IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Micro USB 3.0 Connector
Micro USB 3.0 (USB 3.1 Gen 1) SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB as well as optimized power efficiency. This smaller version of the Mini USB 2.0 connector performs up to 5Gb/s and supports USB On The Go (OTG). It has full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
MIL-DTL-24308 Connectors
Positronic M24308 connectors are an important designation for ensuring quality, high reliability. It meets and often exceeds, the requirements under the M24308 specification. Our connectors have gone through rigorous testing to certify quality and performance. You can find them used in communications, information technology, aircraft, missiles, and related ground support systems and satellites.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
Millipacs® Cable Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® cable connectors in standard 5+2 row configuration, transversal mounting on pin array
Millipacs® Compact PCI
FCI Basics Compact PCI Millipacs® 2mm hard metric (HM) connectors are designed in accordance with IEC 61076-4-101 and fulfill the interconnection requirement of the Compact PCI bus architecture. Millipacs® range currently supports 10Gb/s and 25Gb/s data rate with backward mating compatibility to the standard 2mm HM IEC 61076-4-101 connectors.
Millipacs® High Speed Right Angle Receptacle
FCI Basics offers Millipacs® speed (HS) right-angle receptacle suitable for data rate up to 25Gbps and with mating compatibility to the IEC 61076-4-101 series 2mm hard metric (HM) backplane header. The Millipacs HS receptacle and standard 2mm HM vertical header mating combination deliver low cross talk performance at higher frequencies.
Millipacs® High Temperature Backplane Connectors
Amphenol's Millipacs® is a 2.00mm grid Interconnection system in a hard metric configuration designed in accordance with IEC 917, IEC 61076-4-101, Telecordia GR-1217-CORE standards and fulfills Compact PCI bus architecture. Millipacs® high-temperature series addresses the market requirements for Backplane connectors compatible with higher operating temperature applications.
Millipacs® Mezzanine
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.