Mobile Devices
Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.
Visit our global sites to learn more: Amphenol Mobile Consumer Products
Card Readers
Amphenol has developed an extensive range of SIM and micro SD card readers which come in several different configurations including Simlocks, wing and bridge blocks, standard sim and SD blocks, with options of shielding protection, integrated detect switch, float, or SMT mounting.
Ceres Circular Connector
Amphenol LTW Ceres Connectors are environmentally sealed, up to IP68, rugged, and cost-effective, available in plastic and metal. Our Ceres provides a comprehensive size range and variety of mating styles such as screw, lock bayonet, and push-lock to meet various harsh environments and are suitable for power and data applications【Quick guide: https://amphenolltw.com/down.php?supp_download=92】.
cLGA® Chip-to-Board Socket
HIGH PERFORMANCE, LOW COST CHIP-TO-BOARD APPLICATION
The Amphenol cLGA® land grid array socket system was designed to bring conventional connector material construction to high performance, low cost chip-to-board applications. Gold over nickel-plated copper alloy spring contacts guarantee long-term connector performance, contact retention and ruggedness.
Clincher™ Flex Connectors
Amphenol's FCI Basics Clincher™ 2.54mm pitch connector family include single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry.
Contacts are pre-loaded to connector housings enabling mass termination to unprepared cable. The "clinch" cable termination provides gas-tight, contamination-free four contact points to each conductor.
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.
Contact Pads
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.
cStack™ 25Gb/s Compression-mount Mezzanine Interposer
The Amphenol cStack™ high speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit. With offerings in 1mm to 5mm housing heights and multiple sizes, Amphenol's cStack™ connector provides a solution for any application where space is tight and speed and...
C-Type USB Connector
Amphenol LTW offers a comprehensive range of rugged USB Type-C connectors delivering a high data transmission rate of up to 10 Gbps and superior power charging up to 5A current. Designed in various form factors with multiple termination options make it ideal to fulfill industrial harsh application【Quick Guide: https://amphenolltw.com/down.php?supp_download=111】
DDR4 SO-DIMM Memory Module Sockets
HIGH-SPEED HIGH-DENSITY SO-DIMM SOCKETS
DDR4 SO-DIMM connectors deliver high-speed and bandwidth. Being half the size of regular DIMMs, they lower power consumption and promote better thermal management. Different key positions aid alignment and prevent mismating. 260 position SO-DIMM connectors are available in 4.00mm, 5.20mm, 8.00mm, 9.20mm height, in standard or reverse options.
DIN 41612 Headers and Receptacles
DIN 41612 connector systems are the most popular backplane interconnect systems in IEC 603-2 specifications due to the widespread standard adoption, easy availability, cost-effectiveness, and durability.
The product design for Board-to-Board and I/O solutions involve both standard mount and reverse mount mating combination.