With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
FCI Basics Mini USB 2.0 connector delivers a data transfer rate of up to 480Mb/s. The connector takes up only about 1/8 of the space of a standard USB Type B interface, and has five circuits, with one circuit reserved for future use in host identification between devices. Amphenol offers customized designs of the Type B connector to suit various customer requirements.
FCI Basics Modular Jacks include single and multi-port solutions that are widely used in Telecom, Data, Networking, and Home Entertainment markets for various applications. Modular Jacks Cat 3 supports the transmission of 16Mbps signals targeted to phone, modem, POS terminal machines and Cat 5 supports the transmission of 100Mbps signals targeted to switch, router, hub, etc.
Amphenol's NeXLev® is an established and proven high-density parallel board-to-board connector solution to meet current bandwidth demands in many mezzanine applications. NeXLev delivers a robust, market-proven connector in a small footprint. NeXLev connectors contain either 10, 20, or 30 wafers, with each wafer containing 10 real signal contacts. NeXLev features data rates up to 12.5Gb/s.
Non-magnetic coaxial connectors are used to carry 50 ohm RF signals within the magnetic field of MRI equipment where a high signal-to-noise ratio (SNR) is required.
The nrgBDFB-XLW 1000A Battery Distribution Fuse Bay includes up to eight panels per bay with each panel supporting a single feed with a maximum input rating of 1000A. Each panel contains 20 circuit positions for either bullet-style breakers or TFD fuse holders and features -48V operating voltage to fit in legacy and next-generation network applications with advanced circuit-level monitoring.
N-Type connectors are designed to satisfy the need for a durable, weatherproof, medium-size RF connector with consistent performance through 11 GHz. Our N-Type connectors feature threaded coupling mechanisms and are fully interchangeable with N-Type connectors made to the MIL-C-39012 specification. These connectors are used in all systems where excellent RF and mechanical performance is critical.
G14 Series OCuLink connectors are internal and external Small Form Factor PCIe connectors and cables optimized for the client and mobile market segments, while suitable for various datacom, consumer, and industrial applications. The OCulink standard, which is 85Ω version, accommodates SAS 4.0 (24Gb/s) and PCIe 4.0 (16Gb/s) signaling needs and enables optical and copper technology to coexist.
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
200G / 400G SOLUTIONS
Amphenol's leading the industry in OSFP cable development. OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with both 25G/ lane channel NRZ and 50G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G and 400G per cable assembly.
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
The Compact Power connector series was developed with the PCI Industrial Computer Manufacturers Group (PICMG) as the power interface for plug-in power supplies or other chassis mount applications. It delivers high current through a small package and three levels of sequential mating.
Amphenol introduces the next-generation OverPass™ solution - Mini Cool Edge IO. The 0.60mm pitch connector comes with a slim form factor design, capable of transmitting high-speed signals up to 64G PAM4/PCIe® Gen 6 and allowing much greater signal path lengths while maintaining SI performance when compared to conventional PCB routing methods.
Amphenol introduces the next-generation OverPass™ solution: the Mini Cool Edge IO. This connector features a 0.60mm pitch and a slim form factor design, and is capable of transmitting high-speed signals of up to 128G PAM4/PCIe® Gen 7. It allows for significantly longer signal path lengths while maintaining superior signal integrity (SI) performance compared to traditional PCB routing methods.
Amphenol's PCIe® M.2 Gen 3 and Gen 4 connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® 3.0, USB 3.0, and SATA 3.0 applications, making it suitable for tablets, laptops, and low-profile storage and server applications.
Amphenol's PCIe® M.2 Gen 5 Connectors provide 67 contacts on 0.50mm pitch. It occupies less board space, offers more connector height options, and supports higher data rates compared to PCIe® Mini Card connector. It is designed for PCIe® Gen 5, making it suitable for tablets, laptops, and low-profile storage and server applications.
PCIe® Gen 4 and Gen 5 connectors outperform industry-standard PCIe® 4.0 and 5.0 (Proposed) requiring higher speed performance. The optimized series supports backward mating and is footprint compatible with PCIe 3/2/1. Amphenol's expansive range of vertical PCIe® Gen 4 and Gen 5 connectors will include options for SMT, through-hole solder, press-fit (PF), and straddle mount terminations.
The PCS Series are versatile, high-current, mixed density connectors with low contact resistance. It remains an industry-leading power connector in the market. Options for one, two, or three contact rows provide flexibility in selection and high conductivity contacts are available to maximize current density. Other options - sequential mating, integrated locking latch, and press-fit contacts.
Perma-Tap® power cable assembly saves space and reduces cost. The wires can be cut, stripped, and terminated to customer-specific lengths. The connector is press-fit to a PCB to provide a compact and secure power delivery solution. A permanent connection between a cable and a PCB with only one connector.