Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
Contact Pads
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
cStack™
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DIN 41612 Headers and Receptacles
FCI Basics DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability. The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.
Double Lapping
Amphenol's double-sided lapping process provides the best solution for mobile device metal decorative logos. We can control part flatness tolerance within +/- 0.03mm and maintain a 1000N+ Laser weld bond between metal components. Our high-quality logos reflect a high brand value to customer end products.
D-Sub Economy Range Board-Mount Connectors
FCI Basics D-Sub Economy Range Board-Mount Connectors are proven solutions designed to meet less demanding applications while meeting all their design requirements. These connectors have guaranteed durability of 50 mating cycles. Board connectors are available in straight and right-angle versions, while cable connectors are available in solder bucket and crimp styles.
eSATA Connectors
eSATA connectors are designed for external storage applications that require a single-lane Serial ATA cable connection up to approximately two metres in length. The connectors comply with the Serial ATA Specification issued by the Serial ATA International Organization (SATA-IO). eSATA connectors support both Gen 1 (1.5Gb/s) and Gen 2 (3Gb/s) SATA data rates.
Ferrite Sheet
Ferrite is a ceramic compound composed of iron dioxide (Fe203), combined chemically with one or more metallic elements. Ferrite shields the metal parts of mobile phones so they do not absorb an electromagnetic field which results in a weak signal.
FFC/FPC Connectors (0.50mm pitch)
0.50mm pitch flex connectors utilize 0.50mm contact spacing to terminate mobile devices across a variety of applications. These connectors are offered with top, bottom, dual beams & dual contact positions with both ZIF and Non-ZIF cable terminations. The connector series comes with a wide height range of 0.70mm to 5.80mm with 4 to 80 contact positions in both vertical and right angle orientations.