With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol LTW D-Sub connectors are developed in 5 different standard housing fit for standard/high-density pin contact & sealed for ingress protection up to IP68. The features are connectors interface meet ANSI / B93.55M-1981, Idiot-proof alignment key design【Quick Guide: https://amphenolltw.com/down.php?supp_download=93】
DSUB CONNECTORS FOR CUSTOM APPLICATIONS
Amphenol has proven capability to work with customers and develop special product extensions to meet their custom applications. This can be to meet special polarization requirements, fitment to their special panel cabinets, extra standoff to meet the height requirements, assemblies for cable application, etc.
Amphenol ICC's D-Subminiature product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
FCI Basics D-Sub High-Density Board-Mount Connectors, based on the compact-D form factor, complete your board and system designs by providing high-density and high-speed interfaces. The high-speed, power, assembly, and mechanical packaging expertise, aids in getting the signals out of the box at optimal cost and performance, while accommodating up to 78 positions in standard shell sizes.
Amphenol ICC's D-Subminiature high-density product line offers a wide range of termination options for board and cable ends, bringing down the overall cost of cable assembly and connectors significantly. The terminations include Straight, Right Angle, SMT, Press Fit, and Slim Sunk for board side, and Solder Cup, Crimping, IDC Ribbon, Solderless Wire Wrap, and Screw Termination for cable side.
FCI Basics HDMI™ (High-Definition Multimedia Interface) is smaller, user-friendly version of DVI for high definition audio-video transfer in consumer entertainment devices. Backward-compatible with DVI, the connector system supports uncompressed video and audio data transmission at 5Gb/s along a single cable.
Amphenol ICC's TW Hybrid D-Subminiature connectors offer a wide range of termination options for board and cable ends, bringing up an overall solution of cable and PCB assemblies. The terminations include Straight and Right Angle for the board side, and Solder Cup and Crimping (for power pin only) for the cable side. Each termination variant has both socket and plug connectors.
FCI Basics D-Sub MicroTCA Connectors are power module I/O interconnects for 48V applications designed in accordance with TCA specifications. The concept is based on the single-shell Delta D design, and power contacts handle up to 24A. PCB connectors are proposed in traditional Solder-to-board and Pin-in-Paste versions for optimized applied cost.
FCI Basics D-Sub Pin-in-Paste Connectors are now available in Pin-in-Paste (Through Hole Reflow) versions in standard and compact form factors. Pin-in-Paste technology (PiP) allows the use of Through Hole products in SMT manufacturing processes. The connectors use high-temperature thermoplastic that can withstand reflow soldering temperatures up to 260°C to facilitate PiP soldering.