Mobile Devices

Amphenol designs and manufactures an extensive range of interconnect products, antennas and electromechanical components found in a wide array of mobile computing devices. Amphenol’s capability for high-volume production of these technically demanding, miniaturized products, combined with our speed of new product introduction, are critical drivers of our long-term success in this market. Our solutions address consumer electronics, e-readers, laptops, mobile phones, mobile phone accessories, mobile computing devices, smartphones, tablets, ultrabooks and wearable and hearable devices.

Visit our global sites to learn more: Amphenol Mobile Consumer Products

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Product Ceramic Antenna
Ceramic Antenna
Amphenol designs and manufactures ceramic antennas for customer. It includes LTCC and HTCC. LTCC Ceramic antenna can save the antenna space. HTCC ceramic is mainly for GPS application. Ceramic antennas are commonly used in E-cigarette, earbuds, TV stick and other device.

Product cLGA®
cLGA®
The Amphenol ICC cLGA® land grid array socket system was designed to bring conventional connector material construction to high-performance, low-cost chip-to-board applications. cLGA® sockets are used in applications ranging from handheld computer products to supercomputer systems. The cLGA® socket is fully qualified under Telcordia GR-1217-CORE specifications.

Product Clincher™ Flex Connectors
Clincher™ Flex Connectors
FCI Basics the Clincher™ 2.54mm pitch connector family includes single-row pin-and-receptacle connectors designed for termination to flat flexible circuitry. All receptacle connectors use the same customer-preferred and patented Clincher™ contact and are ideal for applications where shock or vibration are concerns.

Product Coaxial Inserts
Coaxial Inserts
Size 8 coaxial inserts for DIN and D-Sub applications. Available for common flexible coaxial cables.

Product ComboLock® Wire-to-Board Connector System
ComboLock® Wire-to-Board Connector System
The ComboLock® Wire-to-Board connector's compact design for the limited space application needs carries power and signal requirements. The connector system has hybrid 1.00mm pitch signal and 3.00mm pitch power configuration with an active latching feature. The connector has a nominal current carrying capacity of 10A/pin max for power and 1.5A/pin max for signal. Power wire sizes from 26 to 18AWG

Product Conan® 1.00mm Connector
Conan® 1.00mm Connector
Amphenol ICC's Conan® 1.00mm is a mezzanine connector designed for industrial applications and harsh environments. Conan® 1.00mm provides a mechanically secure, high-density electrical interface between parallel printed circuit boards. Its unique design with an audible 'click' sound enhances the security and ease of use. It has good mating performance, rugged design, and is under 70 positions.

Product Conan® Lite 1.00mm Connector
Conan® Lite 1.00mm Connector
Conan® Lite 1.00mm connectors come with a robust metal down feature that helps in establishing a reliable connection with the PCB in both parallel and perpendicular board-to-board applications. These connectors also feature an audible "click" sound ensuring mating in place. Conan® Lite vertical headers, receptacles, and right-angle headers are offered in 9-69 positions.

Product Contact Pads
Contact Pads
Amphenol's contact pads are used in contact areas and as spacers on PCBs. Durable plating includes a diffusion barrier. The contact pads connect with low resistance over the product's lifetime for use in sensitive connections of antennas, microphones, and carbon PCBs. They are available in a wide variety of shapes and sizes. Thickness: scalable ≥ 0.1 mm.

Product Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack 0.80mm Hybrid Power & Signal Connectors
Cool Stack Hybrid Power and Signal connectors provide one-piece high speed and high power solutions while addressing multiple networking standards like PCIe, and SAS/SATA. It offers a maximum current rating of 16A per power pin, which aids in supporting applications with medium power requirements.

Product cStack™
cStack™
The Amphenol ICC cStack™ high-speed solder-less interconnect solution provides limitless flexibility for board-to-board mezzanine applications and board-to-board stackable and coplanar applications when terminated to a flex circuit.

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