IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
Visit our global sites to learn more: Amphenol Communications Solutions
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 2.0 Connector
FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their high-speed signal stability. This smaller version of the Mini USB 2.0 connector while complying with the physical, electrical, and environmental standards of the micro form factor, supports 1.8A and 3A currents for fast charging.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.
MIL-DTL-24308 Connectors
Positronic M24308 connectors are an important designation for ensuring quality, high reliability. It meets and often exceeds, the requirements under the M24308 specification. Our connectors have gone through rigorous testing to certify quality and performance. You can find them used in communications, information technology, aircraft, missiles, and related ground support systems and satellites.
MIL-HD2 Next-Gen SOSA™/VITA 91 Aligned Connector Series
Developed in alignment with The Open Group Sensor Open Systems Architecture™ (SOSA) technical standard, MIL-HD2 provides developers with a readily available, robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical.
Millipacs® Accessories
FCI Basics offers a wide range of accessories compatible with 2mm Hard Metric (HM) series Millipacs® connectors. Millipacs® series accessories increase the usability and flexibility of the connector systems. They include shrouds, guiding systems, coding keys, power contacts.
Millipacs® Mezzanine
FCI Basics Millipacs® Vertical header and receptacle mating combination offer a range of stack heights between 15mm and 25mm for low speed and 10Gb/s mezzanine applications. Millipacs® connector interfaces provide high reliability and robustness making them suitable for the most demanding applications in aerospace, industrial, and also traditional telecom segments.
Millipacs® Power & Hybrid Connectors
FCI Basics Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4- 101. FCI Basics offers Millipacs® Hard Metric Hybrid connectors in standard signal modules of type L, M, N, D, E with signal pins, integrated guide pins, and power/coax contacts.
Millipacs® R/A Headers
Millipacs® is a 2.00mm modular board to board or cable to board Interconnection system in Hardmetric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. Millipacs® Right angle headers features hot plugging application with different mating sequences and are suitable for both Coplanar and Backplane mating.
Millipacs® R/A Receptacles
FCI Basics Millipacs® is a 2.00mm modular, BTB & CTB Interconnection System in Hard Metric (HM) configuration designed in accordance with IEC 917, IEC 61076- 4-101, and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher speed, shielding, High operating temperature (175°C), higher current rating (3A/pin), and low smoke low halogen compatibility.
Millipacs® Vertical Headers
FCI Basics Millipacs® is a 2.00mm modular BTB or CTB Interconnection system in a hard metric configuration designed in accordance with IEC 917 and IEC 61076-4-101 and Telcordia GR-1217-CORE standards. These connectors are enriched with additional options for higher operating temperature (175°C), current rating (3A+/pin), low smoke low halogen (LSLH) materials, touch-proof / dust-free caps.