With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's UltraPort™ QSFP+ interconnect system comprises a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which allows more board real estate and cost-optimized solutions. The UltraPort™ QSFP+ connector supports next-generation 100G+ applications and transmits up to 28 Gb/s per channel.
Amphenol's UltraPort™ SFP+ interconnect system comprises of a 20-position hot-swappable I/O connector enclosed in a metal cage mounted to a host PCB. It supports 28Gb/s applications with backward compatibility for next-generation Ethernet and Fibre Channel applications. UltraPort™ SFP+ connector shares the same unique mating interface and EMI cage dimensions as the SFP+ form factor.
FCI Basics USB 2.0 connector delivers a data rate of up to 480Mb/s. The Universal Serial Bus interface is ideal for use in connecting removable storage devices into automotive multimedia systems but extends its functionality across a variety of domains in consumer, datacom, and industrial applications.
FCI Basics USB 3.0 connector delivers a data rate of up to 5Gb/s thanks to the SuperSpeed transfer mode. As a third major revision of the USB standard, it is backward compatible with USB 2.0 devices and cables. USB 3.0 is available in vertical through hole, right angle through-hole, and upright through-hole positions.
FCI Basics USB 3.1 Gen 1 SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB, as well as improved power efficiency. Standard form-factor plug and receptacle performs up to 5Gbps and has "Sync-N-Go" technology that minimizes user wait-time. SuperSpeed USB is backward compatible with USB 2.0.
USB 4 connectors compatible with Thunderbolt 4 interface combines power charging, tunneling USB, PCIe® data transfer, and DP video and audio capability in a single Type C connector. With a power rating of up to 100W, these connectors have a high-speed data transmission rate of up to 40Gb/s.
USB Type C connectors are expected to be widely used as a next-generation interface. They support a variety of protocols such as USB2.0/3.0/3.1 and meet Superspeed communication 10Gb/s, 5A, and 20V power supply. The usability of the USB 3.1 Type C connector is enhanced also by its low profile and reversible product design. It is ideal for emerging product designs.
USB Type C standard receptacles provide multifunction single cable solutions for data, power, audio, and video. The small form factor made this interconnection a unquestioned technology across devices. The reversible design enables quick and easy connections, no matter which way it is inserted. 16-pin Type-C is a more economical solution to support 20V/5A 100W power charge & speed up to 480Mb/s.
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application.
VHDM-HSD™ is a shielded, high-density, high-speed press-fit connector system optimized for differential pair architectures. The flexible, modular design of the product allows for the differential performance of our VHDM-HSD™ connector to be combined on the same rear organizer as the VHDM® connector which is a single-ended solution.
Amphenol's Waterproof Micro USB 2.0 comes with full shielding that protects against Electromagnetic Interference (EMI), Radio-Frequency Interference (RFI), and Electromagnetic Discharge (ESD). The USB connector supports fast charging with 1.8A power contacts and is capable to support up to 3A for customized needs. These halogen-free connectors meet IPX4 industry ratings.
SCALABLE, SUPERSPEED CONNECTOR SYSTEM
Waterproof USB Type C with IPX8 performance supports a variety of protocols such as USB 2.0, USB 3.2 Gen 1, USB 3.2 Gen 2 and meets high-speed communication and power delivery (20V, 5A). The usability of Waterproof Type C is with strong IP performance and unique IP technology to ensure each part meets the high quality of waterproof performance.
WaveTrax®, the Amphenol Network Solutions fiber raceway system, is designed to help engineers deliver reliable fiber optic network performance. Reduce your cost of ownership with the full line of WaveTrax products, including troughs, elbows, cross and T sections, off-ramps, and articulating links - easily installed so you are up and running quickly!
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS
X2's upgraded platform maintains backward mating interface compatibility with existing XCede® products while offering new backplane configurations. Mid-plane-based orthogonal solutions are available for 6-Pair along with the others, supporting both 85Ω and 100Ω to meet a wide variety of application needs, including Ethernet and PCI.
The XCede® I/O interconnect system is comprised of a 32-position, variable pitch connector built for use in high-speed serial applications. Each port offers 4 channels to increase port density which contributes to more board real estate and immense cost savings. The XCede® I/O connector supports next-generation 100G+ applications and transmits up to 25 Gbps/serial-lane.
DESIGNED TO ACHIEVE 32G DATA RATE REQUIREMENTS
XCede Plus leverages the same core technologies as XCede with improved signal integrity performance while maintaining backward mating interface compatibility with existing XCede products.
ENABLING FUTURE DATA RATES
While maintaining the same mating interfaces, this connector design provides designers with readily available 85Ω and 100Ω solutions to meet a wide variety of application needs, including Ethernet and PCI.
XCede® HD backplane connector achieves high performance (up to 20 Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD connector meets the requirements of high-density architectures with a 35% increase in density as compared to standard XCede®.
DESIGNED TO ACHIEVE 56G DATA RATE REQUIREMENTS WITH HIGHER DENSITY
While maintaining the same mating interfaces with XCede® HD and XCede® HD Plus, this connector provides developers with a readily available robust solution for tighter card pitches and chassis designs where space requirements and density are critical.
The XCede® HD Plus backplane connector achieves high performance (up to 28+ Gb/s) in a Hard Metric form factor. Offering a linear density of up to 84 differential pairs per inch (33 differential pairs per centimeter), the XCede® HD Plus connector meets the high-density needs of today's challenging architectures.