IT Datacom
With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
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50G SFP56 LR Transceivers
SUPPORTS 53.12Gb/s DATA RATE & LOW POWER
The module is compliant with IEEE 802.3 cd, SFF-8472 Rev 12.4, and compatible with SFF-8432 and applicable portions of SFF-8431 Rev. 4.1.
- Supports 53.125Gb/s data rate
- 1.8W maximum power consumption with established link
- Up to 10km on 9/125μm SMF
- Operating temperature range: -40°C to 85°C
- Electrically hot-pluggable
50G SFP56 SR Transceivers
SUPPORTS 53.125Gb/s DATA RATE & LOW POWER
The module is compatible with IEEE 802.3 cd 50G SR. Maximum link length of 70m on OM3 multimode fiber or 100m on OM4 multimode fiber.
- Low power - 1.5W
- Mature COB technology
- Outstanding BER and sensitivity
- Supports 53.125Gb/s data rate
- Electrically hot-pluggable
64G FC Transceivers
SUPPORTS 57.8GB/S DATA RATE & LOW POWER
The module is compatible with 64G FC-PI-7.
- Low power - 1.5W
- Mature COB technology
- Outstanding BER and sensitivity
- Supports 57.8Gb/s data rate
- Electrically hot-pluggable
800Gb/s OSFP Transceivers
DESIGNED FOR USE IN 800GB/S DATA RATE LINKS. COMPLIANT WITH OSFP MSA, IEEE802.3, OIFCMIS
Amphenol's 800G OSFP optical modules include 2xDR4(plus), 2xFR4(plus), 2xLR4, AOC, and AOC breakout series, which adopt LC or MPO optical ports and are compatible with IEEE802.3, OIF-CMIS and other standards. It is mainly used in 800G Ethernet applications and other environments.
800Gb/s QSFP-DD Transceivers
DESIGNED FOR USE IN 800GB/S DATA RATE LINKS. COMPLIANT WITH QSFP-DD MSA, IEEE802.3, OIF-CMIS
Amphenol's 800G QSFP-DD optical modules include 2xFR4(plus), 2xLR4, AOC, and AOC break-out series, which adopt LC or MPO optical ports and are compatible with IEEE802.3, OIF-CMIS, and other standards. It is mainly used in 800G Ethernet applications and other environments.
Advanced Optical Modules (AOMs)
From a dedicated Base-8 architecture to a standard 12 or 24 fiber system, Amphenol Network Solutions' Advanced Optical Modules (AOMs) offer the complete solution. Our AOM portfolio is easily configurable and adaptable to create a solution that meets your network needs. Modules are deployed in the C2X or C2E chassis.
AdvancedTCA
Dedicated interface between backplanes and boards capable of providing dual redundant power, system management and high voltage auxiliary circuits to each slot within the platform. The connector’s outstanding blind mating capability can be used to align the board during insertion.
AgilBrick™ 1.27mm Board-to-Board Header G802
AgilBrick™ 1.27mm Board-to-Board Header G802 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.00mm Board-to-Board Header G825
AgilBrick™ 2.00mm Board-to-Board Header G825 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilBrick™ 2.54mm Board-to-Board Header G800
AgilBrick™ 2.54mm Board-to-Board Header G800 Series offers a cost-effective solution with a flexible structure and 1 to 4 A current rating. These headers from Amphenol can be customized to meet various customer requirements. It comes in customizable pin length, including contact pin and solder tail, which makes it an ideal choice for several applications and specific designs.
AgilLink™ 0.8mm Wire-to-Board
AgilLink™ 0.8mm wire-to-board connector is the most common solution for transferring low power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including, V/T SMT, and R/A SMT to meet various customer requirements. The compactness of the connectors allows for extensive usage in consumer applications.
AgilLink™ 1.0mm Wire-to-Board
AgilLink™ 1.0mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including Single Row V/T SMT, R/A SMT and Dual Row V/T SMT, R/A SMT to meet various customer requirements. It comes in customizable for Low profile or latch feature, which makes it an ideal choice for several
AgilLink™ 1.20mm Wire-to-Board Header
AgilLink™ 1.20mm Wire-to-Board G823H series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol I offers a comprehensive range of these headers including V/T SMT and vertical and R/A right angle SMT to meet various customer requirements. It is offered in customizable for high current ratings, which makes it an ideal c...
