With our industry-leading high-speed, power and fiber optic technologies, together with superior simulation and testing capability and cost-effectiveness, Amphenol is a market leader in interconnect development for the information technology (IT) and datacom market. Whether industry standard or application-specific designs are required, we can provide customers with products that enable performance at the leading edge of next-generation, high-speed, power and fiber optic technologies. Our primary end applications include cloud computing and data centers, gaming systems, internet appliances, networking equipment, servers, storage systems, transmission and web service providers.
HIGH POWER AND LOW RESISTANCE 3.00MM BUSBAR CONNECTOR
Amphenol's BarKlip® XP300 connector is designed to mate directly with 3.00mm single pole busbars and provides a convenient method of distributing up to 300A between vertical and horizontal busbars. The connector features 16 independent points of conducting beams ensuring high reliability and ultra-low contact resistance.
HIGH POWER AND LOW RESISTANCE BUSBAR CONNECTOR
Amphenol's BarKlip® XP connectors feature independent points of contact that provide overall lower resistance and greater overall efficiency. BarKlip® XP series is capable of distributing anywhere from 150 to 1000A of power to busbar power distribution applications.
EBY-Amphenol offers a complete selection of industry-standard barrier strip terminal blocks, customizable to meet your needs. Our barrier strip terminal blocks support a broad range of wire-to-board configurations, ideal for industrial applications, security and alarm systems, and utilities. No special tools required. Contact us now for more information!
Battery Connector for Cordless Power Tools/Vacuum Cleaner
CUSTOMIZABLE HIGH DURABILITY, HIGH CURRENT RATING, CORDLESS POWER TOOLS
The Power Tools Battery connector offers ideal power solution in terms of high current and high durability, better performance in terms of IP protection and overall connector life. The termination for the same can be optimized as per the working requirement.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATIONS
Amphenol's FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.50mm connector family with 0.50mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
FLEXIBLE SOLUTION FOR HIGH-SPEED APPLICATION
FCI Basics BergStak HS™ connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. BergStak HS™ 0.80mm connector family with 0.80mm pitch enables high-speed data applications with up to PCIe® Gen 5 32Gb/s.
BergStak+™ 0.80mm is designed to be the next generation PCIe 4.0 compliant mezzanine connector system. It is compatible with the existing BergStak® 0.80mm product recommended by the OCP. It guarantees to support up to 16Gb/s performance. Customers can upgrade its board-to-board performance from PCIe 3.0 to PCIe 4.0 while leveraging BergStak+™'s backward compatibility and same footprint feature.
The BergStak® 0.40mm board-to-board connectors are in 0.4mm pitch with double row contacts, the family now supports stack height of 1.50/2.0/3.0/3.5/4.0mm and position ranges in 10-100 positions (10/20/24/30/34/40/50/60/70/80/90/100). The lock feature on contacts works together with shock-absorbing ribs on the housing to make it suitable for high-vibration applications and friendly for FPC applications.
FINE PITCH SOLUTION WITH SELF-ALIGNMENT FEATURE
FCI Basics BergStak® 0.50mm self-alignment connectors come with a stack height of 3mm and 50 positions extendable across 20 to 60 positions in increments of 10. It has a unique self-alignment feature that supports blind mating.
MICRO PITCH LOW PROFILE HIGH SPEED BOARD-TO-BOARD CONNECTOR
BergStak® 0.635mm pitch is a compact board-to-board connector with low stack height of 3.00mm. Available in 80 and 140 positions it support applications which require high pin counts and low profile connection.
BergStak® 0.635mm supports signal speeds up to 8Gb/s with an open-pin-field, providing design flexibility.
FLEXIBLE SOLUTION FOR HIGH DENSITY APPLICATIONS
Amphenol's BergStak® 0.8 mm is a flexible solution designed for high-speed and high-density, parallel board-to-board connector systems with 16 PCB stack heights in 10 sizes up to 200 positions.
FCI Basics BergStak® 0.80mm connector family is known for its fast data transmission, high signal quality, and time-proven reliability under extended periods of application. Bergstak® shielded connector with 0.80mm pitch supports high-speed data applications up to 10Gb/s.
FCI Basics BergStak® product range is expanded to include 0.50mm BergStak® FX10 board-to-board connector known for its fast data transmission and high signal quality. This connector is offered in 144 positions and is available in 4.30mm and 6.00mm stack height options. Position is extendable up to 168 positions.
BergStak® FX10 supports speed performance up to 15Gb/s+ and is available in vertical SMT
The BergStak® Secure connector family contains one-time-use and multi-times-use solutions to support customers' different needs on connection security. The family now contains variants with 3-row and 4-row contacts with 37 columns per row, and it can be extended in both (10)row and (100)column direction based on customer requirements, to fulfill high pin count/high signal density requirements.
