Ω differential matched impedance design.
GMT Fuses
Ideal for power distribution to LEDs on connectivity panels, lower amperage network elements, and other traditional equipment, GMT fuses provide fast-acting DC power circuit protection up to 20A.
Guided M8 Metric Circular Connectors
Amphenol LTW's waterproof Guided M8 connectors are designed with unique alignment keys saving the risk of damaged contacts and developed with comprehensive product configurations following IEC standard, delivering secure & reliable data/power transmission for industrial harsh applications.
HCI® High Power Connector
The HCI® High Power backplane/midplane connector series addresses applications demanding additional power at the interface between a daughter card and a backplane or midplane in chassis-based equipment platforms. HCI High Power modules are rated for up to 113A per contact without exceeding a 30°C temperature rise in still air.
HCSO-1W Open Loop Current Sensor
The HCSO-1W sensor simplifies current measurement (AC/DC) for batteries, chargers & motors. It clamps directly on cables, reducing installation steps & errors. Based on Hall effect tech, it offers accurate readings & various current ranges. Easy to install & calibrate, making it cost-effective for manufacturers.