AgilLink™ 1.25mm Wire-to-Board
AgilLink™ 1.25mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes in customizable for pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 1.50mm Wire-to-Board Header
AgilLink™ 1.50mm Wire-to-Board G886 series is the most common solution for transferring power and signal. This series can carry a maximum current rating of 2.5A. Amphenol offers a comprehensive range of these headers including, vertical and right-angle DIP, and vertical and right angle SMT, to meet various customer requirements. It comes with customizable pin length, latch, or location post...
AgilLink™ 2.00mm Wire-to-Board Header
AgilLink™ 2.00mm Wire-to-Board Header G823 Series is the most common solution for transferring power and signal. It can mate with both wire-to-board and board-to-board applications. This series can carry a maximum current rating of 4A. Amphenol offers a comprehensive range of these headers including, V/T DIP, V/T SMT, R/A DIP to meet various customer requirements.
AgilLink™ 2.50mm Wire-to-Board Header
AgilLink™ 2.50mm Wire-to-Board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 1.25A to3A. Amphenol offers a comprehensive range of these headers including, vertical DIP, right-angle DIP, vertical SMT, and right angle SMT to meet various customer requirements.
AgilLink™ 2.54mm Wire-to-Board
AgilLink™ 2.54mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 3A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length, latch or location post, which makes it an ideal choice for several applications
AgilLink™ 3.96mm Wire-to-Board
AgilLink™ 3.96mm wire-to-board is the most common solution for transferring power and signal. This series can carry a maximum current rating of 6A. Amphenol offers a comprehensive range of these headers including V/T DIP, V/T SMT, R/A DIP, R/A SMT to meet various customer requirements. It comes with customizable pin length which makes it an ideal choice for several applications and specific designs.
AirMax® Power Connectors
Hard Metric High Power connectors are a perfect complement to Amphenol's ExaMAX®, AirMax®, ZipLine®, and Millipacs® signal connectors. These power connectors mount alongside their signal counterparts and are used in applications where bulk current is delivered by backplane or midplane to power-consuming components on a mating daughter card.
AirMax VS2® High-Speed Backplane Connector
AirMax VS2® connectors provide a migration path from AirMax VS® for speeds up to 20Gb/s, providing a margin of safety for typical 802.3ap system performance with the flexibility of an open pin field design. The connectors leverage AirMax VS® and VSe® design features and technology to achieve improved signal integrity and mechanical attributes compared to AirMax VS® connectors.
AirMax VSe® High-Speed Backplane Connector
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE WITH ENHANCED PERFORMANCE
AirMax VSe® connectors address the industry needs for high bandwidth applications requiring a scalable migration path to 25Gb/s data rate. AirMax® technology delivers signal densities up to 63.5 differential pairs per inch when using a 5-pair connector system.
AirMax VS® 85Ohms High-Speed Backplane Connector
HIGH SPEED HARDMETRIC CONNECTOR FOR BACKPLANE SUPPORTING INTEL® QPI
AirMax VS® 85Ohms connectors are optimized to minimize impedance discontinuities and signal loss in 85Ohms channels. The connectors' mating interfaces also satisfy demands for backward compatibility to legacy 100 Ohms product interfaces ensuring a smooth transition to next-generation designs.
AirMax VS® Connectors for CompactPCI® Serial System
AirMax® high speed signal connectors meet the dimensional and electrical requirements described in CompactPCI® Serial (PICMG CPCI-S.0) specification. It moves CompactPCI® architecture to high speed serial interconnects to add greater support for serial point to point fabrics like PCI Express®, SATA, Ethernet and USB in the classic CompactPCI® form factor with mechanics fully compliant to IEC 1101.
AirMax VS® Coplanar High-Speed Backplane Connector
AirMax VS® coplanar connectors permit mating 2 boards in the same plane. This is very useful for many applications, one base card can mate to many IO cards to cost effectively offer different system IO options. ATCA systems, Zone 3 connectors directly connect front and rear cards, bypassing the backplane, effectively doubling the electronic capabilities of each slot within the system.