BergStik® FCI Basics 2.54mm unshrouded headers are available in SMT, THT, press-fit, stacking, and PIP versions. Designed in single and double row, they are available in straight or right angle options, from 2 to 72 positions.
Featuring a "breakaway" design, each connector can be cut or broken into lengths to suit the application profile with a maximum current rating of 3A per contact.
Amphenol's Blind Mate MCIO is designed for high speed and high density. It can support PCIe Gen5, and is scalable to PCIe Gen6. We designed Blind Mate MCIO with a guide pin to prevent damages during plug in and plug out. Blind mate MCIO has a robust mechanical design, and the connector can be fixed by a screw-on panel.
Amphenol LTW’s X-Lok Connectors are presented in various sizes for power, signal and hybrid applications for fast, simple and reliable connections. Featuring a push lock mechanism for intuitive mating with audible and tactile feedback. The X-Lok provides less mating failure & quicker installation than traditional threaded solutions【Quick guide: https://amphenolltw.com/down.php?supp_download=112】
SV Microwave’s latest product line offers a comprehensive range of RF interconnects, including standard and bulkhead cable connectors for a variety of cable types and PCB connectors ideal for use in board-to-board solutions, with connectors in both Full Detent and Smooth Bore options, as well as a bullet. This product line is rated to work up to 22 GHz, ensuring reliable and high-performance RF solutions.
Amphenol RF offers a variety of board-to-board solutions engineered to maximize radial and axial float, eliminating the need for cables between the boards and simplifying designs to eliminate assembly errors.
FCI Basics Boltrack™ connector promotes signal and PoE++ transmission over Cat 5e and 6 cables in a wide range of datacom and industrial applications. It offers lightning protection, EMI shielding, and is field-installable. Boltrack™ connector comes in a 4-pair right-angle board receptacle and cable plug mating combination. The connector can resist voltages up to 2,500V.
Amphenol LTW provides a comprehensive product range of Breathable Vent. The Vents help control pressure release within safe operating limits, specifically designed to balance internal and external pressures. Range: M6, M8, M10, Fit-In Plastic/Metal (Oil Filtration), M12, M14, M24, M32 & Rectangular【Quick Guide: https://amphenolltw.com/down.php?supp_download=103】Video: https://youtu.be/dke5JH_B2A0
The C2E chassis provides a Data Center solution that is dense, modular and tray based. It is offered as either a dedicated Base-8 solution using the C2 Base-8 modules for MPO or MTP breakout modules, or a dedicated Base-12 version.
Fiber cable entry and exit gates have a front-facing door that opens to make it easier to get fibers in and out of the tray. The gates are several times larger than those in legacy slack storage trays, producing an industry-leading 96 1.6mm fiber cable capacity. The routing arcs within the tray have movable fingers, which greatly facilitates accessing the fibers during and after installation.
The C2X chassis' supports multiple patch, patch/splice, and pre-terminated fiber configurations available in either bulkhead or cassette solutions. C2X tray-based option accepts C2 AOMs (Advanced Optical Modules) for patch, patch/splice, as well as splitters, MPO breakouts, and WDMs. C2X is available in 1, 2, 3, or 4RU and supports vast fiber counts.
Amphenol LTW’s Cable Joiner was designed and developed for simple, quick and reliable cable interconnections.
It is available in several options to meet various cable O.D. and wire sizes. It also meets the latest requirements for locking protection【Quick guide: https://amphenolltw.com/down.php?supp_download=91】
The Cascade Panel is a 1RU chassis with spaces for 4x custom patch plates at a total density of 96 LCs in a single rack unit. The Cascade Panel has a sliding tray that brings the adapters forward, allowing for easier
access when performing moves, adds, or changes. Its simple,
streamlined design provides a balance of density and usability
when connecting multiple LC or MPO connections.
Amphenol CDFP cable assemblies are designed to meet emerging data center and high-performance computing application needs for high density cabling interconnect systems capable of delivering 32GT/s per lane (Gen 5.0). CDFP has 16 lanes, capable to deliver 64Gbps. This interconnect system is fully compliant with existing industry standard specifications SFF-TA-1032.
Amphenol's CIM process uses ceramic zirconium to provide a scratch and wear-resistant surface to components such as mobile phone camera decoration and side keys. The CIM material provides additional durability and strength to your products. We have applied our Metal Injection Molding (MIM) experience of large volume runs to CIM to create a hi-tech material process.
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
Amphenol's CFP2 series offers a 104 position, 0.6mm pitch connector designed to be compatible with 100Gb/s Form Factor Pluggable (CFP) Multi-Source Agreement for Ethernet and other applications. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP2 has up to 60% lower power consumption versus CFP.
Amphenol's CFP4 series offers a 56 position, 0.6mm pitch connector, and is used in multi-hundred Gb/s systems. Rated for 25Gb/s per channel with resonance dampening for improved signal integrity, CFP4 has up to 60% lower power consumption versus CFP. The CFP4 series includes a plug connector on the mating interface to improve accuracy and aid in delivering high-speed performance.
