IT Datacom

With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.

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Product Advanced Optical Modules (AOMs)
Advanced Optical Modules (AOMs)
From a dedicated Base-8 architecture to a standard 12 or 24 fiber system, Amphenol Network Solutions' Advanced Optical Modules (AOMs) offer the complete solution. Our AOM portfolio is easily configurable and adaptable to create a solution that meets your network needs. Modules are deployed in the C2X or C2E chassis.

AdvancedTCA
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.

Product AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.

Product AgilLink™ 0.8mm Wire-to-Board
AgilLink™ 0.8mm Wire-to-Board
AgilLink™ 0.8mm wire-to-board connector is the most common solution for transferring low power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including, V/T SMT, and R/A SMT to meet various customer requirements. The compactness of the connectors allows for extensive usage in consumer applications.

Product AgilLink™ 1.0mm Wire-to-Board
AgilLink™ 1.0mm Wire-to-Board
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several

Product AgilLink™ 1.20mm Wire-to-Board Header
AgilLink™ 1.20mm Wire-to-Board Header
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...

Product AgilLink™ 1.25mm Wire-to-Board
AgilLink™ 1.25mm Wire-to-Board
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications

Product AgilLink™ 1.50mm Wire-to-Board Header
AgilLink™ 1.50mm Wire-to-Board Header
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...

Product AgilLink™ 2.00mm Wire-to-Board Header
AgilLink™ 2.00mm Wire-to-Board Header
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.

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