AirMax VS® High-Speed Backplane Connector
AirMax VS® connectors use innovative edge-coupling and air dielectric between adjacent conductors to deliver insertion loss and crosstalk. The AirMax VS® connectors address a broad range of system architectures, including backplane, mid-plane, coplanar, mid-plane orthogonal, cabled backplane, and mezzanine applications.
AirMax VS® Orthogonal High-Speed Backplane Connector
AirMax VS® Orthogonal mid-plane interface features two back-to-back AirMax VS® headers oriented at 90 degrees to each other. The headers connect 16 differential signal pairs through shared vias in the mid-plane, providing a direct, high-speed connection while eliminating traces on the mid-plane. The AirMax VS® Orthogonal mid-plane interconnects can support differential signaling at up to 20Gb/s.
AirMax VS® SBB High-Speed Backplane Connector
AirMax VS® high-speed signal connectors, guide modules, and power connectors meet the dimensional and electrical requirements for the Storage Bridge Bay Mid-plane Interface (SBBMI) to connect bridge/controller cards to the mid-plane in a drive enclosure. It comes with high-speed serial data rates that can scale from 2.5Gb/s to 12.5Gb/s without requiring the redesign of a basic platform.
AirMax VSX®
Amphenol's AirMax VSX® connectors are high speed, high density, 2.00mm pitch connectors that support 56Gb/s PAM4 performance. Innovative design reduces crosstalk and reaches excellent SI performance. AirMax VSX provides a migration path to 56Gb/s PAM4 with backward mating compatibility with traditional AirMax VS®, AirMax VS2® and AirMax VSe® series. Industry leading robustness with field proved components.
Alternative to M12 - Ultra High-Density X-Lok Push-Lock Connector
Amphenol LTW’s 33-pin Ultra High-Density (UHD) X-Lok Metal Mini Size push-lock connector boasts a compact design and high contact density, providing space efficiency and enhanced data transmission. This connector serves as an excellent alternative to traditional M12 solutions【Video: https://www.youtube.com/watch?v=7gU_zye2zIw】【Quck guide: https://amphenolltw.com/down.php?supp_download=112】
Alternative to M8 | X-Lok Push Lock Micro Size Connector
Amphenol LTW’s X-Lok Micro Size connectors compatible with the M8 panel cutout, offer an advanced secure solution for signal, and data transmission. Featuring a spring-loaded push lock mechanism, ensure intuitive, fast, reliable connections with audible feedback, minimizes mating failures【Video: https://youtu.be/63FoeMHT9mM】【Quick Guide: https://amphenolltw.com/down.php?cn=news_content&id=151】
Amphe-309 Pin and Sleeve
Pin & Sleeve IEC 60309 UL listed. The Amphe-309 consists of both IP44 (splash-proof) and IP67 (Water Proof) devices from 16 A up to 125 A, from a simple plug to customer-specified combination units. The series range covers all clock positions in use for low profile, watertight, and Heavy Duty solutions. EC 603 09-1 & 2, EN 60 309-1 & 2, BS 4343-2 1992, and UL 1682 & 1686.
Amphe-PD™
This series, utilizing RADSOK® socket contact technology, is a general duty, touch-proof, thermoplastic rectangular with integrated latch push-pull coupling high power connector. Two poles per connector and up to 120 amps possible with a standard operating temperature from -55°C to +125°C.
Amphe-Phase
Amphe-Phase is a High Current Single pin connector with a smart design to keep performance and safety as a top priority keeping the solution price competitive. Finger Proof Protection against electric shock (IP2X) on both sides of Source and Drain and have a bayonet mechanical locking system requiring a key to unlock for additional safety.
Amphe-PRB
This series, utilizing RADSOK® socket contact technology, is an IP67 rated, thermoplastic reverse bayonet coupling, high power connector. With over six insert arrangements ranging from 3 to 5 contacts per connector and up to 70 amps possible with a standard operating temperature from -40°C to +100°C.
APC 8010
The APC 8010 is the perfect machine for every fiber optic production. High reproducibility with all connector geometries ensures high productivity during production. This is made possible by a permanent pressure control, which is adjusted to the connector type and quantity.
Armored RF Cable Assemblies
SV Microwave offers a range of armored RF cable assemblies designed to excel in challenging conditions, especially in applications like ground vehicle communications systems. Cable assemblies are available in both fully and partially armored configurations, these can deliver outstanding resistance to corrosion and crushing.
