Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
![Product Ceramic Antenna](https://staph.blob.core.windows.net/images-products/ceramic-antenna-4720.png)
Ceramic Antenna
Amphenol designs and manufactures ceramic antennas for customer. It includes LTCC and HTCC. LTCC Ceramic antenna can save the antenna space. HTCC ceramic is mainly for GPS application. Ceramic antennas are commonly used in E-cigarette, earbuds, TV stick and other device.
![Product cLGA®](https://staph.blob.core.windows.net/images-products/cLGAR-5810.png)
cLGA®
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.
![Product Clincher™ Flex Connectors](https://staph.blob.core.windows.net/images-products/ClincherT-Flex-Connectors-5636.png)
Clincher™ Flex Connectors
FCI Basics the Clincher™ 2.54mm pitch connector family includes single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry. All receptacle connectors use the same customer-preferred and patented Clincher™ contact and are ideal for applications where shock or vibration are concerns.
![Product Coaxial Inserts](https://staph.blob.core.windows.net/images-products/coaxial-inserts-5589.png)
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
![Product ComboLock® Wire-to-Board Connector System](https://staph.blob.core.windows.net/images-products/combolockr-wire-to-board-connector-system-3146.png)
ComboLock® Wire-to-Board Connector System
The ComboLock® Wire-to-Board connector's compact design for the limited space application needs carries power and signal requirements. The connector system has hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature. The connector has a nominal current carrying capacity of 10A/pin max for power and 1.5A/pin max for signal. Power wire sizes from 26 to 18AWG
![Product Conan® 1.00mm Connector](https://staph.blob.core.windows.net/images-products/ConanR-1-00mm-Connector-5757.png)
Conan® 1.00mm Connector
Amphenol ICC's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards. Its unique design with an audible 'click' sound enhances the security and ease of use. It has good mating performance, rugged design, and is under 70 positions.
![Product Conan® Lite 1.00mm Connector](https://staph.blob.core.windows.net/images-products/conanr-lite-1-00mm-connector-9024.png)
Conan® Lite 1.00mm Connector
Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles, and right-angle headers are offered in 9-69 positions.
![Product Contact Pads](https://staph.blob.core.windows.net/images-products/Contact-Pads-4374.png)
Contact Pads
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
![Product Cool Stack 0.80mm Hybrid Power & Signal Connectors](https://staph.blob.core.windows.net/images-products/Cool-Stack-0-80mm-Hybrid-Power-And-Signal-Connectors-6839.png)
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.
![Product cStack™](https://staph.blob.core.windows.net/images-products/cStackT-1221.png)
cStack™
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
![Product Customized Bearing APEA605](https://staph.blob.core.windows.net/images-products/customized-bearing-apea605-8089.png)
Customized Bearing APEA605
Customized bearings made of CNC components. Smooth handfeedlings.
![Product DDR2 SO-DIMM Memory Module Sockets](https://staph.blob.core.windows.net/images-products/DDR2-SO-DIMM-Memory-Module-Sockets-2064.png)
DDR2 SO-DIMM Memory Module Sockets
DDR2 SO-DIMM sockets are designed to accept modules that conform to JEDEC MO-224. The sockets come with a small form factor which allows fitting into smaller chassis, aiding the development of smaller & lighter notebooks. It comes in two voltage options with different key-ID to prevent incorrect mating. It operates at a higher speed & bandwidth lowers power consumption.
![Product DDR4 SO-DIMM Memory Module Sockets](https://staph.blob.core.windows.net/images-products/DDR4-SO-DIMM-Memory-Module-Sockets-9639.png)
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
![Product DDR5 SO-DIMM Connectors](https://staph.blob.core.windows.net/images-products/DDR5-SO-DIMM-Connectors-9624.png)
DDR5 SO-DIMM Connectors
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR5 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. 262 positions SO-DIMM connector is available in 4.00mm height with the standard option. Sketching design of DDR5 SO-DIMM 8.00mm height with the standard option now.
![Product DIN 41612 Headers and Receptacles](https://staph.blob.core.windows.net/images-products/DIN-41612-Headers-and-Receptacles-6276.png)
DIN 41612 Headers and Receptacles
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
![Product DisplayPort](https://staph.blob.core.windows.net/images-products/DisplayPort-1423.png)
DisplayPort
HIGH-PERFORMANCE DIGITAL AUDIO/VIDEO INTERCONNECT SOLUTION
Amphenol DisplayPort connector system is a scalable solution that transmits 1, 2, or 4 lanes of High-Definition video at 2.7Gb/s per lane up to a maximum of 10.8Gb/s. DisplayPort also allows flexible allocation of available bandwidth between audio and video.
![Product Distribution Network Antennas](https://staph.blob.core.windows.net/images-products/Distribution-Network-Antennas-3844.png)
Distribution Network Antennas
Amphenol’s series of miniature data cards and USB dongle antennas for 3G, 3.5G, and 4G LTE applications provide the performance to power high-speed mobile internet connectivity. With volumes less than 1.5cc and a customizable geometry, these multiband antennas are easily integrated into miniature data cards.
![Product Double Lapping](https://staph.blob.core.windows.net/images-products/Double-Lapping-9876.png)
Double Lapping
Amphenol's double-sided lapping process provides the best solution for mobile device metal decorative logos. We can control part flatness tolerance within +/- 0.03mm and maintain a 1000N+ Laser weld bond between metal components. Our high-quality logos reflect a high brand value to customer end products.
![Product D-Sub Accessories](https://staph.blob.core.windows.net/images-products/D-Sub-Accessories-7897.png)
D-Sub Accessories
FCI Basics D-Sub Accessories complement FCI Basics D-sub offering by accounting for the moderate to severe mechanical stresses encountered, and preventing risks like pulling up and accidental mismating. The range of derived accessories includes plastic or metalized plastic hoods, EMI/RFI shielded two-part metal hoods, various cable clamps, locking devices, dust caps, and brackets.
![Product D-Sub Cable Connectors](https://staph.blob.core.windows.net/images-products/D-Sub-Cable-Connectors-4863.png)
D-Sub Cable Connectors
FCI Basics D-Sub Cable Connectors span across signal and power applications in computer equipment, cash register, and high-end industrial cabinets. Signal connectors are available as removable crimp contacts, and power connectors in crimp, solder bucket, and wire wrap terminations.