Amphenol's CFP8 interconnect system has 124 contacts per port, with a 0.5mm contact pitch and 16 high-speed channels. It is rated for 28Gb/s per channel with resonance dampening for improved signal integrity. It is comprised of insert molding assemblies for top side contacts and Press-Fit cage assemblies.
With performance speeds up to 25 Gbps+, Chameleon meets the demand for faster, smaller, and more compact connector solutions. With stack heights from 6mm to 10mm in 1mm increments, pin counts from 40 to 500+, and pair counts from 16 to 160, Chameleon provides you with a ready platform to easily change and adapt to your design requirement.
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Amphenol RF attenuators are designed to offer flat attenuation over the designated frequency range and feature a microwave grade resistor that consistently reduces power. Hex flats on the body allow this attenuator to be easily torqued to the mating connector.
Positronic Combo-D connectors are a combination of signal and power and are part of the D-sub family. Combo-D connectors are used in military, communications, space, industrial, and medical applications. These connectors are available in various performance levels for the best cost/performance ratio.
ComboLock® is a compact, hybrid wire-to-board connector system that saves space, allows for simpler assembly and simpler cable management. The connector system offers a hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature.
The connector has nominal current carrying capacity of 10A/pin max. for power and 1.5A/pin max. for signal.
HYBRID AND HIGH SPEED SOLUTION
The ComboStak® 0.50 mm BTB connectors are compact, hybrid (signal and power) board-to-board connectors. ComboStak® 0.50 mm combines existing, BergStak® 0.5mm pitch HS signal pins with 2.00mm pitch power blades. ComboStak® 0.50 mm provides high signal and current density with a wide range of stack heights.
HYBRID AND MEDIUM POWER SOLUTION
ComboStak® and PowerStak® are compact, hybrid (signal and power) and power board-to-board connectors. ComboStak® combines existing, BergStak® 0.8mm pitch signal pins with 2.00mm pitch power blades. PowerStak® is the power only version. Both ComboStak® and PowerStak® provide high signal and current density with a wide range of stack heights.
400POS 0.635MM PITCH COM-HPC
Amphenol has developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
COM-HPC is a PICMG sponsored open standard for a family of high performance computer modules targeting the embedded computer space. We have developed a pair of 400pos 0.635mm COM-HPC which support 5mm and 10mm stack heights.
SIGNAL & HYBRID SOLUTIONS FOR BTB, WTW, AND WTB
Solutions offer optimized space, high reliability with adequate creepage and clearance distances for power and allows easy to mate/crimp and cable management. The connector system offers hybrid solutions choice of signal and power loading with an active latching feature.
SINGLE-PIECE COMPRESSION TYPE SURFACE MOUNT CONNECTORS
Amphenol Communications Solutions offers compression-type surface mount connectors to provide power and signal connection between either two PCB modules or one PCB and an electrical module. The single-piece small footprint solution brings cost and space savings to the design of smaller and more economical consumer electronic devices.
Amphenol's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards.
Its unique design with an audible 'click' sound enhances the security and ease of use. The polarization ensures proper alignment during blind mating.
Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles and right angle headers are offered in 9-69 positions.
Cool Edge Hybrid Power and Signal connectors provide a one-piece high speed and high power card-edge package. These versatile solutions address multiple standards like PCIe, SAS, SATA, and offer multiple BTB configurations such as mezzanine, coplanar, and midplane/backplane. Moreover, the connectors are designed as Open Pin Field and are hot-plug capable.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 16GT/s Gen 4 and 32GT/s Gen 5 capabilities. Slim connector design saves space on the motherboard while facilitating other higher-density applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
Cool Edge PCIe® connectors bring high-speed PCIe® support into a one-piece card edge package with 64 GT/s Gen 6 capabilities. Slim connector design saves space on the motherboard while facilitating other higherdensity applications. These connectors come with a simple housing design with an overall reduced footprint, providing additional benefits over standard PCIe® CEM solutions.
The Amphenol Cool Express Link™ is a range of EDSFF E3 Hybrid Orthogonal Press-fit PCIe® Gen 5/6 Cable Connectors that supports low latency, high bandwidth, and high throughput data transmission for existing and next-gen storage and CXL 3.1 applications. Engineered for use in high-performance computing applications in artificial intelligence and machine learning that require advanced enterprise storage...
CoolPower® HD Right-Angle Cable-to-Board Connector
Amphenol's CoolPower® HD Right-Angle Connector is a 90-degree, versatile pin-and-socket solution designed to deliver highdensity power output in a compact, low-profile housing. This makes it an ideal solution for addressing the increasing demands of modern power consumption. The CoolPower® HD series supports a wide range of pin diameters, including 5.7mm, 6.0mm, 8.0mm, and 9.1mm, and ....