ASGTC-Q
ASGTC-Quadrax is a special circular bayonet coupling connector for data line transmission in RMT application, It's IP67 protection and with a self-locking system specially designed in order to get heavy duty application, Q-contacts with the protection of copper body and multipoints band in female contact to provide to 360º shielding.
ATPC Medium Voltage Cable
ATPC Type MV designed to meet UL Standard 1072 and comply with industry standards ICEA S-93-639, S-94-649 and AEIC CS-8. Available in single conductor and three conductors plus ground. Voltage options from 5kV up to 35kV. Copper or aluminum conductors, NL-EPR, TR-XLPE or XLPE insulation with 100%/133%/173% insulation levels, copper tape shield or concentric neutrals. Jacket PVC, XPLE, LLDPE
A-Type & B-Type USB Connectors
Amphenol LTW's waterproof USB connectors are IP67 / IP68 rated and designed with standard Type A/B interfaces in various product configurations -- plastic/metal, screw/bayonet locking, receptacle, receptacle with cables, overmolded cable, and field-installable demands for industrial applications【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
Automotive Grade PCI Express® Gen 5 Card Edge Connectors
EXTEND DIFFERENTIAL SIGNALING TO 32GT/S FOR NEXT-GENERATION SYSTEMS
PCIe® Gen 5 straddle mount connectors outperform the industry standards with higher speed along with complying to USCAR. The optimized series supports backwards mating and is footprint compatible with PCIe® 4/3/2/1.
BarKlip® BK1000 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1000 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1000 HD IO can distribute up to 1000A per contact, load and return, and up to 2000A total. Designed similarly to other ORv3 busbar connectors
BarKlip® BK100 I/O
Amphenol's BarKlip® BK100 I/O provides a convenient method of distributing up to 100A between busbars, cables and circuit boards. It features 12 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition
BarKlip® BK1200 HD I/O 1OU Cable Connector
HIGH POWER OCP-COMPATIBLE CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK1200 HD I/O power cable assemblies feature an OCP-compatible design, compliant with ORv3 power distribution architecture standards. Barklip® BK1200 HD I/O can distribute up to 1250A per contact, load and return, and up to 2500A total.
BarKlip® BK150 Connector
The BarKlip® BK150 connector features 10 independent conducting beams that maintain contact with the mating busbar in common misaligned positions, therefore significantly lowering overall resistance.
BarKlip® BK150's contacts include a stainless- steel helper spring to ensure that proper mating force is maintained and contact resistance is minimized throughout the life of the connection.
BarKlip® BK200 I/O
BarKlip®BK200 I/O provides a convenient method of distributing up to 200A between busbars, cables and circuit boards. It features 14 fully independent cantilevered beams, providing a true compliant spring to adjust for variations in busbar alignment and surface finish. The ultrasonically welded connection between the wire and contact increases the efficiency and reliability of current transition.
BarKlip® BK300 Connector
The BarKlip® BK300 connector features 14 independent conducting beams that maintain contact with the mating busbar. BK300's contacts are plated with Amphenol's proprietary silver-based AGT® plating technology to further reduce contact resistance and eliminate fretting corrosion commonly found in tin-plated connectors.
BarKlip® BK450 Connector
Amphenol's BarKlip® BK450 connector is designed to mate directly with a 3.18mm single pole busbar and provides a convenient method of distributing up to 450A between busbars. The connector system features 36 independent points of gold-plated contact beams ensuring high current carrying capability and low contact resistance.
BarKlip® BK600 I/O
OCP-COMPATIBLE POWER CABLE ASSEMBLY COMPLIANT WITH OPEN COMPUTE POWER DISTRIBUTION ARCHITECTURE
Amphenol's BarKlip® BK600 I/O power cable assemblies feature an OCP-compatible design compliant with ORv3 power distribution architecture standards. Barklip® BK600 I/O can distribute up to 700A between busbars, cables, and circuit boards.
BarKlip® XP200 Connector
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP200 connector provides a convenient method of distributing up to 200A directly to a 3.00mm mating busbar. The connector system features an integrated guide system that provides protection to the contacts during mating and un-mating.