IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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Board-to-Board 85Ω (0.80mm pitch)
Amphenol high-speed BTB connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights & pin counts is offered to provide maximum design flexibility. With superior signal integrity (SI) performance, this 0.80mm pitch connector design is suitable for high-performance applications & meets PCIe Gen 3, 8GT/s.
Board-to-Board Connectors (0.50mm pitch)
0.50MM PITCH, 85Ω BOARD-TO-BOARD SOLUTION
Amphenol high-speed board-to-board connectors provide high contact force reliability ensuring strong connectivity, forced insertions, and removals. A broad range of stacking heights and pin counts are offered to provide maximum design flexibility. Amphenol 0.50mm pitch connector design is suitable for high-performance applications.
Board-to-Board Connectors - B401/B402 Series (0.80mm pitch)
HIGH DENSITY VERTICAL BOARD-TO-BOARD CONNECTORS
Amphenol's B401/B402 series is 0.80mm pitch board-to-board connectors designed for high-density applications. They support stack heights up to 10mm and 100 positions. These connectors feature surface mount terminations and are available in a comprehensive range to satisfy different customer requirements.
Board-to-Board RF Connectors
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.
C2X Fiber Distribution Panel
The C2X chassis' supports multiple patch, patch/splice, and pre-terminated fiber configurations available in either bulkhead or cassette solutions. C2X tray-based option accepts C2 AOMs (Advanced Optical Modules) for patch, patch/splice, as well as splitters, MPO breakouts, and WDMs. C2X is available in 1, 2, 3, or 4RU and supports vast fiber counts.
Ceramic Injection Molding
Amphenol's CIM process uses ceramic zirconium to provide a scratch and wear-resistant surface to components such as mobile phone camera decoration and side keys. The CIM material provides additional durability and strength to your products. We have applied our Metal Injection Molding (MIM) experience of large volume runs to CIM to create a hi-tech material process.
CFP 100G Transceivers
Amphenol 100G CFP/CFP2/CFP4 series optical transceivers support from 10km to 40km reach, adopt LC interface, compatible with IEEE802.3ba, MSA, and other standards. It has the characteristics of low power consumption, dual rate, and high speed. It is widely applied in large data centers, telecom, and other environments.
CFP2
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
CFP4
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
CFP8
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.