With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
COMPLIES TO NEW INTERFACE STANDARD JEDEC SO-023D AND JEDEC SO-023
The new DDR5 connector with only 287 terminals addresses the resonance from the floating RFU pin 220 which resulted in a margin delta. Both RDIMM and UDIMM versions of the new DDR5 socket are tooled and available.
LATEST MEMORY FORM FACTOR FOR AI SERVERS
The LP DDR5 Small Outline Compression Attached Memory Module (SOCAMM) is designed specifically for server and data center applications. It utilizes a compression connector interface and offers all the advantages of LPCAMM DDR5 in a more optimized form factor, making it ideal for high-performance computing (HPC) and artificial intelligence (AI) servers.
HIGH SPEED HIGH DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector are available in various height options.
112G DOUBLE ENDED HIGH PERFORMANCE CABLING INTERCONNECT
DensiLink® OverPass™ products remove high speed signaling from the PCB and create a double ended, high performance cabling interconnect. These cables support 56G and 112G signaling in hardware system designs as well as technology for future 224G signaling systems.
Ideal for miniature applications, the DensiMate™ connector system provides highly reliable performance, which meets industrial automation and IT/Datacom challenges.
With wire gauge range from 30AWG-26AWG, these connectors are available in double row, vertical SMT, and right angle SMT configurations. DensiMate™ comes with an active latch to provide enhanced contact reliability.
HIGH DENSITY / HIGH SPEED / DUAL-BEAM CONTACT / USCAR-2 COMPLIANT BOARD-TO-BOARD CONNECTOR
Amphenol FCI Basics DensiStak™ connector is designed with its 11 rows 1000+ high density pin count, high speed up to PCIe® Gen 4 with 16Gb/s. Reliable dual-beam contact system, compact size with pitch 0.80mm x 1.25mm, USCAR-2 compliant, and optional shields
Amphenol LTW DVI Connectors feature a 1.5A current rating, a ≤20mΩ contact resistance, and a ≥1000MΩ @ 500VDC insulation resistance rating. The DVI has a copper alloy, gold-plated contacts and steel, nickel-plated shell. It offers the durability of 100 cycles and an IP68 rating. Operate in the -20°C to +80°C temperature range【Quick Guide: https://amphenolltw.com/down.php?supp_download=94】
DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability.
The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
FCI Basics DIN IDC cable connectors are available in 4 connector sizes as 96, 42, 21 and 9 positions. Available in wire sizes 30AWG to 24AWG, their unique insulation displacement design grants the lowest installed cost for users. Standard accessories are also offered to make up a fully modular system. This robust and standardized solution is widely used in Industrial and Instrumentation markets.