IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Automotive Grade PCI Express® Gen 5 Card Edge Connectors
EXTEND DIFFERENTIAL SIGNALING TO 32GT/S FOR NEXT-GENERATION SYSTEMS
PCIe® Gen 5 straddle mount connectors outperform the industry standards with higher speed along with complying to USCAR. The optimized series supports backwards mating and is footprint compatible with PCIe® 4/3/2/1.
BarKlip® BK1000 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors
BarKlip® BK100 I/O
Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition
BarKlip® BK1200 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.
BarKlip® BK150 Connector
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance.
BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® BK450 Connector
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact beams ensuring high current carrying capability and low contact resistance.
BarKlip® BK600 I/O
OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
BarKlip® XP200 Connector
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP200 connector provides a convenient method of distributing up to 200A directly to a 3.00mm mating busbar. The connector system features an integrated guide system that provides protection to the contacts during mating and un-mating.