IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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QN Connectors
Amphenol RF’s QN connector is a quick disconnect version of the N-Type connector with similar internal construction, which enables fast and easy matings with minimum space requirements.
QSFP Cable Assemblies
Amphenol's QSFP copper cable assemblies are designed to meet data center, networking and high-performance computing application needs for high density cabling interconnect systems capable of data rates from 10G/Lane to 112G/Lane transmission rates.
QSFP DD
Amphenol's QSFP DD interconnect system is comprised of a 76 position, 0.8mm pitch connector built for use in high speed serial applications. Each port supports up to 400Gb/s in aggregate over an 8 x 50Gb/s electrical interface. The cage and connector design provides backwards compatibility to QSFP28 modules which can be inserted into a QSFP DD port and connected to 4 of the 8 electrical channels.
QSFP DD Cable Assemblies
200G / 400G / 800G SOLUTIONS
Amphenol's QSFP DD (Double Density) copper cable assemblies double the number of channels from 4 to 8 lanes when compared to the existing QSFP cabling systems, enabling more bandwidth within the same mechanical envelope.
QSFP DD OverPass™ Assemblies
56G AND 112G DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
QSFP DD OverPass™ products remove high speed signaling from the PCB and create an eight channel direct lower loss interconnection between the ASIC site and the external QSFP DD IO port by overpassing the PCB. This helps to enable 56G and 112G hardware system designs and a technology for future 224G systems.
QSFP OverPass™ Assemblies
28G AND 56G DIRECT HIGH SPEED CONNECTION FROM CHIP SITE TO IO PORT
QSFP OverPass™ products remove the high speed signaling from the PCB and create a four channel direct lower loss interconnection from the ASIC site to the external IO port by overpassing the PCB. This helps to enable 28G and 56G hardware system designs.
QSFP+ Cable Assemblies
Amphenol's QSFP (Quad Small Form-factor Pluggable) connector, cage and cable assemblies are designed to meet emerging data center and high performance computing application needs for a high density cabling interconnect system capable of delivering aggregate data bandwidths of 40Gb/s & 56 Gb/s & 112 Gb/s.
Quickie® IDC Cable-to-Board Connector System
FCI Basics Quickie® is a complete solution for flat cable-to-board connections using 2.54mm pitch IDC technology. The highly durable and cost-saving connectors come with specialized features in polarization, plating, and structure. Headers are low profile and come in shrouded versions with or without eject latches. Receptacles have strain relief covers for precise alignment.
(Radio Frequency Connectors) RF Connectors
Amphenol LTW's RF connector (radio frequency connector) is an electrical connector designed to work at radio frequencies in the multi-megahertz range. RF connectors are typically used with coaxial cables and are designed to maintain the shielding that the coaxial design offers. Available in SMA【Quick guide: https://amphenolltw.com/down.php?supp_download=105】
RADSOK® PGY™
This series, utilizing RADSOK® socket contact technology for right angle power-to-board application, compact footprint, metal square, press-fit high power connector. With five sizes ranging from 2.4mm, 3.0mm, 3.6mm, 4.8mm, and 5.7mm contact sizes and up to 120 amps possible with a standard operating temperature from -40°C to +125°C.
RADSOK® PowerBlok™
This series, utilizing RADSOK® socket contact technology for power-to-board backplane application, compact footprint, thermoplastic square, press-fit high power connector. With three sizes ranging from 2.4mm, 3.0mm, and 3.6mm contact sizes and up to 70 amps possible with a standard operating temperature from -40°C to +125°C.