IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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OSFP
Amphenol's OSFP interconnect system has 60 contacts per port, with a 0.6mm contact pitch and 8 high-speed channels. The OSFP footprint is optimized for signal integrity performance and built for use in high-speed serial applications. The connector is enhanced for low crosstalk and has ground commoning for resonance dampening. It is also designed for 1U applications.
OSFP Copper Cable Assemblies 200G/400G
200G / 400G SOLUTIONS
Amphenol's leading the industry in OSFP cable development. OSFP (Octal Small Form Factor Pluggable) cable assemblies are compatible with both 25G/ lane channel NRZ and 50G/lane channel PAM4 signaling protocols that allow the cables to deliver aggregate bandwidths of 200G and 400G per cable assembly.
OSFP Loopback 200G/400G
OSFP (Octal SFP) Loopback Modules are part of our OSFP I/O system product family that includes copper cables, connectors, and AOC's. These OSFP loopback cable assemblies are offered in four configurations - Passive Electrical, Passive Thermal, Active Electrical, Active Thermal. All loopback cable assemblies support 200G (8 lanes @ 25G NRZ) or 400G (8 lanes @ 50G PAM4) signaling transmission.
Outside Plant Passives (OSP)
Optical passives ranging from 4 to 40 channel counts. They can be configured with optional express, upgrade, and test ports to support a variety of applications. The packaging comes in two forms, the HiDT (channel counts 8 or less) and the OSP AOM (channel counts 12 and higher), both providing stable optical performance across a wide operating temperature range for OSP deployment.
OverPass™ Cable System
Amphenol's OverPass™ cable system offers a broad range of capabilities that allow our customers to efficiently transmit high-speed signals from near an ASIC to anywhere in their system.
OverPass™ QSFP+
Amphenol's OverPass™ QSFP+ interconnect system is comprised of a 38-position, 0.8mm pitch connector built for use in high-speed serial applications. The OverPass™ QSFP+ connector supports next-generation 200G+ applications and transmits up to 56Gb/s PAM4 per channel. It features a stamped and formed contact design providing improved mechanical durability.
Paladin® 112Gb/s Backplane Connector
AMPHENOL'S GAME-CHANGING 112Gb/s BACKPLANE INTERCONNECT TECHNOLOGY.
Paladin's® revolutionary architecture sets the benchmark for signal integrity performance in backplane interconnects. Exhibiting smooth linear transmission beyond 40GHz, the lowest crosstalk in the market, and consistent SI performance over its entire mating range.
Paladin® Cabled Backplane
Cable Backplane Systems is part of Amphenol's Highspeed Backplane Product business, dedicated to developing and manufacturing cabled backplane solutions for next-generation system architectures. Our customers are leading providers of data center switches and routers, enterprise servers, and high-performance computers.
Paladin® HD 112G Backplane Interconnect System
The Paladin® HD interconnect system provides world-class bandwidth through industry-leading density at 112GB/s performance, supporting up to 144 differential pairs orthogonally within 1U spacing. Paladin HD utilizes a balanced pair structure; built with individually assembled and discretely shielded differential pairs which have a revolutionary hybrid board attachment for maximized density.
PC/104 Connector
FCI Basics PC/104 is an embedded computer standard defined by its compact footprint. The specification is based on the 104 signal contacts on the two bus connectors (64 pins on P1, plus 40 pins on P2). PC/104 is a modular, ruggedized version of the PC 2.54mm pitch. Instead of using a backplane, PC/104 modules mate together via stackable ISA, PCI, and PCIe® bus connectors.