With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
The ComboLock® Wire-to-Board connector's compact design for the limited space application needs carries power and signal requirements. The connector system has hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature. The connector has a nominal current carrying capacity of 10A/pin max for power and 1.5A/pin max for signal. Power wire sizes from 26 to 18AWG
ComboStak® and PowerStak® Board-to-Board Connectors
ComboStak® and PowerStak® are compact, hybrid (signal and power), and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power-only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
COMPRESSION-TYPE SURFACE MOUNT CONNECTORS FOR HDD (HARD DISK DRIVE)
Compression connectors are customizable single-piece solutions that facilitate read & write functions in traditional low-cost bulk-storage HDDs and helium HDDs.
Amphenol ICC's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards. Its unique design with an audible 'click' sound enhances the security and ease of use. It has good mating performance, rugged design, and is under 70 positions.