IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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QSFP+ Copper Cable Assemblies 40G
QSFP (Quad Small Form Factor Pluggable) cable assemblies are designed to meet emerging data center and high performance computing application needs for high-density cabling interconnect systems capable of delivering aggregate data bandwidths of 40Gb/s. The QSFP cables support bandwidth transmission requirements as defined by IEEE802.3ba (40Gb/s) and Infiniband QDR (4x10Gb/s per channel).
QSFP+ Loopback Modules
Amphenol's QSFP+ Loopback Modules are part of our comprehensive QSFP+ product family which includes copper cables and connectors. These QSFP+ loopbacks are offered as passive electrical with multiple attenuations and thermal consumption levels. QSFP+ loopbacks are designed to support data speeds up to 40G (4 lanes at 10G).
QSFP+ to 4x SFP+ Copper Splitter Cable Assemblies 40G
40G QSFP+ to 4x SFP+ splitter cable assemblies are designed to meet emerging data center and high performance computing application needs for a high-density cabling interconnect system capable of delivering aggregate data bandwidths of 40Gb/s at QSFP end and 10G at SFP end. This interconnect system is fully compliant with existing industry standard specifications such as the QSFP MSA and SFP MSA.
QSFP to 2x QSFP Copper Splitter Cable Assemblies 100G/200G
The QSFP28 to 2xQSFP50 Y cable assembly supports the bandwidth transmission requirements as defined by 100 Gigabit-Ethernet (IEEE 802.3bj) and 25 Gigabit-Ethernet (IEEE 802.3by). Amphenol's QSFP28 100Gb interconnect system complies with industrial standards SFF-8665 / SFF-8402, GR-253-CORE, Gigabit-Ethernet (IEEE 802.3bj and IEEE 802.3by), FC-PI-5, and FC-PI-6.
QSFP to 4x SFP Copper Splitter Cable Assemblies 100G/200G
Amphenol's QSFP28 - 4XSFP28 Splitter cable assembly is designed to meet data center, networking and high performance computing application needs, for high-density cabling interconnect system, capable of 28Gb/s per channel transmission rates. It is designed to meet the requirements of Small Form Factor industry-standard SFF-8665 /SFF-8402.
Quickie® IDC Cable-to-Board Connector System
FCI Basics Quickie® is a complete solution for flat cable-to-board connections using 2.54mm pitch IDC technology. The highly durable and cost-saving connectors come with specialized features in polarization, plating, and structure. Headers are low profile and come in shrouded versions with or without eject latches. Receptacles have strain relief covers for precise alignment.
RADSOK® PGY™
This series, utilizing RADSOK® socket contact technology for right angle power-to-board application, compact footprint, metal square, press-fit high power connector. With five sizes ranging from 2.4mm, 3.0mm, 3.6mm, 4.8mm, and 5.7mm contact sizes and up to 120 amps possible with a standard operating temperature from -40°C to +125°C.
RADSOK® PowerBlok™
This series, utilizing RADSOK® socket contact technology for power-to-board backplane application, compact footprint, thermoplastic square, press-fit high power connector. With three sizes ranging from 2.4mm, 3.0mm, and 3.6mm contact sizes and up to 70 amps possible with a standard operating temperature from -40°C to +125°C.
RADSOK® PowerBlok™ WTB
This series, utilizing RADSOK® socket contact technology for power-to-board two-point contact terminals application, low profile compact footprint, metal square, press-fit high power connector. With two sizes, 2.4mm and 3.6mm contacts and up to 70 amps possible with a standard operating temperature from -40°C to +105°C.
RADSOK® SMT RADSERT™
This series, utilizing RADSOK® socket contact technology for board-to-board mezzanine application, compact footprint, metal circular, press-fit high power connector. With five sizes ranging from 2.4mm, 3.0mm, 3.6mm, 4.8mm, and 6.0mm contact sizes and up to 120 amps possible with a standard operating temperature from -40°C to +125°C.