Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
Metal Injection Molding
Amphenol produces high-quality parts with over 90% metal density through our metal injection molding (MIM) process. The MIM process provides greater flexibility in design complexity, prevents corrosion, and provides a resistant polish. The MIM process is used on components of various applications including mobile phones, laptops, and industrial and automotive platforms.
Mezzostak® 0.5mm Mezzanine Connectors
Mezzostak® is a robust 0.5mm fine pitch mezzanine connector suitable for a wide range of high-reliability applications and demanding environments. The hermaphroditic design of these connectors provides a precise mating interface with extra housing guidance. Mezzostak® 0.5mm are available in two versions, which offer a choice between supplemental PCB hold-downs and pegs for short overall length.
Micro Board-to-Board 0.60mm Stack Height - 103 Series (0.35mm pitch)
Amphenol's 103 series are 0.35mm pitch micro board-to-board connectors designed for high-density applications. They support an extreme low profile 0.60mm stack height and a high current rating up to 5A. These connectors are offered in 4 to 60 positions. These meet USB 3.1 Gen 2 signal transmission rates and are ideal for consumer applications.
Micro Coax Harness
Amphenol is one of the leading providers of MCX cable solutions on the market. The current market demands a more integrated connectivity solution, including integrated hinge/MCX cable assemblies. Our Micro Coax Cable assembly is designed for high-speed transmission, high EMI shielding, and a very small bundle diameter for optimal spacing in tight applications.
Micro SATA Connectors
Micro SATA connectors from Amphenol enable smaller 1.8inch SATA drive form factors for hard disk drives (HDDs) or solid-state drives (SSDs). The connectors comply with the Serial ATA specification issued by the Serial ATA International Organization (SATA-IO). Micro SATA signal and power contacts consist of 16 contacts on a 1.27mm pitch size.
microSD Express Connector
Amphenol is the first in the industry to offer card sockets for both microSD Express and Micro SD cards (UHS-I). The 17 pin microSD Express connector is capable of achieving high speeds up to 985MB/s and meeting PCIe® 3.0 requirements. The connector enables microSD Express platform to reach its full potential; making microSD Express card possible to serve as a removable Solid State Drive (SSD).
Micro USB 2.0
Micro USB 2.0 connectors have power contacts of 1.8A and 3A current for fast charging. The plastic tongue and two-layer shells design ensure high reliability and prevent connector damage. Amphenol offers customized designs to suit various customer requirements. These connectors also offer high-speed signal stability of up to 480Mb/s transmission.
Micro USB 2.0 Connector
FCI Basics Micro USB 2.0 connectors deliver a data transfer rate up to 480Mb/s and are characterized by their high-speed signal stability. This smaller version of the Mini USB 2.0 connector while complying with the physical, electrical, and environmental standards of the micro form factor, supports 1.8A and 3A currents for fast charging.
Micro USB 3.0 Connector
Micro USB 3.0 (USB 3.1 Gen 1) SuperSpeed connector delivers 10x the data transfer rate of Hi-Speed USB as well as optimized power efficiency. This smaller version of the Mini USB 2.0 connector performs up to 5Gb/s and supports USB On The Go (OTG). It has full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication.
Micro USB 3.1 GEN 1
USB 3.1 Gen 1 now operates with full-duplex signaling over two differential pairs, improving host-directed simultaneous-bidirectional communication. USB 3.1 Micro offers a 5Gb/s signaling rate offering a 10x performance increase over Hi-Speed USB 2.0. SuperSpeed USB is backward compatible with USB 2.0 and will provide optimized power efficiency.